17,835 resources related to

Electronics Packaging

Top Conferences on Electronics Packaging

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

2022 IEEE International Reliability Physics Symposium (IRPS)

2022 59th ACM/IEEE Design Automation Conference (DAC)

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2022 45th International Spring Seminar on Electronics Technology (ISSE)

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

2022 IEEE Applied Power Electronics Conference and Exposition (APEC)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE CPMT Symposium Japan (ICSJ)

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Global Oceans 2020: Singapore - U.S. Gulf Coast

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

2019 IEEE 23rd International Symposium on Consumer Technologies (ISCT)

2019 IEEE Photonics Conference (IPC)

2018 IEEE Aerospace Conference

SC18: International Conference for High Performance Computing, Networking, Storage and Analysis

2018 9th Annual Power Electronics, Drives Systems and Technologies Conference (PEDSTC)

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

2018 IEEE International Vacuum Electronics Conference (IVEC)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 IEEE International Parallel and Distributed Processing Symposium (IPDPS)

2018 IEEE 36th VLSI Test Symposium (VTS)

2018 IEEE International Conference on Software Architecture (ICSA)

2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

MILCOM 2017 - 2017 IEEE Military Communications Conference (MILCOM)

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2017 Systems and Information Engineering Design Symposium (SIEDS)

2017 19th International Conference on Transparent Optical Networks (ICTON)

2017 International Topical Meeting on Microwave Photonics (MWP)

2017 IEEE International Conference on Robotics and Biomimetics (ROBIO)

2017 24th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

2017 International SoC Design Conference (ISOCC)

2017 IEEE AFRICON

2017 Conference on Lasers and Electro-Optics (CLEO)

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

2017 25th Telecommunication Forum (TELFOR)

2016 8th International Conference on Information Technology in Medicine and Education (ITME)

2016 IEEE International Conference on Semiconductor Electronics (ICSE)

2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting

2016 18th Mediterranean Electrotechnical Conference (MELECON)

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS 2013)

2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

2013 NORCHIP

2013 Workshop on Accelerated Stress Testing & Reliability (ASTR)

2013 International Conference on Mechatronic Sciences, Electric Engineering and Computer (MEC)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2013 Brazilian Power Electronics Conference (COBEP 2013)

2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)

2012 International Symposium on Optomechatronic Technologies (ISOT 2012)

2012 Argentine School of Micro-Nanoelectronics, Technology and Applications (EAMTA)

2011 IEEE 6th International Workshop on Electronic Design, Test and Application (DELTA)

2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)

2008 IEEE Power Electronics Specialists Conference - PESC 2008

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

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Top Videos on Electronics Packaging

Why Join the IEEE Electronics Packaging Society

2020 & 2021 IEEE Electronics Packaging Technology Award- Mitsumasa Koyanagi, Peter Ramm & Chin C. Lee

Welcome to REPP 2021 (Symposium on Reliability of Electronics and Photonics Packaging)

On-Shoring The Next Generation Of Advanced Packaging

$Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction$

Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction

The Future is Heterogeneous Integration: The HI Roadmap 2021 Edition

Chiplet-In-Wafer Technology For The Development Of III-V RF ICs

Cross-Layer ESD Protection Designs: Chips, Packaging and Systems

Advanced Packaging for Silicon Photonics Based Modules and Applications

Package Technology, Design, And Methodology Challenges And Solutions For High Bandwidth Electronic Systems

How the Semiconductor Research Corporation (SRC) is Leading Research in Packaging

REPP: Making Digital Twins Work

IEEE Heterogeneous Integration Roadmap Working Groups: Extended Q&A

Design & Materials Challenges For Cost-Effective High-Performance LEDs

Care Innovations: Responsibility For Being Green

Accelerating Electronics & Photonics Innovation for Revolutionary Microsystems

Analysis of Flexible PCBs: Trace Reinforcement Approach

Workshop at REPP: The IEEE Heterogeneous Integration Roadmap

The Origins of Silicon Valley: Early Technology and EPS

Semiconductor Packaging: The Future Is Now

IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective

21st-Century Nano System for Abundant Data Computing

Infineon Technologies: Power Efficiency from Generation to Consumption

Packaging and Integration Technology in Wide Band-gap Devices based Power Electronics Converters-Video

Growth In Semiconductor Packaging And Assembly: Are We In Another “Roaring 20s”?

Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap

Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap

Advanced Package Technologies and their Reliability Challenges

Working Group Meeting 4: 2021 IEEE Heterogeneous Integration Roadmap

Pt. 2: Electronic & Photonic (Co)Packaging Technologies - Bill Bottoms - Industry Panel 2, IEEE Globecom, 2019

Packaging And Interconnect Technologies For Cryogenic And Quantum Systems

EMC - Li Er-ping - Advanced Electromagnetic Simulation Techniques for Analysis of Signal and Power Integrity in Multilayered Electronic Packaging

Advanced Packaging In Hyperscale Data Center Applications

Sustainable Electronics – From Dumped E-Waste To A Circular Economy: What Is Needed?

APEC 2018 - full live-stream replay

Architectures & Business Aspects of Heterogeneous Integration

HIR Chiplet Workshop: Architectures and Business Aspects for Heterogeneous Integration

Patrizio Vinciarelli, Newell Award: APEC 2019

Wrap-up and Charge to Heterogeneous Integration Roadmap Teams

Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap

Wrap-up & Charge to the Heterogeneous Integration Roadmap Teams

The Future of Microelectronics After the Pandemic

Reimagining Co-design of HPC Systems for a Heterogeneous Future

Thermal Sciences for the Heterogeneous Future

Electromigration Failure of Solder Interconnects under Non-DC Conditions

Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages

The Origins of Silicon Valley: Characteristics of a Startup Environment

Characteristics of Successful Tech Hubs and Start-ups: Lessons from the Origin and Growth of Silicon Valley

A View of the Future of High Performance Computing

Random Failure Reduction: Strategy for Advanced Semiconductor Devices Production

The Evolution of Lead-free Solder Alloys

The Roaring 20s: A Renaissance for the Semiconductor Industry

2011 IEEE Honors: IEEE James H. Mulligan, Jr. Education Medal - Raj Mittra

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Xplore Articles related to Electronics Packaging

**Electronics Packaging** for High Reliable Piezoactuators

Nano Evaluation in **Electronics Packaging**

Graphene-based heat spreading materials for **electronics packaging** applications

A flip-chip power **electronics packaging** technology on a flexible polymeric substrates

Investigations of carbon nanotubes epoxy composites for **electronics packaging**

Study of nanosilver filled conductive adhesives and pastes for **electronics packaging**

Nano Packaging - A challenge for Non-destructive Testing

Experimental Research on Heat Transfer of Confined Air Jet Impingement with Tiny Size Round Nozzle in High Density **Electronics Packaging** Model

Effects of fluid properties on dispensing processes for **electronics packaging**

Nano-scaled functional layers for current and heat transport in **electronics packaging**

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Periodicals related to Electronics Packaging

Advanced Packaging, IEEE Transactions on

Aerospace and Electronic Systems Magazine, IEEE

Antennas and Propagation, IEEE Transactions on

Circuits and Systems II: Express Briefs, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Computer

Consumer Electronics, IEEE Transactions on

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Display Technology, Journal of

Electromagnetic Compatibility, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Geoscience and Remote Sensing Letters, IEEE

Industrial Informatics, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Mechatronics, IEEE/ASME Transactions on

Microelectromechanical Systems, Journal of

Microwave and Wireless Components Letters, IEEE

Microwave Magazine, IEEE

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Power Electronics, IEEE Transactions on

Semiconductor Manufacturing, IEEE Transactions on

Software, IEEE

Solid-State Circuits, IEEE Journal of

Spectrum, IEEE

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Electronics Packaging

Electronics Packaging and Test Fixturing for the 500C Environment

Ultrathin 3D FO‐WLP eWLB‐PoP (Embedded Wafer‐Level Ball Grid Array‐Package‐on‐Package) Technology

Power Electronics Packaging

HighTemperature Electronics Packaging

Oracle 10g Memory Management

Oracle 11g Memory Management

Auto_Tune Features

Protein-protein Interaction Network Alignment: Algorithms and Tools

Protein-To-Protein Interaction DATABASES

Embedded Wafer‐Level Ball Grid Array (eWLB) Packaging Technology Platform

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Courses related to Electronics Packaging

Recent Advances in LDMOS Technology

Software Requirements for the Certified Software Development Associate (CSDA) and IEEE Standards Bundle

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Standards related to Electronics Packaging

(Replaced) IEEE Standard VHDL Language Reference Manual

IEEE Recommended Practices for the Implementation of a Metric Equipment Practice (IEEE Std 1301-1991)

IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

Standard for High Frequency Characterization for Low Temperature Co-Fired Ceramic (LTCC)Materials

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Top Organizations on Electronics Packaging

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Consumer Technology Society

Electromagnetic Compatibility

Electron Devices

Electronic Design Automation, Council on

Geoscience & Remote Sensing

Industrial Electronics

Industry Applications

Instrumentation & Measurement

Magnetics

Member and Geographic Activities

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Power Electronics

Reliability

Robotics & Automation

Signal Processing

Solid State Circuits

Systems, Man & Cybernetics

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Electronics Packaging

Young-Lyong Kim

Cheul-Joong Youn

Jong-Ho Lee

Hyung-Kil Baek

Eun-Chul Ahn

Young-Hee Song

Tae-Gyeong Chung

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Electronics Packaging

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Top Conferences on Electronics Packaging

Top Videos on Electronics Packaging

Xplore Articles related to Electronics Packaging

Periodicals related to Electronics Packaging

E-books related to Electronics Packaging

Courses related to Electronics Packaging

Standards related to Electronics Packaging

Top Organizations on Electronics Packaging

Most published Xplore authors for Electronics Packaging