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Flip-chip Devices

Top Conferences on Flip-chip Devices

2021 51st European Microwave Conference (EuMC)

2022 IEEE Radio and Wireless Symposium (RWS)

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2022 IEEE 19th Annual Workshop on Microelectronics and Electron Devices (WMED)

2022 IEEE International Ultrasonics Symposium (IUS)

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 28th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)

2021 IEEE International Reliability Physics Symposium (IRPS)

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE Asia-Pacific Microwave Conference (APMC)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

2018 IEEE International Conference on Semiconductor Electronics (ICSE)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2015 25th International Crimean Conference "Microwave and Telecommunication Technology" (CriMiCo)

2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS 2011)

2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems (ELECTRO-2009)

Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

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Xplore Articles related to Flip-chip Devices

The PhotonicPlug - Scaling Up Silicon Photonics Packaging

Fluxless Flip Chip Interconnects for MEMS Devices for Heterogeneous Integration

Construction analysis of flip chip package for aerospace application

A Novel BLU-Free Full-Color LED Projector Using LED on Silicon Micro-Displays

Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

Toolbox for 3D acoustic imaging of manufactured electronic circuits

Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application

Implementation of High-Temperature Pressure Sensor Package and Characterization up to 500°C

LED flip chip packaging trends with tear down study

A fuzzy SVM for intelligent diagnosis of solder bumps using scanning acoustic microscopy

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E-books related to Flip-chip Devices

Interconnects

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Most published Xplore authors for Flip-chip Devices

Shigeru Kanazawa

Takeshi Fujisawa

Kiyoto Takahata

Toshio Ito

Yuta Ueda

Wataru Kobayashi

Hiroyuki Ishii

Hiroaki Sanjoh

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Flip-chip Devices

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Top Conferences on Flip-chip Devices

Xplore Articles related to Flip-chip Devices

E-books related to Flip-chip Devices

Most published Xplore authors for Flip-chip Devices