Conferences related to Component Reliability

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2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE AUTOTESTCON

AUTOTESTCON is the world’s premier conference that brings together themilitary/aerospace automatic test industry and government/military acquirers and usersto share new technologies, discuss innovative applications, and exhibit products andservices.

  • 2018 IEEE AUTOTESTCON

    AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services

  • 2017 IEEE AUTOTESTCON

    IEEE AUTOTESTCON is also known as the Systems Readiness Technology Conference. This major conference and exposition provides focus on the maintenance aspects of systems readiness and providing Mission Assurance through Advanced ATE (Automatic Test Equpmenrt/Systems). This includes Maintenance Repair & Overhaul as well as factory and development automated test equipment. This conference brings military and aerospace industry principals together to share new concepts, technologies and applications in this essential field of supportability and sustainability. The conference includes a major exhibit of exciting new products from a wide variety of exhibitors, and provides the opportunity to meet with senior military and aerospace leaders to discuss their future needs and expectations and the ways in which we can satisfy those needs.

  • 2016 IEEE AUTOTESTCON

    echnical Interchange Meeting for military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2015 IEEE AUTOTESTCON

    IEEE AUTOTEST is an annual Technical Interchange Meeting sponsored by the Institute of Electrical and Electronic Engineers (IEEE). This event serves to gather the military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2014 IEEE AUTOTEST

    IEEE AUTOTESTCON is the world s only conference that focuses primarily on Automated Test and related technology for military, government and aerospace applications. The conference also has an expanded focus into commercial areas that share a common technical base, including aerospace, vehicle and automotive, and commercial factory test applications. Autotestcon provides a unique opportunity to discuss platform support requirements with all DoD Branches, provides hands-on experience with test equipment, and

  • 2013 IEEE AUTOTESTCON

    Content focused on automatic test systems for US military systems.

  • 2012 IEEE AUTOTESTCON

    Automated Test Systems (ATE) and related technologies such as Test Program Sets for US military and defense equipment

  • 2011 IEEE AUTOTESTCON

    Annual conference of the automatic testing industry.

  • 2010 IEEE AUTOTESTCON

    IEEE AUTOTESTCON, The Support Systems Technology Conference, is the largest conference focused on automatic test systems for military and aerospace systems, and has been held annually since 1965. It features more than 120 quality application-focused papers and 250 Exhibits. Attendance ranges between 650 and 750 registered professionals.

  • 2009 IEEE AUTOTESTCON

    Automated Test, Test Technology, and related Support Systems for Defense Systems.

  • 2008 IEEE AUTOTESTCON

    All theoretical and application aspects for an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. In keeping with our conference theme "Surpassing the Limits-Forging Ahead" our focus will be on new ideas and concepts, unusual testing solutions, and future technologies, e.g. ATE Architectures, Artificial Intelligence in Test, ATE/TPS Development Techniques, ATE/TPS Management, BIT/BIST

  • 2007 IEEE AUTOTESTCON

  • 2006 IEEE AUTOTESTCON

  • 2005 IEEE AUTOTESTCON

  • 2004 IEEE AUTOTESTCON

  • 2003 IEEE AUTOTESTCON

  • 2002 IEEE AUTOTESTCON

  • 2001 IEEE AUTOTESTCON

  • 2000 IEEE AUTOTESTCON

  • AUTOTESTCON '99

  • AUTOTESTCON '98

  • AUTOTESTCON '97

  • AUTOTESTCON '96


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Periodicals related to Component Reliability

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Component Reliability

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Xplore Articles related to Component Reliability

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Impact of data center cooling strategies on component reliability

2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014

In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center operation, there arises a distribution of component temperatures that are sensitive to the specific cooling ...


4×4 Optical data vortex switch fabric: Component reliability analysis

2014 International Conference on Signal Processing and Communications (SPCOM), 2014

In this paper we analyse the component reliability of 4×4 Optical Data Vortex Switch fabric The results are compared with primary Data Vortex and Augmented Data Vortex switches.


Optimizing component reliability in datacenters using predictive models

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015

Prior studies have demonstrated component silicon reliability sensitivity to datacenter cooling strategies that include containment and non-containment cooling with return side setpointing. In this work, the evaluations were compared to supply side setpointing to understand the optimal approach to datacenter cooling. This was accomplished through the development of predictive models of T<sub>inlet</sub> as a function of T<sub>setpoint</sub>. These models were ...


On component reliability and system reliability for automotive applications

2012 IEEE International Integrated Reliability Workshop Final Report, 2012

A new strategy is proposed for automotive system reliability design. Such strategy aims to overcome the discrepancy between single component reliability and system lifetime/performance requirements. While the design for X (DfX, X: reliability, testability, manufacturability, ...) methodology is part of every state-of-the art semiconductor development, it remains that reliability specifications and ppm goals of a products are strongly application and ...


Failure analysis on the sealing glass insulator of semiconductor device with low resistance abnormity

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017

A semiconductor device adopts glass insulators to realize the sealing insulation between metal leads and case. Abnormal low resistance phenomenon between the metal lead and shell take places in several devices after working under normal pressure, temperature and humidity for a certain period. The normal resistance is usually at the level of Megohm, while the abnormal resistance is instable and ...


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Educational Resources on Component Reliability

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IEEE-USA E-Books

  • Impact of data center cooling strategies on component reliability

    In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center operation, there arises a distribution of component temperatures that are sensitive to the specific cooling strategies being used. This paper evaluates the impact of various data center cooling strategies on component reliability focusing on the gate oxide time dependent dielectric breakdown (TDDB) mechanism on a 32nm chipset component.

  • 4×4 Optical data vortex switch fabric: Component reliability analysis

    In this paper we analyse the component reliability of 4×4 Optical Data Vortex Switch fabric The results are compared with primary Data Vortex and Augmented Data Vortex switches.

  • Optimizing component reliability in datacenters using predictive models

    Prior studies have demonstrated component silicon reliability sensitivity to datacenter cooling strategies that include containment and non-containment cooling with return side setpointing. In this work, the evaluations were compared to supply side setpointing to understand the optimal approach to datacenter cooling. This was accomplished through the development of predictive models of T<sub>inlet</sub> as a function of T<sub>setpoint</sub>. These models were subsequently used for tradeoff analyses to quantitatively evaluate possible ways to leveraging of the improved reliability. Specifically, to reduce data center costs and/or improve performance. Performance tradeoff estimates were based on experimental lab data.

  • On component reliability and system reliability for automotive applications

    A new strategy is proposed for automotive system reliability design. Such strategy aims to overcome the discrepancy between single component reliability and system lifetime/performance requirements. While the design for X (DfX, X: reliability, testability, manufacturability, ...) methodology is part of every state-of-the art semiconductor development, it remains that reliability specifications and ppm goals of a products are strongly application and sector specific. It is therefore especially necessary to understand the aging behavior of system-integrated components, each of which must work beyond their foreseen lifetime targets, as well as to understand the effect of steady-state and varying failure rates on system performance. We propose to extend component failure rate assessment based on the regular useful life phase (exponential distributions) by also including early and wear out phase completely with corresponding Weibull distributions with their scale parameters dependent on competing dominant modes in these regimes. By doing so, the system design and verification cycle can be shortened and further improved, saving both time and costs.

  • Failure analysis on the sealing glass insulator of semiconductor device with low resistance abnormity

    A semiconductor device adopts glass insulators to realize the sealing insulation between metal leads and case. Abnormal low resistance phenomenon between the metal lead and shell take places in several devices after working under normal pressure, temperature and humidity for a certain period. The normal resistance is usually at the level of Megohm, while the abnormal resistance is instable and from one hundred ohm to several Kilohm only. Fluorescent dye method can demonstrates the micro cracks on the glass insulator surface which cannot be observed by optical microscope or scanning electron microscope. According to the results of series of tests, micro cracks may absorb the moisture in the environment by capillary action, leading the sodium and potassium ion in glass getting free. Such free ions are ranged in order when applying the electric field, which consequently forms different and unstable low resistance paths leading to the failure.

  • Failure analysis on the solder points cracking of CBGA package

    The solder points cracking of a component with package of ceramic ball grid array (CBGA) type is studied in the paper. The cracking cause is found and the failure mechanism is clarified. The weakness of the package structure design is demonstrated by comparing the experiment results of two kinds of components, which provides guidance for the reliable design and application.

  • The reliability approaches and requirements for IC component in telecom system

    Telecom system and its reliability are introduced. Approaches in telecom equipment design and manufacture are summarized, such as IC supplier process management, incoming quality control, failure rate and wear-out lifetime evaluation, equipment process online monitor, reliability burn-in and screening, field failure analysis and improvement and so on. Telecom equipment becomes more complicated and integrated and brings engineering challenges to board design with IC component suffering high electrical, temperature and mechanical stress. Flexible and low cost engineering approaches introduced and requirements for IC industry proposed.

  • Reliability of a large consecutive-k-out-of-r-from-n:F system with unequal component-reliability

    For a consecutive-k-out-of-r-from-n:F system with unequal component reliability: (1) upper and lower reliability bounds are obtained; and (2) a limit formula and a life distribution for the reliability of a large system are derived under certain conditions. Many previous results on the reliability of the consecutive-k-out-of-n:F system are special cases of this paper.<<ETX>>

  • Bayes estimation of component-reliability from masked system-life data

    This paper estimates component reliability from masked series-system life data, viz, data where the exact component causing system failure might be unknown. It focuses on a Bayes approach which considers prior information on the component reliabilities. In most practical settings, prior engineering knowledge on component reliabilities is extensive. Engineers routinely use prior knowledge and judgment in a variety of ways. The Bayes methodology proposed here provides a formal, realistic means of incorporating such subjective knowledge into the estimation process. In the event that little prior knowledge is available, conservative or even noninformative priors, can be selected. The model is illustrated for a 2-component series system of exponential components. In particular it uses discrete-step priors because of their ease of development and interpretation. By taking advantage of the prior information, the Bayes point-estimates consistently perform well, i.e., are close to the MLE. While the approach is computationally intensive, the calculations can be easily computerized.

  • Update on optical component reliability and testing requirements

    Optical component reliability, as underway in international standards, is reviewed. In optical communications, the reliability functions of fiber and optoelectronic semiconductor transceivers, has been extensively studied and modeled for some time. The mechanisms causing failure for these are relatively well known. The mechanisms in other items such as passive optical components, optical amplifiers, or dynamic components (that are optically passive but electrically active) are not nearly as well understood.



Standards related to Component Reliability

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Guide for Developing and Assessing Reliability Predictions Based on IEEE Standard 1413

The scope of this document is to provide guidance for conducting and assessing reliability predictions (techniques and methods) for electronic products and systems.


IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


IEEE Guide for the Application of Thyristor Surge Protective Devices

This Guide is intended to complement the IEEE Standard Test Specification for Thyristor Diode Surge Protective Devices (ANSI/IEEE C62.37-1996) The definitions used are the same. This publication contains information on basic function and component description, general terms and definitions, electrical environment, comparative SPD technologies, parameter interpretation and application, example designs.


IEEE Standard Methodology for Reliability Predictions and Assessment for Electronic Systems Equipment

A standardized medium for developing reliability predictions of electronic systems and equipment.


Standard Framework for Reliability Prediction of Hardware

This standard provides the framework for performing and reporting reliability predictions. It applies to hardware products including electronic, electrical and mechanical devices and assemblies.



Jobs related to Component Reliability

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