Conferences related to Microassembly

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Haptics Symposium (HAPTICS)

Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices.

  • 2018 IEEE Haptics Symposium (HAPTICS)

    Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices.

  • 2016 IEEE Haptics Symposium (HAPTICS)

    Held since 1992, the IEEE Haptics Symposium (HAPTICS) is a vibrant interdisciplinary forum where psychophysicists, engineers, and designers come together to share advances, spark new collaborations, and envision a future that benefits from rich physical interactions between humans and computers, generated through haptic (force and tactile) devices. In 2016, this conference will be held in central Philadelphia, one of the most historic and beautiful cities in North America. HAPTICS 2016 will be a four-day conference with a full day of tutorials and workshops and three days of conference activities including technical paper presentations and hands-on demonstrations.Features:ExhibitsWorkshops and TutorialsHands-on Demonstrations

  • 2014 IEEE Haptics Symposium (HAPTICS)

    This conference brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators, and the study of the human systems involved in haptic interacti

  • 2012 IEEE Haptics Symposium (HAPTICS)

    This conference brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators, and the study of the human systems involved in haptic interaction.

  • 2010 IEEE Haptics Symposium (Formerly known as Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems)

    The Haptics Symposium is a bi-annual, single-track conference that brings together researchers who are advancing the human science, technology and design processes underlying haptic (force and tactile) interaction systems. Our community spans the disciplines of biomechanics, psychology, neurophysiology, engineering, human-computer interaction and computer science.

  • 2008 16th Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (Haptics 2008)

    The Haptics Symposium is an annual, single-track conference that brings together researchers in diverse engineering and human science disciplines who are interested in the design, analysis, and evaluation of systems that display haptic (force and touch) information to human operators.

  • 2006 14th Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


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Periodicals related to Microassembly

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Microassembly

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Xplore Articles related to Microassembly

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An 8b 250MHz A/D converter

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.


A 25MHz thermally-based RMS-to-DC converter

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

This paper will describe a thermally-based rms-to-dc converter with 1% accuracy for 25MHz bandwidth inputs.


Study of delaminated plastic packages by high temperature Moire and finite element method

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997

In the current study, 1200 l/mm gratings are replicated at elevated temperatures onto the cross sections of two delaminated plastic packages: a thin quad flatpack plastic package (TQFPP) and a power small outline plastic package (PSOPP). The specimens are measured at room temperature for thermal deformation induced by cooling process. The finite element models are used to simulate the cooling ...


Automatic Microassembly Method Based on Teaching Playback and Visual Servo

2017 4th International Conference on Information Science and Control Engineering (ICISCE), 2017

In view of the characteristics of non-silicon flat micro parts in MEMS devices, such as small, light and thin, a vacuum adsorption microassembly system based on microvision was established. Through the research on the key assembly technologies of micro-gripper operation, moving control and micro vision positioning, a general scheme of automatic assembly for flat micro parts is put forward, which ...


Assembly process development of stacked multi-chip leadframe package

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004

Driven by customer requirements and the need for cost reduction, high density stacked multi-chip package (MCP) based on leadframe type has been developed in Agere Systems. This MCP integrates one SoC chip with two stacked SDRAM chips. The paper focuses on the assembly process development and finite element analysis of high density multi-chip package based on leadframe. All the experiments ...


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Educational Resources on Microassembly

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IEEE-USA E-Books

  • An 8b 250MHz A/D converter

    An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.

  • A 25MHz thermally-based RMS-to-DC converter

    This paper will describe a thermally-based rms-to-dc converter with 1% accuracy for 25MHz bandwidth inputs.

  • Study of delaminated plastic packages by high temperature Moire and finite element method

    In the current study, 1200 l/mm gratings are replicated at elevated temperatures onto the cross sections of two delaminated plastic packages: a thin quad flatpack plastic package (TQFPP) and a power small outline plastic package (PSOPP). The specimens are measured at room temperature for thermal deformation induced by cooling process. The finite element models are used to simulate the cooling process and the results are compared with the Moire interferometry results. The finite element models with different delaminations between die and die attach are used to simulate the fringe patterns obtained from Moire interferometry. It was found that the delamination size can be estimated by the combination of Moire technique and finite element method. The finite element model, once verified, can then be used in making cost effective decisions in plastic packaging design and processing.

  • Automatic Microassembly Method Based on Teaching Playback and Visual Servo

    In view of the characteristics of non-silicon flat micro parts in MEMS devices, such as small, light and thin, a vacuum adsorption microassembly system based on microvision was established. Through the research on the key assembly technologies of micro-gripper operation, moving control and micro vision positioning, a general scheme of automatic assembly for flat micro parts is put forward, which is based on the combination of teaching playback and microscopic visual feedback. Furthermore, some key technologies are especially studied, such as teaching playback control method, target part recognition, position compensation and attitude adjustment, and an automatic assembly program is developed by using VC++ platform. The experimental results show that automatic assembly can be realized by using the combinational control mode of visual servo and teaching playback, and it has higher precision and efficiency, and it also has realistic significance to automatic assemble application.

  • Assembly process development of stacked multi-chip leadframe package

    Driven by customer requirements and the need for cost reduction, high density stacked multi-chip package (MCP) based on leadframe type has been developed in Agere Systems. This MCP integrates one SoC chip with two stacked SDRAM chips. The paper focuses on the assembly process development and finite element analysis of high density multi-chip package based on leadframe. All the experiments in the paper were conducted using a test vehicle with 144 pin TQFP leadframe. Three main processes were evaluated in the experiments, which are die attach, wire bonding and molding. The paper presents some of the challenges for process development such as placement accuracy and epoxy bleed for die attach, ball neck nicking and wire straightness control of reverse bonding for wire bonding and wire sweep for molding. The evaluation results for these three processes are satisfactory. The paper also presents finite element modeling for both stacked MCP and discrete single die packages. The results show that there is no obvious difference on package warpage and thermal/mechanical stress for both packages. Therefore, it is verified that the new established processes for this stacked MCP could be used for actual stacked MCP prototypes build and this stacked MCP is promising for future high volume production.

  • Design Tradeoffs When Using SMT, COB, And/or TAB packaging Technology

    None

  • Finite Element Method based stress analysis and warpage prediction of SIM card packaging

    SIM cards have been more and more widely used and the failure of packaging becomes a remarkable issue. In this paper, effects of die thickness and layout, material properties and packaging process parameters on the stress of dies were analyzed based on finite element simulation. The whole simulation includes two main packaging processes: cooling after die attach and molding process. The warpage of SIM card after packaging was also researched. The results reveal that the die stress is sensitive to the die thickness and material property can also affect the stress level and warpage. To lower the die stress and package warpage, manufacturers should pay enough attention to material selection and process parameter set.

  • A conceptual assembly study on enhancing the voltage capability of the FlatPower package platform via Tandem diodes

    In this publication we demonstrate the manufacture of so-called Tandem diodes in a soft-soldered, stacked-die configuration. Compared to the planar product design, where the dies are placed next to each other and wire bonded, the needed board space can be reduced significantly, lowering cost and application size. We discuss the manufacturability and the critical processing items and show their feasibility.

  • Transient thermal response of power semiconductors to short power pulses

    Thermal response curves used to calculate the peak junction temperature of power semiconductors are normally derived by experimental identification of the parameters of a known model. Unfortunately the model, developed many years ago, is inappropriate for large surges of short time duration, as they are encountered in present day power conditioning systems. An alternative model is derived, the limits of its accuracy are estimated, and a correction factor is described. A verification of the accuracy of the two methods is also presented. For pulse widths shorter than the thermal transit time, which is in the order of 300 mu s, the peak junction temperature can be more accurately calculated with an expression derived in the present work, which takes into consideration the active volume in which the heat is generated, than with the transient thermal response curve. A correction factor, a function of the width of the pulse, inserted in this equation, further improves its accuracy.<<ETX>>

  • Unwanted microwave oscillator frequency shifts induced by bipolar junction transistor die attach

    Two space qualified frequency synthesizers were found to exhibit noise bursting during testing, following X-ray examination, in July 1994. An inter- company, cross-functional investigation team was formed to determine root cause because of the potential impact on flight hardware. The source of the problem was isolated to poor bonding of a bipolar junction transistor (BJT). The root cause of the noise bursting phenomena was not positively identified, but there is strong correlation to the die attachment process of the BJT in the oscillator of the VCO and a soft correlation with the BJT environment.



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