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Packaging And Assembly

Top Conferences on Packaging And Assembly

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 IEEE Applied Power Electronics Conference and Exposition (APEC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)

2021 IEEE CPMT Symposium Japan (ICSJ)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2019 Winter Simulation Conference (WSC)

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2019 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)

2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

SC18: International Conference for High Performance Computing, Networking, Storage and Analysis

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

2018 IEEE International Conference on Software Architecture (ICSA)

2018 Asia-Pacific Microwave Conference (APMC)

2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

2017 9th International Congress on Ultra Modern Telecommunications and Control Systems and Workshops (ICUMT)

2017 IEEE 30th International Conference on Microelectronics (MIEL)

2017 40th International Spring Seminar on Electronics Technology (ISSE)

2017 International Conference on Machine Learning and Cybernetics (ICMLC)

2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

2017 12th International Conference on Computer Engineering and Systems (ICCES)

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting

2015 IEEE International Reliability Physics Symposium (IRPS)

2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS 2013)

2013 Brazilian Power Electronics Conference (COBEP 2013)

2013 Workshop on Accelerated Stress Testing & Reliability (ASTR)

2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2013 IEEE International Integrated Reliability Workshop (IIRW)

2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems

2013 NORCHIP

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2012 6th International Conference on Software Security and Reliability (SERE)

2012 13th International Symposium on Quality Electronic Design (ISQED)

2012 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2012

2012 19th IEEE International Conference on Electronics, Circuits and Systems - (ICECS 2012)

2012 Argentine School of Micro-Nanoelectronics, Technology and Applications (EAMTA)

2012 International Symposium on Optomechatronic Technologies (ISOT 2012)

2012 IEEE International Interconnect Technology Conference - IITC

2011 IEEE International Symposium on Assembly and Manufacturing (ISAM)

2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)

2009 3rd International Electrostatic Discharge Workshop (IEW)

2008 2nd International Electrostatic Discharge Workshop (IEW)

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

2007 International Electrostatic Discharge Workshop (IEW)

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Xplore Articles related to Packaging And Assembly

Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures

Building In Reliability For **Packaging And Assembly**

Ultra slim **packaging and assembly** method for 360-μm diameter guide wires

University Education Program on Microelectronics **Packaging and Assembly**: Facing the Challenging of Fast Developing Electronics Industry

A novel parallel manipulator design for **packaging and assembly**

Survey of High-Temperature Reliability of Power Electronics Packaging Components

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

**Packaging and Assembly** Challenges for 50G Silicon Photonics Interposers

**Packaging and assembly** for integrated photonics - the ePIXpack photonics packaging service

**Packaging and assembly** of 12-channel parallel optical transceiver module

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Periodicals related to Packaging And Assembly

Advanced Packaging, IEEE Transactions on

Aerospace and Electronic Systems Magazine, IEEE

Antennas and Propagation, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Computing in Science & Engineering

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Education, IEEE Transactions on

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Microelectromechanical Systems, Journal of

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Plasma Science, IEEE Transactions on

Power Electronics, IEEE Transactions on

Selected Topics in Quantum Electronics, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Software Engineering, IEEE Transactions on

Solid-State Circuits, IEEE Journal of

Spectrum, IEEE

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Packaging And Assembly

Packaging Technologies

Antenna Integration in eWLB Package

Embedded Wafer‐Level Ball Grid Array (eWLB) Packaging Technology Platform

Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs

Cost Comparison of FO‐WLP with Other Technologies

Die Integration Technologies on Advanced Substrates Including Embedding and Cavities

The Role of Pick and Place in Fan‐Out Wafer‐Level Packaging

Electronic Package Assembly

The Software Assembly Descriptor

State‐of‐the‐Art IC Packages, Modules, and Substrates

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Courses related to Packaging And Assembly

Introduction to Developing Embedded Systems

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Top Organizations on Packaging And Assembly

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Components, Packaging & Manufacturing Tech

Computer

Education

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Member and Geographic Activities

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Power Electronics

Reliability

Robotics & Automation

Signal Processing

Solid State Circuits

Technical Activities Board

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Most published Xplore authors for Packaging And Assembly

Tao-Chih Chang

Jin-Ye Juang

Hung-Jen Chang

Chun-Chih Chuang

Chau-Jie Zhan

Yin-Po Hung

Tsung-Fu Yang

Wei Li

Su-Ching Chung

Jung-Hua Chou

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Packaging And Assembly

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Xplore Articles related to Packaging And Assembly

Periodicals related to Packaging And Assembly

E-books related to Packaging And Assembly

Courses related to Packaging And Assembly

Top Organizations on Packaging And Assembly

Most published Xplore authors for Packaging And Assembly