128 resources related to
Chip/package Co-design
Top Conferences on Chip/package Co-design
2026 25th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2022 IEEE Custom Integrated Circuits Conference (CICC)
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)
2021 IEEE 14th International Conference on ASIC (ASICON)
2021 IEEE 15th Malaysia International Conference on Communication (MICC)
2021 IEEE Asia-Pacific Microwave Conference (APMC)
2010 European Wireless Technology Conference (EuWIT)
2010 10th Russian-Chinese Symposium on Laser Physics and Laser Technologies (RCSLPLT) & 2010 Academic Symposium on Optoelectronics Technology (ASOT)
2009 20th International Zurich Symposium on Electromagnetic Compatibility
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