Conferences related to Ic Design

Back to Top

2021 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2006 IEEE International Electron Devices Meeting (IEDM)

  • 2007 IEEE International Electron Devices Meeting (IEDM)

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2017 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.



Periodicals related to Ic Design

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.




Xplore Articles related to Ic Design

Back to Top

A distributed engineering database management system for IC design

Proceedings of the European Conference on Design Automation., 1991

Describes a distributed engineering database subsystem (DDB) which is an integral part of the framework in the PANDA IC-CAD system. DDB provides a simple but efficient method for organizing the IC design data in a distributed environment. With version management and concurrency control services, DDB supports the iterative, tentative and collaborative nature of the design process. A database schema based ...


Analogue IC design within EUROCHIP

IEE Colloquium on Analogue IC Design: Obstacles and Opportunities, 1990

The UK's own very successful ECAD Initiative (Electronics CAD) is now of several years standing and has made general CAD tools and IC design available to some 100 participating HE and FE institutions. This UK scheme, funded on a start-up basis by the (then) UGC (for the universities) and NAB (for the polytechnics and colleges), and with chip fabrication currently ...


IEE Colloquium on 'Analogue IC Design: Obstacles and Opportunities' (Digest No.107)

IEE Colloquium on Analogue IC Design: Obstacles and Opportunities, 1990

None


Experiment Design of IC-Design with Effectiveness Analysis of the Guidance Method

2012 International Conference on Industrial Control and Electronics Engineering, 2012

IC design is one of the most key techniques in electronic information industry. It is an important task for tertiary education to develop high quality IC design experiment with intensive connection to electronic information industry. This paper designed an IC-design experiment which implemented a simple physical design-flow of digital circuit. Therein, effective guidance method, as well as the content quality ...


An all-in-one debugger of 8-bit microcontroller with high transfer speed

2016 International Conference on IC Design and Technology (ICICDT), 2016

An all-in-one debugger for 8-bit microcontrollers is developed, which supports three important modes, namely, boundary scan mode, programming mode, and debugging mode. Its transfer speed is higher than some other protocols. Its interface is based on IEEE Std 1149.1-2001 [1] to simplify hardware connection. The system is implemented and tested successfully on a Field Programmable Gate Array (FPGA).



Educational Resources on Ic Design

Back to Top

IEEE.tv Videos

5G mmW Phased Arrays - Future X Radio Panel Talk - Baljit Singh - Brooklyn 5G Summit 2018
28nm CMOS Wireless Connectivity Combo IC - Chia-Hsin Wu - RFIC Showcase 2018
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
BSIM Spice Model Enables FinFET and UTB IC Design
A High Efficiency 39GHz CMOS Cascode Amplifier for 5G Applications - H.C. Park - RFIC 2019 Showcase
Infineon Technologies: Power Efficiency from Generation to Consumption
Micro-Apps 2013: EM Simulation Tools in Evolution within Circuit Design
WIRELESS TRANSCEIVER SYSTEM DESIGN FOR MODERN COMMUNICATION STANDARDS
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
IEEE PELS Webinar Series-Galvanic Isolation for Power Supply Applications
Flywheel Energy Storage for the 21st Century: APEC 2019
MicroApps: Making the Transition from AWR to Cadence Tools - A More Seamless & Effcient Flow for Mutual IC & PCB Customers (AWR)
A Fully-Integrated SOI CMOS Complex-Impedance Detector for Matching Network Tuning in LTE Power Amplifier: RFIC Interactive Forum
IMS 2011 Microapps - Online Design
mmwave Phased Arrays for 5G Applications - Challenges and Opportunities - Ian Gresham: Brooklyn 5G Summit 2017
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
Sources of Innovation
IMS 2011 Microapps - Power Amplifier Design Utilizing the NVNA and X-Parameters
IMS 2012 Microapps - RF System Design: Moving Beyond a Linear Datasheet
Sang Gyun Kim - RFIC Industry Showcase - IMS 2020

IEEE-USA E-Books

  • A distributed engineering database management system for IC design

    Describes a distributed engineering database subsystem (DDB) which is an integral part of the framework in the PANDA IC-CAD system. DDB provides a simple but efficient method for organizing the IC design data in a distributed environment. With version management and concurrency control services, DDB supports the iterative, tentative and collaborative nature of the design process. A database schema based on the concept of object and how it is used as the foundation for tool integration are also discussed.<<ETX>>

  • Analogue IC design within EUROCHIP

    The UK's own very successful ECAD Initiative (Electronics CAD) is now of several years standing and has made general CAD tools and IC design available to some 100 participating HE and FE institutions. This UK scheme, funded on a start-up basis by the (then) UGC (for the universities) and NAB (for the polytechnics and colleges), and with chip fabrication currently subsidised by the DTI, may in some senses be viewed as having provided a model for the more recent European venture, EUROCHIP, which is described in this paper.<<ETX>>

  • IEE Colloquium on 'Analogue IC Design: Obstacles and Opportunities' (Digest No.107)

    None

  • Experiment Design of IC-Design with Effectiveness Analysis of the Guidance Method

    IC design is one of the most key techniques in electronic information industry. It is an important task for tertiary education to develop high quality IC design experiment with intensive connection to electronic information industry. This paper designed an IC-design experiment which implemented a simple physical design-flow of digital circuit. Therein, effective guidance method, as well as the content quality of the experiment, becomes the key feature of the overall quality of the IC design experiment. Based on the running of the IC design experiment of electronic information and engineering department of Beijing University of Technology, this paper also analysis the effectiveness under different guidance method, and then forwards the method and suggestion to improve the quality of the guidance method of IC design experiment.

  • An all-in-one debugger of 8-bit microcontroller with high transfer speed

    An all-in-one debugger for 8-bit microcontrollers is developed, which supports three important modes, namely, boundary scan mode, programming mode, and debugging mode. Its transfer speed is higher than some other protocols. Its interface is based on IEEE Std 1149.1-2001 [1] to simplify hardware connection. The system is implemented and tested successfully on a Field Programmable Gate Array (FPGA).

  • Enhancing students' understanding for IC design course through online video learning

    This paper features a comprehensive learning for Integrated Circuit (IC) Design course to enhance students' understanding. Learning IC Design require students' to be proficient in Electronic Design Automation (EDA) tools. EDA computerization is a class of programming devices for outlining electronic frameworks, for example, coordinated circuits. The apparatuses are utilized in a plan stream that chip fashioners use to outline and examine whole semiconductor chips. Teaching EDA software requires frequent lab demonstration and always time consuming. It is difficult to be repeated if the students missed it. This will affect students understanding on the next topics and hence affects influence the overall performance. Therefore, the use of video and interactive software tools in teaching and learning is the modern alternative way to let students to appreciate the process involved in practical and excite students' capability to engage in teaching and learning. Significant improvement is shown on the students' performance by comparing before and after implementation of comprehensive EDA learning. The results of the comparative study show the effectiveness of the proposed model. There is significant improvement in terms of the students that scored higher grade and reduction in percentage of students that obtained lower grade for this course.

  • Suggestion of an IC Design Education Method for Understanding Intuitively and Feelingly

    The education programs of IC design and its related fields are conducted mainly at universities, graduate schools and/or technical colleges in Japan. Unfortunately, these programs are still not conducted in Japanese high schools. We suggested an IC design education method for understanding intuitively and feelingly for a high school using the making of the FET model in prior learning and the materials evaluations by EDX in evaluation stage. After the practice, we examined problems with the program using a questionnaire and a hearing survey. We have verified that the program had an overall instructional merit. Fortunately, it was revealed by the evaluation questionnaire of the high school students who took lectures that these practices for IC design were effective for a high school education.

  • Fabless IC design for wireless and optic-fiber communications

    The construction of the RF-part of a wireless transceiver and that of an optic-fiber transceiver are described. The functions of the basic function blocks are briefly introduced. Different technologies for RF-IC and ultrahigh speed IC are compared. Circuit techniques required for these IC design are discussed. The mode of fabless IC design plus foundry IC fabrication is explained. A series ICs realized and tested is shown.

  • Implementation of web-based platform for IC design and project management

    In order to accomplish IC design online and project management, an enhanced unified electronic design automation (EDA) platform based on the WEB (abbreviated as WEB-EDA) is developed. The platform provides the sharing of cross-domain EDA resources via shell mode and desktop mode, IC design and project management. And for the purpose of safeguarding the online design environment, we adopt masquerade intrusion detection module and role-based access control (RBAC) module. WEB-EDA has been used in our laboratory. The experiences with the applications show that the WEB-EDA platform is highly effective and convenient.

  • Virtual Collaborative Environment for Support of Teamwork-based Education of Analog IC Design

    This work presents a virtual collaborative environment for support of teamwork-based education of Integrated Circuit (IC) design. The environment was planned to cope with those issues often observed during the design of such circuits in academic courses as lack of collaboration among students or difficulties to collaborate to, lack of organization and documentation. By providing essential means for collaboration, a case study has revealed these issues are diminished and a clean straight-forward design flow for teamwork- based education is achievable.



Standards related to Ic Design

Back to Top

IEEE Standard for an Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks

ALF shall serve as the data specification language of library elements for design applications used to implement integrated circuits. The range of abstraction shall include from the register-transfer level (RTL) to the physical level. The language shall model behavior, timing, power, signal integrity, physical abstraction and physical implementation rules of library elements.


IEEE Standard for Design and Verification of Low Power Integrated Circuits

This standard establishes a format used to define the low power design intent for electronic systems and electronic intellectual property. The format provides the ability to specify the supply network, switches, isolation, retention and other aspects relevant to power management of an electronic system. The standard defines the relationship between the low power design specification and the logic design specification ...


IEEE Standard for Extensions to Standard Test Interface Language (STIL) (IEEE Std. 1450-1999) for Semiconductor Design Environments

Define structures in STIL to support usage as semiconductor simulation stimulus; including: 1) mapping signal names to equivalent design references, 2) interface between Scan and BIST, and the logic simulation, 3) data types to represent unresolved states in a pattern, 4) parallel or asynchronous pattern execution on different design blocks, and 5) expression-based conditional execution of pattern constructs. Define structures ...


IEEE Standard for Integrated Circuit (IC) Delay and Power Calculation System

Delay and power calculation for integrated circuit design.


IEEE Standard for Standard Delay Format (SDF) for the Electronic Design Process

SDF (Standard Delay Format) is an existing OVI standard for the representation and interpretation of timing data for use at any stage of the electronic design process. The ASCII data in the SDF file is represented in a tool and language independent way and includes path delays, timing constraint values, interconnect delays and high level technology parameters.