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Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. (Wikipedia.org)
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Top Conferences on Wafer bonding
2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)
2011 China-Japan Joint Microwave Conference (CJMW)
2010 3rd International Symposium on Systems and Control in Aeronautics and Astronautics (ISSCAA)
2010 2nd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
2007 1st IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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Selected Topics in Quantum Electronics, IEEE Journal of
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