1,652 resources related to

Wafer scale integration

Top Conferences on Wafer scale integration

2021 51st European Microwave Conference (EuMC)

2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 IEEE International Electron Devices Meeting (IEDM)

2022 IEEE International Interconnect Technology Conference (IITC)

2021 IEEE Custom Integrated Circuits Conference (CICC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 IEEE International 3D Systems Integration Conference (3DIC)

2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 Conference on Lasers and Electro-Optics (CLEO)

2021 Symposium on VLSI Technology

2021 IEEE International Ultrasonics Symposium (IUS)

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)

2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 International Conference on IC Design and Technology (ICICDT)

2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC)

2019 Winter Simulation Conference (WSC)

2019 IEEE Aerospace Conference

2019 Joint Conference of the IEEE International Frequency Control Symposium anEuropean Frequency and Time Forum (EFTF/IFC)

2019 Compound Semiconductor Week (CSW)

2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

2019 IEEE SENSORS

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2019 IEEE Photonics Conference (IPC)

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

2018 19th International Symposium on Quality Electronic Design (ISQED)

2018 18th International Workshop on Junction Technology (IWJT)

2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)

2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)

2018 19th International Radar Symposium (IRS)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS)

2018 IEEE International Conference on RFID (RFID)

2018 7th Electronic System-Integration Technology Conference (ESTC)

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2018 IEEE 15th International Conference on Group IV Photonics (GFP)

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

2017 Portland International Conference on Management of Engineering and Technology (PICMET)

2017 75th Device Research Conference (DRC)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)

ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference (ESSCIRC)

2017 IEEE CPMT Symposium Japan (ICSJ)

2017 International Conference on Optical Network Design and Modeling (ONDM)

2016 18th Mediterranean Electrotechnical Conference (MELECON)

2009 2nd International Workshop on Electron Devices and Semiconductor Technology (IEDST)

2009 IEEE International SOC Conference (SOCC)

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Xplore Articles related to Wafer scale integration

Wafer Level Autoclave

The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

Summary Report: Wafer Level Reliability Testing Discussion Group

Statistical error analysis of VLSI architectures: methodology and a case study

Directions in silicon-on-silicon MCMs

Battle management onboard processing for SDI

Approaches for the repair of VLSI/WSI RRAMs by row/column deletion

Distributed syndrome decoding for regular interconnected structures

A system-integrate ULSI chip containing eleven 4 Mb RAMs, six 64 kb SRAMs and an 18 k gate array

A network flow approach to the reconfiguration of VLSI arrays

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Periodicals related to Wafer scale integration

Advanced Packaging, IEEE Transactions on

Circuits and Systems for Video Technology, IEEE Transactions on

Circuits and Systems Magazine, IEEE

Components and Packaging Technologies, IEEE Transactions on

Computer

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Computers, IEEE Transactions on

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Instrumentation & Measurement Magazine, IEEE

Lightwave Technology, Journal of

Microelectromechanical Systems, Journal of

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Pattern Analysis and Machine Intelligence, IEEE Transactions on

Photonics Technology Letters, IEEE

Power Electronics, IEEE Transactions on

Proceedings of the IEEE

Reliability, IEEE Transactions on

Selected Topics in Quantum Electronics, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Solid-State Circuits, IEEE Journal of

Spectrum, IEEE

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Wafer scale integration

Adaptive Patterning and M‐Series for High Density Integration

Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations

Integrated Fan‐Out (InFO) for Mobile Computing

Integrated Fan‐Out (InFO) for High Performance Computing

Enabling Low Temperature Cure Dielectrics for Advanced Wafer‐Level Packaging

NEPES’ Fan‐Out Packaging Technology from Single die, SiP to Panel‐Level Packaging

SWIFT® Semiconductor Packaging Technology

Input/Output Interconnect Networks for Gigascale Systems

Conclusions and Future Trends

Graphene and Atom‐Thick 2D Materials: Device Application Prospects

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Top Organizations on Wafer scale integration

Aerospace & Electronics Systems

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Instrumentation & Measurement

Member and Geographic Activities

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Power Electronics

Reliability

Robotics & Automation

Solid State Circuits

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Wafer scale integration

M. Malek

E.E. Swartzlander

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Wafer scale integration

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Top Conferences on Wafer scale integration

Xplore Articles related to Wafer scale integration

Periodicals related to Wafer scale integration

E-books related to Wafer scale integration

Top Organizations on Wafer scale integration

Most published Xplore authors for Wafer scale integration