Conferences related to Measurement errors

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


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Periodicals related to Measurement errors

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


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Most published Xplore authors for Measurement errors

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Xplore Articles related to Measurement errors

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A recursive measurement error estimation identification method

IEEE Power Engineering Review, 1991

None


Innovations in microwave measurement

IEEE MTT-S International Microwave Symposium Digest, 2005., 2005

Presents an abstract for the session paper for the above titled paper.


IEE Colloquium on 'Uncertainties in Electrical Measurement' (Digest No.109)

IEE Colloquium on Uncertainties in Electrical Measurement, 1993

None


IEE Half-Day Colloquium on Uncertainties Made Easy (Ref. No.1996/168)

IEE Colloquium on Uncertainties Made Easy (Digest No. 1996/168), 1996

None


Material parameter measurements for microwave anti reflection coating development

2008 Microwaves, Radar and Remote Sensing Symposium, 2008

The main steps for characterization and measurement of microwave absorbent materials in the 1-10 GHz range is introduced. The coaxial reflection- transmission type of material parameter measurement is analyzed in detail and the main measurement error is corrected. The microscopic material particle parameter measurement concept is also presented using different mixing rule laws to determine the material parameters of the ...


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Educational Resources on Measurement errors

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IEEE.tv Videos

IMS 2011 Microapps - Waveguide Characteristics and Measurement Errors
Quadrotor Trajectory Tracking with L1 Optimal control
Micro-Apps 2013: Precision RF/MW Cable and Antenna Test in the Field
IMS 2011 Microapps - A Comparison of Noise Parameter Measurement Techniques
IMS 2011 Microapps - Ultra Low Phase Noise Measurement Technique Using Innovative Optical Delay Lines
IMS 2011 Microapps - Vector-Receiver Load Pull - Measurement Accuracy at its Best
HIMSS IT Reform - Interoperability
RF Induced Communication Errors in RFFE MIPI Controlled Power Amplifiers: RFIC Interactive Forum
IMS 2012 Microapps - Passive Intermodulation (PIM) measurement using vector network analyzer Osamu Kusano, Agilent CTD-Kobe
APEC 2012 - Thomas S. Buzak Plenary
I2MTC 2014 Conference Preview
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
How to Think about Cryptography: Common Crypto Flaws and How to Avoid Them - IEEE SecDev 2016
MicroApps: Measurement Advances for Differential and I/Q Devices (Agilent Technologies)
Playing With Numbers for Energy Efficiency: Introduction to Approximate Computing - Olivier Sentieys at INC 2019
MicroApps: Recent Improvement on Y-Factor Noise Figure Measurement Uncertainty (Agilent Technologies)
Computing with Dynamical Systems - Fred Rothganger: 2016 International Conference on Rebooting Computing
Handling of a Single Object by Multiple Mobile Robots based on Caster-Like Dynamics
Micro-Apps Keynote 2013: Modern RF Measurements and How They Drive Spectrum Analyzer Digital IF Processor Design
National Strategic Computing Initiative - Carl Williams: 2016 International Conference on Rebooting Computing

IEEE-USA E-Books

  • A recursive measurement error estimation identification method

    None

  • Innovations in microwave measurement

    Presents an abstract for the session paper for the above titled paper.

  • IEE Colloquium on 'Uncertainties in Electrical Measurement' (Digest No.109)

    None

  • IEE Half-Day Colloquium on Uncertainties Made Easy (Ref. No.1996/168)

    None

  • Material parameter measurements for microwave anti reflection coating development

    The main steps for characterization and measurement of microwave absorbent materials in the 1-10 GHz range is introduced. The coaxial reflection- transmission type of material parameter measurement is analyzed in detail and the main measurement error is corrected. The microscopic material particle parameter measurement concept is also presented using different mixing rule laws to determine the material parameters of the single particles from the macroscopic parameters. Two dimensional FDTD simulations have been used to model the behavior of mixed electric and magnetic type of material.

  • Characteristic-impedance measurement error on lossy substrates

    This paper examines error caused by parasitic inductance in the characteristic impedance measured by the calibration comparison method on lossy silicon substrates.

  • Dual-mode digital revolution counter

    Revolution speed measurement methods are analyzed. Three different measurement methods are presented and appropriate resolutions and relative errors are calculated The method which measures the time between two pulses gives the best results for slow rotation speeds. The method which counts the number of pulses in a fixed time window gives better results for high rotation speeds. Measurement optimization is done by measuring in two modes corresponding to the previous methods and the relative error is significantly decreased. A revolution counter is realized for measuring rotation speeds in the range 10-9999 r.p.m. with a sensor which gives one pulse per revolution. In the entire range the resolution of 1 r.p.m. is displayed. A microcontroller is used for switching between the measurement modes as well as for the rotation speed calculation and displaying.

  • A multi-mode optical fibre sensing system using white light interferometry

    Firstly, the theory of the white light interferometer is presented. This is followed by minimum peak height difference and related experimental results. The curve fitting signal processing scheme and the best order of polynomial for curve fitting are then discussed. Finally, displacement measurement with and without curve fitting signal processing is examined. The results show that, with a two wavelength source, the central fringe can be identified if the sampling gap is smaller than the maximum sampling OPD gap. The noise in the system can be reduced by the curve fitting technique proposed. The best order of the polynomial used to carry out curve fitting is four according to the experimental results and the analysis.

  • On the influence of coordinate transform upon measurement error of bistatic radar system

    Coordinate transformation is always concerned with data processing of bistatic/multistatic systems. The influence of coordinate transformation upon measurement errors of the bistatic system is discussed in the paper. Detail derivations of the relation equation between the original coordinate system and the transformed new one, quantitative analysis of the influence and a number of curves are also given in the paper.

  • A New State Estimation Model of Utilizing PMU Measurements

    The PMU can measure voltage phasors of the PMU node and current phasors of the correlative branch, and voltage phasors of the correlative nodes can be calculated by PMU measurements, so the state variable of these nodes are known. Two ways of research on the state estimation(SE) with PMU measurements are: one regards the PMU measurements as normal measurements and uses them together with SCADA measurements in the nonlinear state estimation; the other is linear state estimation with only PMU measurements on the condition that the system is observable fully with PMUs. The former has not considered the PMU's ability of measuring state variables, and the latter is difficult to realize now. Considering the high measurement precision and reliability of the PMU, the paper gives a new model to regard the state variable measured or calculated by PMU as the state variable of nodes in the state estimation. The model can utilize the PMU's ability of measuring state variables, reduce the scale of estimator. The improvement of calculating time- consuming and convergence speed in the new model is analyzed by the simulation. In the new SE model, the weight of PMU measurements is assumed to be infinite, and not equal to the variance reciprocal of measurements error, so the state estimation precision is influenced by the weight departure of the PMU measurements. The paper analyses and expands the new model more deeply, and presents a double state estimation model: at first, the nonlinear SE is done on the condition of taking the state variable measured or calculated by PMU as the state variable of nodes, then the linear SE is done with both nonlinear SE results and PMU measurements. The model adds little calculation time, but improves the SE equations' convergence speed and estimation precision simultaneously. The double state estimation model is validated by the simulation.



Standards related to Measurement errors

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(Replaced) IEEE Standard VHDL Language Reference Manual

his standard revises and enhances the VHDL language reference manual (LRM) by including a standard C language interface specification; specifications from previously separate, but related, standards IEEE Std 1164 -1993,1 IEEE Std 1076.2 -1996, and IEEE Std 1076.3-1997; and general language enhancements in the areas of design and verification of electronic systems.


IEEE Recommended Practice for Measurements and Computations of Radio Frequency Electromagnetic Fields With Respect to Human Exposure to Such Fields, 100 kHz-300 GHz

Revise and develop specifications for preferred methods for measuring and computing external radiofrequency electromagnetic fields to which persons may be exposed. In addition, the document will specify preferred methods for the measurement and computation of the resulting fields and currents that are induced in bodies of humans exposed to these fields over the frequency range of 100 kHz to 300 ...


IEEE Recommended Practice for Testing and Startup Procedures for Electric Heat Tracing Systems for Power Generating Stations


IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...



Jobs related to Measurement errors

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