Conferences related to Cooling

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


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Periodicals related to Cooling

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Cooling

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Xplore Articles related to Cooling

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Direct liquid cooling of a stacked multichip module

4th Electronics Packaging Technology Conference, 2002., 2002

With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and ...


IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

IEEE PC57.93/D1.8, October 2018, 2018

This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made ...


IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

PC57.93/D1.7, February 2018, 2018

This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made ...


IEEE Draft Standard Requirements, Terminology, and Test Code for Shunt Reactors Rated Over 500 kVA

IEEE PC57.21/D4.2, February 2019, 2019

All liquid-immersed or dry-type, single-phase or three-phase, outdoor or indoor shunt reactors rated over 500 kVA are covered. Terminology and general requirements are stated, and the basis for rating shunt reactors is set forth. Routine, design, and other tests are described, and methods for performing them are given. Losses and impedance, temperature rise, dielectric tests, and insulation levels are covered. ...


Evaluation of a Liquid Cooling Concept for High Power Processors

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2007

A high performance liquid cooling architecture for high power processors in less than 45 mm height electronics chassis (1U rack space) was proposed and investigated experimentally. A review of several system cooling approaches from CPU to data center was also provided. The present proposed method employs conventional heat pipes to transport local CPU heat to the edge of an electronics ...


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Educational Resources on Cooling

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IEEE-USA E-Books

  • Direct liquid cooling of a stacked multichip module

    With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and the conjugated convection-conduction heat transfer in the cooling structure. The effects of the top clearance, the side clearance, flow rate, heating arrangement on the maximum chip temperature and velocity distribution are presented.

  • IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

    This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made as required for various MVA ratings, voltage ratings, and types of liquid insulation.

  • IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

    This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made as required for various MVA ratings, voltage ratings, and types of liquid insulation.

  • IEEE Draft Standard Requirements, Terminology, and Test Code for Shunt Reactors Rated Over 500 kVA

    All liquid-immersed or dry-type, single-phase or three-phase, outdoor or indoor shunt reactors rated over 500 kVA are covered. Terminology and general requirements are stated, and the basis for rating shunt reactors is set forth. Routine, design, and other tests are described, and methods for performing them are given. Losses and impedance, temperature rise, dielectric tests, and insulation levels are covered. Construction requirements for liquid-immersed reactors and construction and installation requirements for dry-type reactors are presented. This standard also covers thyristor-controlled shunt reactors used in static var compensators.

  • Evaluation of a Liquid Cooling Concept for High Power Processors

    A high performance liquid cooling architecture for high power processors in less than 45 mm height electronics chassis (1U rack space) was proposed and investigated experimentally. A review of several system cooling approaches from CPU to data center was also provided. The present proposed method employs conventional heat pipes to transport local CPU heat to the edge of an electronics module coupled with system liquid cold plates. As coolant from external cooling distribution unit in data center flows through the system cold plates in the rack, CPU heat load is rejected to data center cooling facility. Capable of removing the processor power as high as 450W is demonstrated from a prototype built. Experiments were conducted to characterize the prototype thermal performance between liquid inlet and heat pipe evaporator base. A 25 mm times 25 mm heat block was used to simulate CPU and provide heat source to the heat pipe evaporator base. The impacts of heat transfer rate, flow rate, and liquid inlet temperature were evaluated. The total thermal resistance of below 0.090degC/W was achieved at water flow rate of 1 l/min and heat transfer rate of 450W.

  • Experimental and numerical study on natural convection from upward horizontal rectangular grooved fins

    Natural convection from two-dimensional upward horizontal rectangular grooved fins was studied experimentally and numerically. A Mach-Zehnder interferometer was used in the experiment and the local Nusselt numbers on each surface (outer, left, bottom, and right surfaces) of the grooves were measured quantitatively by analyzing the interferograms. In some cases (grooves of some aspect ratios in low Grashof number), the total heat transfer rate from the grooved surface is even smaller than that from a non-grooved surface though the surface area is greater; care should be practised to avoid such cases. As revealed by the numerical analysis, a secondary recirculation flow is frequently found in the groove. It prevents the main flow from flowing into the groove. When this happens, the heat transfer rate from the inner surfaces is significantly smaller than that from the outer surface. The results have been compressed by the Nu vs. Gr correlations and they give an important guideline for selecting proper aspect ratio and dimensions for upward horizontal grooved fins.

  • IEEE Approved Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

    This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made as required for various MVA ratings, voltage ratings, and types of liquid insulation.

  • Discussion

    None

  • Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

    In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and fabricated, and the compact system is integrated. In line with the fluidic interconnect design and analysis, an experimental process for hydraulic characterization of the integrated cooling system is established. The pressure drops for different fluidic interconnects in this system are measured and compared with the analyzed results.

  • IEEE Draft Guide for Installation and Maintenance of Liquid-Immersed Power Transformers

    This guide provides guidance and recommended practices on the installation and maintenance of liquid-immersed power transformers rated 501 kVA and above with secondary voltages of 1000 V and above. This guide covers the entire range of power transformers, including extra high-voltage (EHV) transformers. This guide does not cover special transformers such as furnace transformers, rectifier transformers, etc. Distinctions are made as required for various MVA ratings, voltage ratings, and types of liquid insulation.



Standards related to Cooling

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IEEE Recommended Practice for Implementation of Unique Identification System in Power Plants and Related Facilities


IEEE Recommended Practice for Installation, Application, Operation, and Maintenance of Dry-Type General Purpose Distribution and Power Transformers


IEEE Standard for Cylindrical-Rotor 50 Hz and 60 Hz Synchronous Generators Rated 10 MVA and Above

The requirements in this standard apply to all 50 Hz and 60 Hz, two-pole and four-pole, cylindrical-rotor synchronous generators driven by steam turbines and/or by combustion gas turbines. The drive may be direct or through a gearbox or other device that permits different speeds for the turbine and the generator. The generators covered by this standard are to have rated ...


IEEE Standard for Metal-Enclosed Bus

This standard covers assemblies of metal-enclosed conductors along with associated interconnections, enclosures, and supporting structures. When switches and disconnecting links are included, they shall conform to this standard. This standard is concerned with performance characteristics of enclosed, rather than open, indoor and outdoor conductor assemblies with rated maximum operating voltages through 38 kV. While this standard does cover 600 volt ...