Conferences related to 3d-integration Packaging Technologies

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


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Periodicals related to 3d-integration Packaging Technologies

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Circuits and Systems Magazine, IEEE


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for 3d-integration Packaging Technologies

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Xplore Articles related to 3d-integration Packaging Technologies

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Large area mold embedding technology with PCB based redistribution

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the ...


From wafer level to panel level mold embedding

2013 IEEE 63rd Electronic Components and Technology Conference, 2013

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. Mold embedding is currently ...



Educational Resources on 3d-integration Packaging Technologies

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IEEE.tv Videos

APEC 2015: 3D Packaging
KeyTalks: 3D Packaging of Power Products
3D Power Packaging Made Real with Embedded Component and Substrate Technologies - P.M. Raj, APEC 2018
Q&A with Mustafa Badaroglu: IEEE Rebooting Computing Podcast, Episode 21
IRDS: More Moore Outbrief - Mustafa Badaroglu at INC 2019
APEC 2018 - full live-stream replay
3D Printing for Sensor Platform Integration - Benjamin Ingis - IEEE EMBS at NIH, 2019
Advanced Packaging and Energy as Integration to Reboot Computing: IEEE Rebooting Computing 2017
Levente Klein: Drone-based Reconstruction for 3D Geospatial Data Processing: WF-IoT 2016
Why Join the IEEE Electronics Packaging Society
Infineon Technologies: Power Efficiency from Generation to Consumption
Merge Network for a Non-Von Neumann Accumulate Accelerator in a 3D Chip - Anirudh Jain - ICRC 2018
Heterogeneous Photonic Packaging - John Osenbach - IPC 2018
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing
The Evolution and Future of RF Silicon Technologies for THz Applications
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
IMS 2015: Inkjet-Printed Nanotechnology-Enabled Zero-Power Wireless Sensor Nodes for Smart Skin Applications
Technology for Health Summit 2017 - Welcome & Summit Opening
New Paradigm for Fault-Tolerant Computing with Interconnect Crosstalks - Naveen Kumar Macha - ICRC 2018
IEEE 3D Standards-Based Medical Applications and 3D Printing: Young Lae Moon

IEEE-USA E-Books

  • Large area mold embedding technology with PCB based redistribution

    The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the potential of advanced compression molding processes for multi chip embedding in combination with large area and low cost redistribution technology derived from printed circuit board manufacturing. PCB based redistribution offers the potential of real large area redistribution up to 610 × 457 mm2and the integration of vias (also through mold vias -TMVs) as both are standard features in PCB manufacturing. The use of compression molding equipment with liquid or granular epoxy molding compounds for the targeted integration process flow is a new technology that has been especially developed to allow large area embedding process for the manufacturing of single chip packages, multi chip packages or even heterogeneous systems on wafer scale, typically in 8" to 12" format. The wiring of the embedded components can be done using PCB manufacturing technologies, i.e. a resin coated copper (RCC) film is laminated over the embedded components and on the wafer backside for double sided redistribution. In a process flow similar to conventional PCB manufacturing μvias and through mold vias are drilled using a UV laser after RCC lamination and are metalized by galvanic Cu process in one step. Conductor lines and pads are formed by Cu etching. Finally, a soldermask and a solderable surface finish are applied - all of them standard PCB processes. If solder depots are necessary, e.g. for BGA packages, those can be applied by solder balling equipment - either by printing or by preform attach. To evaluate the potential of today's encapsulants for large area embedding processes, different liquid and granular molding compounds have been intensively evaluated on their processability, process & material induced die shift and warpage results. A strong focus was put on the process chain: chip placement on a temporary carrier - compression vacuum molding for embedding - RCC lamination - laser drilling processes for μVias & through holes - metallization structuring - module singulation & 3D assembly. The feasibility of the entire process chain is demonstrated by the fabrication of a Ball Grid Array (BGA) type of system package with two embedded dies and through mold vias allowing the stacking of these BGA packages. A demonstrator with two BGAs with embedded components and PCB based redistribution stacked on each other and mounted on a base substrate enabling the electrical connection of the stacked module was generated. Reliability of the manufactured 3D stacks is evaluated by temperature cycling and is analyzed both non-destructively and destructively. In summary this paper describes the potential of wafer level mold embedding technology in combination with PCB based redistribution processes towards a 3D SiP stack. Technological feasibility of the process flow is proven and a reliability characterization shows the applicability to consumer electronics applications at least. The technology described offers a cost effective packaging solution for e.g. future sensor/ASIC systems or processor/memory stacks providing miniaturization and sourcing advantages known from PoP assembly.

  • From wafer level to panel level mold embedding

    The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. Mold embedding is currently done on wafer level, typically with diameters of 8“ to 12”, for future process optimization, PCB technologies offer the potential of real large areas up to 610 × 457 mm2. For mold embedding as e.g. for fan-out wafer level packaging compression molding equipment is used in combination with liquid, granular or sheet epoxy molding compounds, with the boundary condition, that mold processes do need a product specific tool (with defined diameter & thickness). Within this paper the potential of tool-less lamination processes, a standard in PCB manufacturing, is evaluated. Lamination is done in panel format using well- known molding compounds from wafer level compression molding. To evaluate the potential of today's encapsulants for large area embedding processes, different liquid, granular and sheet molding compounds have been intensively evaluated on their processability, on process & material induced die shift and on resulting warpage - all on panel level. Acting as an interconnection layer, PCB based redistribution technologies using lamination of resin coated copper (RCC) films are used. Within the paper, different RCC materials are introduced and discussed concerning their reliability potential based on the available layer thicknesses and thermo-mechanical material properties. The feasibility of the proposed technologies is demonstrated using a two chip package. Dies are embedded in panel size by lamination technologies. Subsequently the wiring is done by lamination of an RCC film over the embedded components and on the panel backside for double sided redistribution. In a process flow also similar to conventional PCB manufacturing μvias to the die pads and through mold vias are drilled using a UV laser and are metalized by Cu-electroplating in one step. This way dies are connected to the front copper layer as well as front to backside of the panel. Conductor lines and pads are formed by Cu etching. Finally, a solder mask and a solderable surface finish are applied. If solder depots are necessary, e.g. for BGA packages, those can be applied by solder balling equipment - either by printing or by preform attach. In summary this paper describes the potential to move from wafer level to panel level mold embedding technology in combination with PCB based redistribution processes. The technology described offers a cost effective packaging solution for e.g. single chip packages as well as for future sensor/ASIC systems or processor/memory stacks in volume production.



Standards related to 3d-integration Packaging Technologies

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