Conferences related to Integrated Circuits

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


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Periodicals related to Integrated Circuits

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Reviews in

The IEEE Reviews in Biomedical Engineering will review the state-of-the-art and trends in the emerging field of biomedical engineering. This includes scholarly works, ranging from historic and modern development in biomedical engineering to the life sciences and medicine enabled by technologies covered by the various IEEE societies.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


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Most published Xplore authors for Integrated Circuits

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Xplore Articles related to Integrated Circuits

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Silicon Integrated Circuits Incorporating Antennas

IEEE Custom Integrated Circuits Conference 2006, 2006

The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip ...


IEE Colloquium on 'Power Integrated Circuits' (Digest No.34)

IEE Colloquium on Power Integrated Circuits, 1989

None


High-performance RF/microwave integrated circuits in advanced logic CMOS technology: the coming of age for RF/digital mixed-signal system-on-a-package

16th Symposium on Integrated Circuits and Systems Design, 2003. SBCCI 2003. Proceedings., 2003

Summary form only given. This tutorial presents recent developments in CMOS device and circuit technology, which enable the disruptive ascent of CMOS logic technology to the forefront of high performance RF/microwave communication circuit and system designs, fully integrated with high performance digital processors on the same die. Device level characteristics of CMOS and bipolar are compared vis-a-vis, and their meaning ...


Progress and Challenges Towards Terahertz CMOS Integrated Circuits

IEEE Journal of Solid-State Circuits, 2010

Key components of systems operating at high millimeter wave and sub-millimeter wave/terahertz frequencies, a 140-GHz fundamental mode voltage controlled oscillator (VCO) in 90-nm CMOS, a 410-GHz push-push VCO with an on-chip patch antenna in 45-nm CMOS, and a 125-GHz Schottky diode frequency doubler, a 50-GHz phase-locked loop with a frequency doubled output at 100 GHz, a 180-GHz Schottky diode detector ...


Applications of power integrated circuits in switch-mode power supplies

IEE Colloquium on Power Integrated Circuits, 1989

Designers of switched-mode power supplies (SMPS) are constantly looking for ways to make their products lighter and smaller. The movement towards higher frequencies (100 kHz or above) is aimed at reducing the size of the magnetics and associated components and hence it little more than a design technique for reducing size. Likewise, the search for power integrated circuits in SMPS ...


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Educational Resources on Integrated Circuits

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IEEE-USA E-Books

  • Silicon Integrated Circuits Incorporating Antennas

    The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing

  • IEE Colloquium on 'Power Integrated Circuits' (Digest No.34)

    None

  • High-performance RF/microwave integrated circuits in advanced logic CMOS technology: the coming of age for RF/digital mixed-signal system-on-a-package

    Summary form only given. This tutorial presents recent developments in CMOS device and circuit technology, which enable the disruptive ascent of CMOS logic technology to the forefront of high performance RF/microwave communication circuit and system designs, fully integrated with high performance digital processors on the same die. Device level characteristics of CMOS and bipolar are compared vis-a-vis, and their meaning to circuit design and system performance are analyzed. Circuit level solutions to compensate for intrinsic drawbacks on logic CMOS technology are introduced and their adequacy to RF/microwave wireless integrated system stressed. New CMOS- compatible structures, already available as deep Nwell implants, are shown to be the only required device level addition to advanced CMOS processes to enable mixed-signal integration. The tutorial concludes with a prelude of what is ahead and where very promising research and product developments are likely to come from.

  • Progress and Challenges Towards Terahertz CMOS Integrated Circuits

    Key components of systems operating at high millimeter wave and sub-millimeter wave/terahertz frequencies, a 140-GHz fundamental mode voltage controlled oscillator (VCO) in 90-nm CMOS, a 410-GHz push-push VCO with an on-chip patch antenna in 45-nm CMOS, and a 125-GHz Schottky diode frequency doubler, a 50-GHz phase-locked loop with a frequency doubled output at 100 GHz, a 180-GHz Schottky diode detector and a 700-GHz plasma wave detector in 130-nm CMOS are demonstrated. Based on these, and the performance trends of nMOS transistors and Schottky diodes fabricated in CMOS, paths to terahertz CMOS circuits and systems including key challenges that must be addressed are suggested. The terahertz CMOS is a new opportunity for the silicon integrated circuits community.

  • Applications of power integrated circuits in switch-mode power supplies

    Designers of switched-mode power supplies (SMPS) are constantly looking for ways to make their products lighter and smaller. The movement towards higher frequencies (100 kHz or above) is aimed at reducing the size of the magnetics and associated components and hence it little more than a design technique for reducing size. Likewise, the search for power integrated circuits in SMPS is mainly governed by a desire to reduce size, although the broader advantages of integration are often an additional attraction. The author considers firstly the use of power hybrids in SMPS and then looks briefly at monolithic structures. He concludes that in terms of future development, the power hybrid offers the most likely way forward for SMPSs of any size, with monolithic integration being developed to offer more complex control chips and larger power stages.<<ETX>>

  • Test and design-for-test of mixed-signal integrated circuits

    This tutorial aims to introduce circuit designers to the problems of making integrated circuits more testable. An efficient test procedure for a complex, mixed-signal application specific integrated circuit (ASIC), must take several factors into consideration: stimuli generation, sufficient access, single test output, simple measurement set and system-level decomposition. These factors worth attention for specific circuits classes, since there is no universal method valid for any kind of analog and/or mixed-signal function. Attention is paid to integrated filters and integrated analog-to-digital and digital-to- analog converters, as they are today the main analog and mixed-signal cores found in state-of-the-art complex systems-on-chips (SoC). In particular, the possibilities offered by techniques using small circuit modifications are specially focused, as the means to improve circuit testability, and thus the fault coverage, while avoiding at most to degrade the performance of the final electronic system. Practical silicon examples are presented, trying to give a flavour on the pros and cons that design for test is offering nowadays to integrated circuit designers. To meet the goals stated above, the following topics are addressed in this tutorial: introduction to mixed-signal test (main test concepts, digital vs. analog testing, test practice in integrated circuit industry, design and test inter-relations), testing approaches (fault-based, specification-based, techniques for testing filters, techniques for testing converters), and design-for-test techniques (enhancing testability, built-in self-test and on-line test). This tutorial is intended for professionals interested in analog and mixed-signal integrated circuits in general: designers interested in how to consider tests in early design phases, test engineers interested in incorporating test within the design flow, and academics involved in research and education on test procedures and strategies.

  • Substrate noise measurement by using noise-selective voltage comparators in analog and digital mixed-signal integrated circuits

    In mixed-signal integrated circuits (IC's), substrate noise produced by high- speed digital circuits passes to the on-chip analog circuits through the substrate and seriously degrades their performance. We have developed a method for measuring the substrate noise by using noise-selective chopper-type voltage comparators as noise detectors. This method can detect the wide-band substrate noise so we can analyze and further reduce its effect. A switched capacitance is selectively loaded on the output of the inverter amplifier of the comparator during the comparison period in order to reduce the noise detected at the transition from compare to auto-zero. In contrast, the noise at the transition from auto-zero to compare can be selectively detected. Waveforms of high-frequency substrate noise were reconstructed by using this on-chip-noise detector incorporating the noise-selective comparators implemented using a 0.5-/spl mu/m CMOS bulk process.

  • Ultra-fast, low-power integrated circuits in a scaled submicron HBT IC technology

    We have developed fast, dense, and low-power integrated circuits using a new scaled IC process. We have fabricated HBTs of 0.3 /spl mu/m/sup 2/ emitter and circuit metalization pitch of 4 /spl mu/m to reduce power and compact the chip size. Submicron HBTs exhibited f/sub T/ of over 160 GHz. We have demonstrated a number of circuits including a low-power comparator test chip clocked at 40 GHz.

  • Paths to terahertz CMOS integrated circuits

    A 140-GHz fundamental mode VCO in 90-nm CMOS and a 410-GHz push-push VCO in 45-nm CMOS, and a 125-GHz Schottky diode frequency doubler, a 50-GHz phase locked loop with a frequency doubled output at 100 GHz, a 180-GHz Schottky diode detector and a 700-GHz plasma wave detector in 130-nm CMOS have been demonstrated. Based on these, paths to terahertz CMOS circuits are suggested.

  • Power integrated circuits and their applications

    The introduction of power MOSFET technology provided the necessary impetus for including power functions-up to several amperes capability, with operating voltages up to 100 V-in the monolithic Si structure. This is the result of the MOSFETs superior Si utilisation over any other topography at the stated working voltage. Full circuit protection against overloads in voltage and current with the added proviso of protection against excessive temperature can be easily accommodated. These low voltage power integrated circuits are presently found in such diverse areas of applications as: DC/DC converters; motor controllers; and automotive high side power switches-mainly as relay replacements. The favoured technology for these monolithic structures tends to be BCD (bipolar, CMOS and DMOS) either self-isolated or junction isolated- where the type of structure tends to be one of preference. When considering monolithic structures for higher voltage applications viz. up to 1000 V-a pre- requisite for operation employing 3 phase rectified mains-only two types of technology are found to be viable: (a) junction isolation; and (b) dielectric isolation. Each of these two technologies have their individual merits and drawbacks, and the author discusses them in more detail.<<ETX>>



Standards related to Integrated Circuits

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IEEE Standard for an Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks

ALF shall serve as the data specification language of library elements for design applications used to implement integrated circuits. The range of abstraction shall include from the register-transfer level (RTL) to the physical level. The language shall model behavior, timing, power, signal integrity, physical abstraction and physical implementation rules of library elements.


IEEE Standard for Boundary-Scan Testing of Advanced Digital Networks

This project will define an extension to IEEE Std. 1149.1-2001 to standardize the boundary scan structures and methods required to ensure simple, robust, and minimally intrusive boundary scan testing of advanced digital networks not adequately addressed by existing standards, especially those networks that are AC-coupled, differential, or both, in parallel with IEEE Std. 1149.1 testing of conventional digital networks and ...


IEEE Standard for Design and Verification of Low Power Integrated Circuits

This standard establishes a format used to define the low power design intent for electronic systems and electronic intellectual property. The format provides the ability to specify the supply network, switches, isolation, retention and other aspects relevant to power management of an electronic system. The standard defines the relationship between the low power design specification and the logic design specification ...


IEEE Standard for Integrated Circuit (IC) Delay and Power Calculation System

Delay and power calculation for integrated circuit design.


IEEE Standard Testability Method for Embedded Core-based Integrated Circuits

This project will develop a standard design-for-testability method for Integrated Circuits containing embedded cores, i.e., reusable megacells. This method will be independent of the underlying functionality of the Integrated Circuit or its individual embedded cores. The method will create the necessary testability requirements for detection and diagnosis of such Integrated Circuits, while allowing for ease of interoperability of cores originated ...


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