2,420 resources related to

Wafer bonding

Top Conferences on Wafer bonding

2022 59th ACM/IEEE Design Automation Conference (DAC)

2022 IEEE International Electron Devices Meeting (IEDM)

2022 IEEE International Interconnect Technology Conference (IITC)

SoutheastCon 2023

2021 International Semiconductor Conference (CAS)

2021 IEEE International 3D Systems Integration Conference (3DIC)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE International Ultrasonics Symposium (IUS)

2021 10th International IEEE/EMBS Conference on Neural Engineering (NER)

2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)

2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2021 IEEE CPMT Symposium Japan (ICSJ)

2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

2020 Optical Fiber Communications Conference and Exhibition (OFC)

2019 IEEE 9th International Nanoelectronics Conferences (INEC)

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2019 IEEE SENSORS

2019 IEEE Photonics Conference (IPC)

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

2018 Conference on Optoelectronic and Microelectronic Materials and Devices (COMMAD)

2018 IEEE International Conference on Information and Automation (ICIA)

2018 23rd Opto-Electronics and Communications Conference (OECC)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 IEEE International Conference on RFID (RFID)

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

2018 International Conference on Optical MEMS and Nanophotonics (OMN)

2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

2017 75th Device Research Conference (DRC)

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

2017 IEEE 26th Asian Test Symposium (ATS)

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

2017 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

2017 IEEE 20th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS)

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM)

2016 IEEE International Conference on Semiconductor Electronics (ICSE)

2016 18th Mediterranean Electrotechnical Conference (MELECON)

2015 8th International Congress on Image and Signal Processing (CISP)

2011 China-Japan Joint Microwave Conference (CJMW)

2010 3rd International Symposium on Systems and Control in Aeronautics and Astronautics (ISSCAA)

2010 6th International Conference on MEMS, NANO, and Smart Systems (ICMENS)

2010 2nd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2008 International Microprocesses and Nanotechnology Conference (MNC)

Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*

2007 1st IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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Xplore Articles related to Wafer bonding

Building In Reliability For Packaging And Assembly

Hybrid silicon wafer-scale packaging technology

A high-speed, low-power 3D-SRAM architecture

A 150-V multiple up-drain VDMOS, CMOS, and bipolar process in 'direct-bonded' silicon on insulator on silicon

Back gated CMOS on SOIAS for dynamic threshold voltage control

Micro-Corrosion of Al-Cu Bonding Pads

Photo-pumped operation of InGaAsP vertical-cavity lasers on Si fabricated by **wafer bonding**

Novel 3-D structures [ICs]

Structure Design and Fabrication of an Area-changed Bulk Micromachined Capacitive Accelerometer

The transport and deformation of blood cells in micro-channel

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Periodicals related to Wafer bonding

Advanced Packaging, IEEE Transactions on

Antennas and Propagation, IEEE Transactions on

Biomedical Engineering, IEEE Transactions on

Design & Test of Computers, IEEE

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Instrumentation and Measurement, IEEE Transactions on

Magnetics, IEEE Transactions on

Microelectromechanical Systems, Journal of

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Proceedings of the IEEE

Quantum Electronics, IEEE Journal of

Selected Topics in Quantum Electronics, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Sensors Journal, IEEE

Solid-State Circuits, IEEE Journal of

Spectrum, IEEE

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Wafer bonding

Temporary Carrier Technologies for eWLB and RDL‐First Fan‐Out Wafer‐Level Packages

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Top Organizations on Wafer bonding

Antennas & Propagation

Circuits & Systems

Components, Packaging & Manufacturing Tech

Computer

Electron Devices

Electronic Design Automation, Council on

Engineering in Medicine & Biology

Industrial Electronics

Instrumentation & Measurement

Magnetics

Member and Geographic Activities

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Reliability

Robotics & Automation

Sensors Council

Solid State Circuits

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Wafer bonding

Q.-Y. Tong

G. Kidao

T.Y. Tan

U. Gosele

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Wafer bonding

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Xplore Articles related to Wafer bonding

Periodicals related to Wafer bonding

E-books related to Wafer bonding

Top Organizations on Wafer bonding

Most published Xplore authors for Wafer bonding