Conferences related to Defect Control

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


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Periodicals related to Defect Control

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Defect Control

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Xplore Articles related to Defect Control

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Development of high-performance polycrystalline silicon thin-film transistors (TFTs) using defect control process technologies

IEEE Electron Device Letters, 2002

High-performance polycrystalline Si (poly-Si) thin-film transistors (TFTs) were successfully fabricated on a glass substrate below 425/spl deg/C by introducing defect control process technologies. The defects in the laser crystallized poly-Si films were terminated by an oxygen plasma treatment to the film and the defects at the SiO/sub 2//Si interface were controlled by a gate SiO/sub 2/ film formation using electron ...


Software reliability case development method based on software reliability characteristic model and measures of defect control

2016 7th IEEE International Conference on Software Engineering and Service Science (ICSESS), 2016

For high reliability software, mission critical system software and embedded system software, to demonstrate convincingly and validly that the software satisfies the reliability requirements is one of the most challenging issues. In this paper, we present a method for developing software reliability case based on software reliability characteristic model and measures of defect control. Three software reliability argument patterns are ...


Efficient killer-defect control using reliable high-throughput SEM-ADC

2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (IEEE Cat. No.01CH37160), 2001

An efficient killer-defect control method using a reliable high throughput scanning electron microscope and automatic defect classification (ADC) is described. The concept of ADC system-class is used to facilitate recipe set-up (defect imageless tuning). Experiments demonstrated that the performance of this method exceeds that specified by the International Technology Roadmap for Semiconductors. This method is applicable to both application-specific IC ...


Use of multiple lithography monitors in a defect control strategy for high volume manufacturing

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295), 1999

As I-line and deep ultraviolet (DUV) photolithography processes grow more complex, yield improvement has become more challenging and critical. With the advent of smaller sub-micron geometries using newer chemically amplified photoresists, a high sensitivity, easy to review and trouble-shoot monitor is essential. In order to fully understand what defects may be generated by a process or process tool, it is ...


Defect control of immersion lithography with top coat material

Digest of Papers Microprocesses and Nanotechnology 2005, 2005

193nm immersion lithography is the most promising lithography candidate toward 45nm node technology and beyond; because it is able to obtain larger DOF and higher resolution at a hyper NA lens design greater then 1.0. Also the recent progress of 193nm immersion lithography technology would be applicable to establish the high volume manufacturing process soon. However, immersion specific issue, such ...


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Educational Resources on Defect Control

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IEEE-USA E-Books

  • Development of high-performance polycrystalline silicon thin-film transistors (TFTs) using defect control process technologies

    High-performance polycrystalline Si (poly-Si) thin-film transistors (TFTs) were successfully fabricated on a glass substrate below 425/spl deg/C by introducing defect control process technologies. The defects in the laser crystallized poly-Si films were terminated by an oxygen plasma treatment to the film and the defects at the SiO/sub 2//Si interface were controlled by a gate SiO/sub 2/ film formation using electron cyclotron resonance (ECR) plasma enhanced chemical vapor deposition (PECVD). As a result, high n-channel mobility of 309 cm/sup 2/V/sup -1/s/sup -1/, low threshold voltage of 1.12 V and low subthreshold swing of 250 mV/decade were obtained. In addition, it was demonstrated that the defect control process is quite effective to minimize the variation of TFT characteristics.

  • Software reliability case development method based on software reliability characteristic model and measures of defect control

    For high reliability software, mission critical system software and embedded system software, to demonstrate convincingly and validly that the software satisfies the reliability requirements is one of the most challenging issues. In this paper, we present a method for developing software reliability case based on software reliability characteristic model and measures of defect control. Three software reliability argument patterns are proposed. As a case study, we take the load control software to demonstrate how a software reliability case can be generated using the proposed method and corresponding argument patterns.

  • Efficient killer-defect control using reliable high-throughput SEM-ADC

    An efficient killer-defect control method using a reliable high throughput scanning electron microscope and automatic defect classification (ADC) is described. The concept of ADC system-class is used to facilitate recipe set-up (defect imageless tuning). Experiments demonstrated that the performance of this method exceeds that specified by the International Technology Roadmap for Semiconductors. This method is applicable to both application-specific IC and system-on-chip production lines.

  • Use of multiple lithography monitors in a defect control strategy for high volume manufacturing

    As I-line and deep ultraviolet (DUV) photolithography processes grow more complex, yield improvement has become more challenging and critical. With the advent of smaller sub-micron geometries using newer chemically amplified photoresists, a high sensitivity, easy to review and trouble-shoot monitor is essential. In order to fully understand what defects may be generated by a process or process tool, it is necessary to fully duplicate the given process on the test wafer used to monitor the defect level. That concept is called: Process Induced Defects Per Wafer Pass (PIDPWP). PIDPWP requires the real and exact product process to be used in creating the defect test monitor. To monitor a photolithography process using the concept of PIDPWP, typically, a coat, expose, and develop sequence is used with a selected and simplified mask, such as a diffraction grating. In a manufacturing area with multiple technologies, each step of the process may require different resist/developer combinations. Each resist/developer combination requires constant monitoring to insure adequately low levels of defects. Our solution to this problem is to use multiple integrated monitors to verify each process. This allows for better response time and defect density control when the defects are due to the chemicals or chemical delivery systems, and not just the mechanical aspects of the tool. In addition, we have designed our system to have minimal impact on production, yet still allow for statistical process control, analysis, and defect reduction. The Photo Track Monitor (PTM) methods and results of this control strategy as applied in a high volume manufacturing environment are discussed.

  • Defect control of immersion lithography with top coat material

    193nm immersion lithography is the most promising lithography candidate toward 45nm node technology and beyond; because it is able to obtain larger DOF and higher resolution at a hyper NA lens design greater then 1.0. Also the recent progress of 193nm immersion lithography technology would be applicable to establish the high volume manufacturing process soon. However, immersion specific issue, such as the immersion specific defect (Gil et al., 2005) and the leaching of resists compound into immersion fluid (Tsuji et al., 2005), still exists without any effective countermeasure. In order to prevent these immersion specific criteria, topcoat is one of the most useful materials. In this report, we discuss the top coat development criteria that are the suppression ability for leaching material, the protection capability for water penetration, surface tension control and so on.

  • Defect control methods for SIMOX SOI wafer manufacture and processing

    The layered structure of thin film silicon-on-insulator (SOI) wafers introduces new considerations for defect detection, particularly for optical metrology tools used to characterize and control SOI wafer processing. Multi- layer interference, as well as subsurface features of the material, can complicate the detection of surface defects. Non-particle defect types which scatter light, such as mounds, pits (including so-called "HF" defects), and slip lines, can be efficiently detected and classified with advanced operating modes of state-of-the art optical metrology tools. Such capabilities facilitate improvements in the wafer manufacturing process, and result in improved defect detection capabilities and material quality. This work describes defect characterization of SIMOX-SOI wafers using the KLA-Tencor Surfscan 6420 and SP1/sup TBI/.

  • Bond pad F-crystal defect control and monitoring

    Bonding pad crystal defect was observed on wafers before die saw. To eliminate and monitor the defect, a study was conducted to investigate the effect of humidity and packaging materials (packaging sponge and lint free paper material) on pad crystal defect generation. Ionic content specification of packaging sponge material was defined through the study. A setup for routine monitoring of pad crystal defect was constructed and implemented in wafer fabrication. The pad crystal defects were F rich. Humidity (>55%) was found to be an effective acceleration factor of the defect. With a 70% humidity stress test, a F content limit of 400 ppb in packaging sponge material was concluded to prevent defect generation. Air non-permeable lint free paper was found to provide further protection of the wafers from pad crystal defect.

  • Novel darkfield patterned inspection system with killer defect control

    Darkfield defect inspection systems are widely used for inline monitoring since their sampling ratio is high. For yield ramp up it is necessary to combine the enormous amounts of inspection data with defect sources. In this paper we propose a data riddling method for darkfield defect inspection systems with high sensitivity and high throughput. This method consists of a fatality recognition function and a defect size measurement function.

  • Photo track defect control using multiple masking layer defect data

    The defect monitoring strategy presented here has been developed for defectivity feedback for track and stepper issues typically seen in a high volume multi-device manufacturing facility. It combines data streams from multiple masking layers and product mixes improving the signal to noise ratio (S/N) of the defectivity signal utilizing an AMD/Spansion developed statistical control system known as ASPECT. True defect driven failures at the current layer, faster feedback loops, and a more comprehensive look at potential problems within the photo lithography area are the results of this integrated monitor process control strategy.

  • Bubble defect control in low-cost roll-to-roll ultraviolet imprint lithography

    To obtain high quality patterns in ultraviolet roll-to-roll (R2R) imprinting lithography in the atmospheric environment with industrial resins, air bubble defects and the resulting distortion should be avoided in the process. In this reported work, the formation mechanism of the bubble defects is studied systematically with experiments and numerical analysis. The results show that the unsuitable resin coating method mainly contributes to the bubble defects in resin. On the basis of the above conclusions, an improved coating method is proposed in order to reduce the bubbles in the R2R process. This improvement can be applied to the replication of high quality patterns in R2R imprinting with low-cost industrial resins.



Standards related to Defect Control

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IEEE Guide for Diagnostics and Failure Investigation of Power Circuit Breakers

This guide recommends procedures to be used to perform failure investigations of power circuit breakers. Although the procedure may be used for any circuit breaker, it is mainly focused on high-voltage ac power circuit breakers used on utility systems. Recommendations are also made for monitoring circuit breaker functions as a means of diagnosing their suitability for service condition.



Jobs related to Defect Control

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