128 resources related to
Chip/package Co-design
Top Conferences on Chip/package Co-design
2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2022 IEEE Custom Integrated Circuits Conference (CICC)
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)
2021 IEEE 14th International Conference on ASIC (ASICON)
2021 IEEE 15th Malaysia International Conference on Communication (MICC)
2021 IEEE Asia-Pacific Microwave Conference (APMC)
2010 European Wireless Technology Conference (EuWIT)
2010 10th Russian-Chinese Symposium on Laser Physics and Laser Technologies (RCSLPLT) & 2010 Academic Symposium on Optoelectronics Technology (ASOT)
2009 20th International Zurich Symposium on Electromagnetic Compatibility
More links
