Conferences related to Cause effect analysis

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2021 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE)

FUZZ-IEEE 2021 will represent a unique meeting point for scientists and engineers, both from academia and industry, to interact and discuss the latest enhancements and innovations in the field. The topics of the conference will cover all the aspects of theory and applications of fuzzy sets, fuzzy logic and associated approaches (e.g. aggregation operators such as the Fuzzy Integral), as well as their hybridizations with other artificial and computational intelligence techniques.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


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Periodicals related to Cause effect analysis

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


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Most published Xplore authors for Cause effect analysis

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Xplore Articles related to Cause effect analysis

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Analysis of the Body Diode Reverse Recovery of MOSFETs in ZVS PWM Combined Three-level Converter

2007 IEEE Power Electronics Specialists Conference, 2007

Zero-voltage-switching (ZVS) PWM combined three-level (TL) converter is suitable for high input voltage with wide range applications because the switches sustain only half of the input voltage and the output Alter inductance can be reduced significantly. However, the MOSFETs in the converter suffer the body diode reverse recovery in two-level mode leading to a lower conversion efficiency. In this paper, ...


Decision Support Method in Risk Communications Using Collaborative Learning

2015 International Conference on Computer Application Technologies, 2015

In this paper, we propose a method for supporting risk communications that uses collaborative learning. Using collaborative learning, participants in risk communications (e.g., stakeholders, decision makers, and experts) can not only acquire desired information, but also ascertain the intentions and knowledge of other parties with different concerns. In the process of collaborative learning, the participants achieve mutual understanding of risks. ...


Research of Vector Variable Frequency System Based on TMS320F2812

2008 International Conference on Intelligent Computation Technology and Automation (ICICTA), 2008

In order to effectively resolve the real-time problems caused by a large number of calculations during carrying out the vector control of electrical motors, this paper analyzes the vector control theory of asynchronous motors based on the magnetic orientation of motor rotors, and its mathematical model is made. Then the variable frequency vector speed-adjusting experimental system is built with the ...


Power converters supplying: compatibility problems between special application and disturbance sources

1997 IEEE Industrial and Commercial Power Systems Technical Conference. Conference Record, 1997

In this paper, the effects of nonlinear loads on power distribution systems are discussed by analyzing power system behaviour; in particular, the voltage notch caused by static power converters are analyzed. These evaluations can be useful for an optimization of the overall design of power systems, from component types and rating choices to circuit sizing. A more general optimal design ...


Corner point lot qualification technique

IEEE 1995 International Integrated Reliability Workshop. Final Report, 1995

This paper describes a new approach in the sample make up for qualifying a new process, a process change, and, or a material change. This new approach, which we will refer to as the corner point lot method, produces a qualification sample that better represents the process operating window. The corner point lot method uses a design of experiment approach ...


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Educational Resources on Cause effect analysis

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IEEE.tv Videos

Why Power Supplies Fail: A Real World Analysis - David Hill at APEC 2016
Micro-Apps 2013: Rapid Simulation of Large Phased Array T/R Module Networks
RF Induced Communication Errors in RFFE MIPI Controlled Power Amplifiers: RFIC Interactive Forum
A Bayesian Approach for Spatial Clustering - IEEE CIS Webinar
Brooklyn 5G Summit: Critical Modeling Aspects and Their Effect on System Design and Performance
The Josephson Effect: Josephson Digital Electronics in the Soviet Union
The Josephson Effect: The Josephson Volt
IMS 2011 Microapps - Yield Analysis During EM Simulation
The Josephson Effect: The Original SQUIDs
IMS 2012 Microapps - Improve Microwave Circuit Design Flow Through Passive Model Yield and Sensitivity Analysis
Brooklyn 5G Summit: Critical Modeling Aspects and Their Effect on System Design and Performance Panel
IMS 2011 Microapps - A Practical Approach to Verifying RFICs with Fast Mismatch Analysis
IMS MicroApps: Multi-Rate Harmonic Balance Analysis
New Approach of Vehicle Electrification: Analysis of Performance and Implementation Issue
A Flexible Testbed for 5G Waveform Generation and Analysis: MicroApps 2015 - Keysight Technologies
Spectrum Analysis: RF Boot Camp
Surgical Robotics: Analysis and Control Architecture for Semiautonomous Robotic Surgery
IMS 2012 Microapps - Generation and Analysis Techniques for Cost-efficient SATCOM Measurements Richard Overdorf, Agilent
Similarity and Fuzzy Logic in Cluster Analysis
Contactless Wireless Sensing - Shyam Gollakota - IEEE EMBS at NIH, 2019

IEEE-USA E-Books

  • Analysis of the Body Diode Reverse Recovery of MOSFETs in ZVS PWM Combined Three-level Converter

    Zero-voltage-switching (ZVS) PWM combined three-level (TL) converter is suitable for high input voltage with wide range applications because the switches sustain only half of the input voltage and the output Alter inductance can be reduced significantly. However, the MOSFETs in the converter suffer the body diode reverse recovery in two-level mode leading to a lower conversion efficiency. In this paper, the cause of the body diode reverse recovery has been analyzed, the effects on reverse recovery by adopting different control schemes were discussed in detail, and the theoretical analysis were verified by the experimental results from a prototype with 400 V-800 V input and 54 V/20A output.

  • Decision Support Method in Risk Communications Using Collaborative Learning

    In this paper, we propose a method for supporting risk communications that uses collaborative learning. Using collaborative learning, participants in risk communications (e.g., stakeholders, decision makers, and experts) can not only acquire desired information, but also ascertain the intentions and knowledge of other parties with different concerns. In the process of collaborative learning, the participants achieve mutual understanding of risks. Features of this method are the use of externilization and construction of a fishbone diagram of opinion understanding.

  • Research of Vector Variable Frequency System Based on TMS320F2812

    In order to effectively resolve the real-time problems caused by a large number of calculations during carrying out the vector control of electrical motors, this paper analyzes the vector control theory of asynchronous motors based on the magnetic orientation of motor rotors, and its mathematical model is made. Then the variable frequency vector speed-adjusting experimental system is built with the DSP TMS320F2812 which works as the core control chip and intelligent power module. The system's hardware and software solution is put forward, and experiments are made. The experimental results show that the whole control scheme is feasible and the system can run stably.

  • Power converters supplying: compatibility problems between special application and disturbance sources

    In this paper, the effects of nonlinear loads on power distribution systems are discussed by analyzing power system behaviour; in particular, the voltage notch caused by static power converters are analyzed. These evaluations can be useful for an optimization of the overall design of power systems, from component types and rating choices to circuit sizing. A more general optimal design of power systems in the presence of nonlinear loads requires the configuration of a specific power distribution system with characteristics of high efficiency. The purpose of this paper is to introduce a new approach to the evaluation of the lower performance of electrical power systems caused by the presence of nonlinear loads such as static power converters. Such an approach should be suitable both in the design of new power systems, and in the upgrading of existing networks.

  • Corner point lot qualification technique

    This paper describes a new approach in the sample make up for qualifying a new process, a process change, and, or a material change. This new approach, which we will refer to as the corner point lot method, produces a qualification sample that better represents the process operating window. The corner point lot method uses a design of experiment approach to purposely force critical parameters, as identified through Failure Mode and Effect Analysis (FMEA), to the corners of their spec limits.

  • Research on the cancellation of Doppler Offset by information aid for aviation Mobile Broadband Communication

    A new method, IAADO (Information-Aided Anti-Doppler-Offset), aiming at eliminating ICI (Inter-Channel-Interference) caused by DFO (Doppler Frequency Offset) and improving the performance of AMBC (Aviation Mobile Broadband Communication), is presented with a view to the characteristics of the high DFO of aviation channel and the aircraft as a platform of AMBC. The strong ICI caused by large DFO, degrades the performance of AMBC badly. And the DFO can be computed by the aid information, the position and the velocity vector of its own and the positions and the velocity vectors of the aircrafts or ground stations around, which is derived from equipments onboard, such as navigation equipments and surveillance equipments, in real time or near real time. According to that the compensation can be done at the receiver, although it is of uncertainty. In this paper, the performance of information-aided cancellation of ICI caused by DFO is analyzed, and the effect of the uncertainty of aid information is investigated also. The simulation results show that the combined method which combines the estimation and IAADO based on aid information with uncertainty, resolves the ICI caused by DFO effectively, and makes AMBC get better performance in high-speed movement, i.e. En_route phase and Arrival phase.

  • Improving an existing root cause analysis and corrective action program

    Almost every nuclear power plant in North America has an existing root cause analysis and corrective action program. Since a good root cause analysis and corrective action program is essential for safe, reliable production of nuclear power, one question that should be asked is: “How does one improve an existing root cause analysis and corrective action program?” A rather novel approach is to use the concepts of the Toyota Production System (TPS or Lean) to cut waste and improve the effectiveness of root cause analysis and accident/incident investigation. Applying Lean thinking can produce eye- opening, practical, but uncommon ideas to improve an existing root cause analysis and corrective action program and make them more efficient and effective.

  • Front-end processing defect localization by contact-level passive voltage contrast technique and root cause analysis

    To keep the evidence of the root cause, focused ion beam (FIB) cross-section and transmission electron microscope (TEM) analysis are the effective techniques for further analysis when a unit is de-processed to contact-level and front-end layers are still intact. To make sure that FIB cross-section hits a defect, it is very important to localize the defect precisely in advance. Since the contacts are the only access to the front-end layers of a semiconductor device, it should be possible to utilize them as probes to pinpoint the defects related to the front-end processes. In this paper, The technique of contact-level passive voltage contrast was employed to identify the contacts with abnormal contrast and thus localize the front-end processing defects.

  • Speaker identification using dynamic time warping with stress compensation technique

    We present an algorithm for an isolated-word text-dependent speaker identification under normal and four stressful styles. The styles are: shout, slow, loud, and soft which are designed to simulate speech produced under real stressful conditions. The algorithm is based on dynamic time warping (DTW) with a cepstral stress compensation technique. Comparing DTW combined with cepstral stress compensation, with DTW without cepstral stress compensation, the recognition rate has improved to some extent with a little increase in the computations. The recognition rate is improved: from 33% to 67% in shout style, from 51% to 84% in slow style, from 40% to 80% in loud style, and from 52% to 70% in soft style. The cepstral coefficients and transitional coefficients are combined to form an observation vector for dynamic time warping. This algorithm is tested on a limited number of speakers due to our limited data base.

  • Analysis of influencing factors for the grey multi-attribute group decision making

    In the problem of group decision-making, the information about the decision makers' preferences is not complete due to factors of the quality of human resource and the influence of environment. The information gained by decision making can be loss or hazy. When it is hazy the values of the objects to be appraised are interval grey numbers. The group decision making problems including the grey number are called the grey group decision-making problems. Combining the thoughts and methods of the grey system with the classic group decision-making theory, the grey group decision making problems are discussed. In this paper, we develop a GREY DEMATEL method for group decision-making to gather group ideas and analyze the cause-effect relationship of complex problems in grey environments. Procedures of the GREY DEMATEL method are then proposed. Using the GREY DEMATEL procedures, the involved criteria of a system (or subsystem) are separated into the cause and effect groups for helping decision-makers focus on those criteria that provide great influence. Finally, a practical example is used to show feasibility and effectiveness of the proposed approach.




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