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62 resources related to
Thermal Shock
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Top Conferences on Thermal Shock
2026 IEEE International Conference on Plasma Science (ICOPS)
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
2021 IEEE Pulsed Power Conference (PPC)
2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
2021 Conference on Lasers and Electro-Optics (CLEO)
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)
2020 IEEE Vehicle Power and Propulsion Conference (VPPC)
2020 IEEE Industry Applications Society Annual Meeting (IAS)
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2019 IEEE Electrical Insulation Conference (EIC)
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
2018 Asia Pacific Magnetic Recording Conference (APMRC)
2018 IEEE International Conference on Semiconductor Electronics (ICSE)
2017 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA)
2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)
2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)
2012 6th International Conference on Bioinformatics and Biomedical Engineering (iCBBE)
2011 IEEE Winter Topicals (WTM)
2007 26th International Conference on Thermoelectrics (ICT 2007)
2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (AGEC)
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Top Videos on Thermal Shock
HALT and TC Reliability of QFN Assemblies with and without Urethane Coating
Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism
Low-Temperature and Fine-Pitch Wafer-to-Wafer Hybrid Bonding using Nanotwinned and Nanocrystalline Copper for Advanced Packaging
Hardware Reliability Qualification Of Robo-Taxi: Environmental Stress And Failure Modes For Autonomous Vehicle Modules/Components
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Xplore Articles related to Thermal Shock
Investigation of the RDL reliability based on RF characterization
The Design and Simulation of Coting's **Thermal Shock** Resistance System
Review of Design Theory of Ceramic Cutting Tools for High Speed Cutting
Enhanced Resistance to Ablation by Infusion and In-Situ Growth of SiC on Graphite Using Polymer Infiltration Pyrolysis
Thermal Expansion Coefficient of Garnet and Bixbyite Laser Crystals Evaluated by First Principles Calculation
New developments in accelerated weathering tests for Back-contact modules
Thermocouple Condition Monitoring Using Thermocouple Resistance. Experimental Study
Case Study Application of Cold Peening in Combination with Thermal Stress Relieving as Effective Method for Straightening Large Turbine Rotor
Comparison of Gold-Plated PCB Finishes
Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under **Thermal Shock** and Random Vibration
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E-books related to Thermal Shock
Ultra-Thin-all (UTW) Substrate Thermal Shock Durability Study
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Most published Xplore authors for Thermal Shock
Haixiao Dou
Miaomiao Yang
Yanning Chen
Yanbin Qiao
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