3,044 resources related to

Thermal expansion

Top Conferences on Thermal expansion

2022 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

2022 IEEE/PES Transmission and Distribution Conference and Exposition (T&D)

2022 IEEE Sensors

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 IEEE Applied Power Electronics Conference and Exposition (APEC)

2021 33rd Chinese Control and Decision Conference (CCDC)

2021 IEEE Electrical Insulation Conference (EIC)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 IEEE Pulsed Power Conference (PPC)

2021 IEEE International Ultrasonics Symposium (IUS)

2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

2021 IEEE International Conference on Plasma Science (ICOPS)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)

2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)

2021 IEEE International Magnetic Conference (INTERMAG)

2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI)

2020 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)

IGARSS 2020 - 2020 IEEE International Geoscience and Remote Sensing Symposium

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

2019 IEEE 13th International Conference on Power Electronics and Drive Systems (PEDS)

2019 IEEE International Reliability Physics Symposium (IRPS)

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2018 IEEE Aerospace Conference

2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2018 7th Electronic System-Integration Technology Conference (ESTC)

2018 Asia Pacific Magnetic Recording Conference (APMRC)

2018 Northwest Energy System Symposium (NWESS)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE International Telecommunications Energy Conference (INTELEC)

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

2017 19th International Conference on Transparent Optical Networks (ICTON)

2017 Conference on Lasers and Electro-Optics (CLEO)

2017 Iranian Conference on Electrical Engineering (ICEE)

2017 4th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

2016 9th International Conference on Integrated Power Electronics Systems (CIPS)

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference

2015 41st Annual Northeast Biomedical Engineering Conference (NEBEC)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)

2012 2nd International Conference on Electric Technology and Civil Engineering (ICETCE)

2011 International Semiconductor Device Research Symposium (ISDRS)

2010 2nd International Conference on Industrial and Information Systems (IIS 2010)

2008 International Microprocesses and Nanotechnology Conference (MNC)

2007 26th International Conference on Thermoelectrics (ICT 2007)

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Xplore Articles related to Thermal expansion

Pressure dependence of molar volume near the melting point in benzene

Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

Item of interest

An 8b 250MHz A/D converter

Development of a multichannel ultrasonic interferometer for the measurements under high pressures and its application to biomolecular studies

Optimization design for CNC machine spindle system heat-dissipating structure

High performance wavelength-tunable filter based on in-fiber Bragg grating and electrically resistive coating

Creep properties of Sn-rich solder joints

Interconnects and packaging of millimeter wave circuits

Electrical equivalent method for thermal stress analysis

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Periodicals related to Thermal expansion

Advanced Packaging, IEEE Transactions on

Antennas and Propagation, IEEE Transactions on

Applied Superconductivity, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Device and Materials Reliability, IEEE Transactions on

Dielectrics and Electrical Insulation, IEEE Transactions on

Display Technology, Journal of

Electrical Insulation Magazine, IEEE

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Instrumentation and Measurement, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Mechatronics, IEEE/ASME Transactions on

Microelectromechanical Systems, Journal of

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Plasma Science, IEEE Transactions on

Power and Energy Magazine, IEEE

Power Systems, IEEE Transactions on

Proceedings of the IEEE

Quantum Electronics, IEEE Journal of

Selected Topics in Quantum Electronics, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Sensors Journal, IEEE

Systems, Man, and Cybernetics, Part C: Applications and Reviews, IEEE Transactions on

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

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E-books related to Thermal expansion

Thermal Detectors: Mechanisms, Operation, and Performance

Approaches of Modeling and Simulation of Stresses in S Finishes

STATOR INSPECTION

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Standards related to Thermal expansion

Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

IEEE Recommended Practice for Electric Power Systems in Commercial Buildings

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Top Organizations on Thermal expansion

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Dielectrics & Electrical Insulation

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Industry Applications

Instrumentation & Measurement

Magnetics

Member and Geographic Activities

Microwave Theory & Techniques

Nanotechnology Council

Nuclear & Plasma Science

Photonics

Power & Energy

Reliability

Robotics & Automation

Sensors Council

Solid State Circuits

Standards Board

Systems, Man & Cybernetics

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Thermal expansion

Ming Ji

Nong Zhang

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Thermal expansion

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Top Conferences on Thermal expansion

Top Videos on Thermal expansion

Xplore Articles related to Thermal expansion

Periodicals related to Thermal expansion

E-books related to Thermal expansion

Standards related to Thermal expansion

Top Organizations on Thermal expansion

Most published Xplore authors for Thermal expansion