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Transfer molding
Transfer molding, like compression molding, is a process where the amount of molding material is measured and inserted before the molding takes place. The molding material is preheated and loaded into a chamber known as the pot. (Wikipedia.org)
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Top Conferences on Transfer molding
2021 IEEE International Conference on Networking, Sensing and Control (ICNSC)
2022 IEEE Sensors
2013 Fifth International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)
2012 Second International Conference on Electric Information and Control Engineering (ICEICE)
2011 3rd International Workshop on Education Technology and Computer Science (ETCS)
2011 National Postgraduate Conference (NPC)
2010 2nd International Conference on Information Technology and Computer Science (ITCS 2010)
2010 2nd International Conference on Mechanical and Electronics Engineering (ICMEE 2010)
2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)
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