272 resources related to

Tin alloys

Top Conferences on Tin alloys

2022 IEEE Applied Power Electronics Conference and Exposition (APEC)

2021 IEEE 21st International Conference on Nanotechnology (NANO)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 20th International Workshop on Junction Technology (IWJT)

2021 IEEE International Reliability Physics Symposium (IRPS)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM)

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2021 IEEE International Electron Devices Meeting (IEDM)

2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)

2021 IEEE International Magnetic Conference (INTERMAG)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2019 IEEE Holm Conference on Electrical Contracts

2018 IEEE Custom Integrated Circuits Conference (CICC)

2018 IEEE 8th International Nanoelectronics Conferences (INEC)

2018 Asia Pacific Magnetic Recording Conference (APMRC)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE Canadian Conference on Electrical & Computer Engineering (CCECE)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2017 IEEE International Conference on Prognostics and Health Management (ICPHM)

2016 11th International Forum on Strategic Technology (IFOST)

2016 9th International Kharkiv Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves (MSMW)

2015 6th Asia Symposium on Quality Electronic Design (ASQED)

2014 8th IEEE International Conference on Software Security and Reliability (SERE)

2014 20th Biennial University/Government/Industry Micro/Nano Symposium (UGIM)

2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2012 2nd International Conference on Remote Sensing, Environment and Transportation Engineering (RSETE)

2011 International Semiconductor Device Research Symposium (ISDRS)

2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems (ELECTRO-2009)

2009 3rd International Conference on Energy and Environment (ICEE)

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

2007 26th International Conference on Thermoelectrics (ICT 2007)

2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (AGEC)

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Xplore Articles related to Tin alloys

Thermoelectric properties of Sb-doping in the TiNiSn1-xSbx half-Heusler system

Titanium Doped ${\hbox {Nb}}_{3}{\hbox {Sn}}$ Superconductor Fabricated by the Internal Tin Tube (ITT) Approach

Possible ways for efficiency improvement of thermoelectric materials

Production of thermoelectric materials by mechanical alloying - extrusion process

The Effect of Boron Implantation of the Sliding Wear and Contact Resistance of Palladium, 60Pd40Ag, and a CuNiSn Alloy

Properties of Ti alloyed multifilamentary Nb3Sn wires by internal tin process

Breakdowns in the Metal-Semimetal BiSb Point Contacts

Thermoelectric properties and transport phenomena in (Bi/sub 1-x/Sb/sub x/)/sub 2/(Te/sub 1-y/Se/sub y/)/sub 3/ quaternary n-type alloys produced by powder metallurgy and extrusion

Corrosion resistant positive grids, novel separators, and negative plate additives for increased VRLA battery life

Electromigration resistance of TiN-layered Ti-doped Al interconnects

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Periodicals related to Tin alloys

Advanced Packaging, IEEE Transactions on

Applied Superconductivity, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Device and Materials Reliability, IEEE Transactions on

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Magnetics, IEEE Transactions on

Microwave Theory and Techniques, IEEE Transactions on

Nanotechnology Magazine, IEEE

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Proceedings of the IEEE

Reliability, IEEE Transactions on

Selected Topics in Quantum Electronics, IEEE Journal of

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E-books related to Tin alloys

Properties and Whisker Formation Behavior of Tin‐Based Alloy Finishes

Mechanically Induced Tin Whiskers

Characterization Techniques for Film Characteristics

A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties

Contact Plating

Compact Reconfigurable Antennas

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Top Organizations on Tin alloys

Communications

Components, Packaging & Manufacturing Tech

Electron Devices

Magnetics

Member and Geographic Activities

Microwave Theory & Techniques

Nanotechnology Council

Nuclear & Plasma Science

Photonics

Reliability

Technical Activities Board

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Most published Xplore authors for Tin alloys

Anna Kadlecová

Iva Králová

Petr Veselý

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Tin alloys

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Top Conferences on Tin alloys

Xplore Articles related to Tin alloys

Periodicals related to Tin alloys

E-books related to Tin alloys

Top Organizations on Tin alloys

Most published Xplore authors for Tin alloys