128 resources related to

Chip/package Co-design

Top Conferences on Chip/package Co-design

2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

2022 IEEE Custom Integrated Circuits Conference (CICC)

2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

2022 23rd International Symposium on Quality Electronic Design (ISQED)

2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)

2022 59th ACM/IEEE Design Automation Conference (DAC)

2022 17th European Microwave Integrated Circuits Conference (EuMIC)

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)

2021 IEEE 14th International Conference on ASIC (ASICON)

2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)

2021 18th International SoC Design Conference (ISOCC)

2021 Design, Automation & Test in Europe Conference & Exhibition (DATE)

2021 IEEE 15th Malaysia International Conference on Communication (MICC)

2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2021 IEEE Asia-Pacific Microwave Conference (APMC)

2021 IEEE CPMT Symposium Japan (ICSJ)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP)

2015 IEEE International Reliability Physics Symposium (IRPS)

2013 IEEE International Integrated Reliability Workshop (IIRW)

2010 European Wireless Technology Conference (EuWIT)

2010 10th Russian-Chinese Symposium on Laser Physics and Laser Technologies (RCSLPLT) & 2010 Academic Symposium on Optoelectronics Technology (ASOT)

2009 20th International Zurich Symposium on Electromagnetic Compatibility

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Xplore Articles related to Chip/package Co-design

Chip-package co-design for mixed SoC

RF robustness enhancement through statistical analysis of chip package co- design

DREAM: a chip-package co-design tool for RF-mixed signal systems

Chip package co-design of the RF front end with an integrated antenna on multilayered organic material

Modeling and Parameter Extraction Methods of Bond-Wires for Chip-Package Co- Design

An LCP package model for use in **chip/package co-design** of an X-band SiGe Low Noise Amplifier

Chip-package co-design of a 4.7 GHz VCO

Chip package co-design of receiver front-end for 4G mobile phones

Chip-package co-design methodology for global co-simulation of re-distribution layers (RDL)

System-level **chip/package co-design** for multi-core processors implemented with power-gating technique

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Periodicals related to Chip/package Co-design

Device and Materials Reliability, IEEE Transactions on

Electron Devices, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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Top Organizations on Chip/package Co-design

Circuits & Systems

Components, Packaging & Manufacturing Tech

Electron Devices

Electronic Design Automation, Council on

Microwave Theory & Techniques

Solid State Circuits

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Most published Xplore authors for Chip/package Co-design

Yuhan Gao

Lintao Liu

Liang Chen

Ruzhang Li

Ruimin Xu

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Chip/package Co-design

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Top Conferences on Chip/package Co-design

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Xplore Articles related to Chip/package Co-design

Periodicals related to Chip/package Co-design

Top Organizations on Chip/package Co-design

Most published Xplore authors for Chip/package Co-design