76 resources related to

Nonconductive adhesives

Top Conferences on Nonconductive adhesives

2022 IEEE 22nd International Conference on Nanotechnology (NANO)

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2022 IEEE 17th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2022 45th International Spring Seminar on Electronics Technology (ISSE)

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

2021 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE 17th International Conference on Wearable and Implantable Body Sensor Networks (BSN)

2021 IEEE CPMT Symposium Japan (ICSJ)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2018 Northwest Energy System Symposium (NWESS)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2009 IEEE International Conference on Portable Information Devices (PORTABLE)

Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

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Xplore Articles related to Nonconductive adhesives

Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

Photo-patternable non-conductive adhesives (NCAs) for electronic packaging applications

High reliable non-conductive adhesives for flip chip CSP applications

Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology

Flip-chip on flex for 3D packaging

Characterization of Fast Cure Anisotropic Conductive and Non-Conductive Adhesives

High-Speed Experimental Results for an Adhesive-Bonded Superconducting Multi- Chip Module

Influence of bump geometry, adhesives and pad finishings on the joint resistance of Au bump and A/NCA flip chip interconnection

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Periodicals related to Nonconductive adhesives

Advanced Packaging, IEEE Transactions on

Applied Superconductivity, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Device and Materials Reliability, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Microelectromechanical Systems, Journal of

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Top Organizations on Nonconductive adhesives

Communications

Components, Packaging & Manufacturing Tech

Electron Devices

Industrial Electronics

Member and Geographic Activities

Photonics

Reliability

Robotics & Automation

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Most published Xplore authors for Nonconductive adhesives

Woon-Seong Kwon

Kyung-Woon Jang

Kyung-Wook Paik

Myung-Jin Yim

Jin-Sang Hwang

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Nonconductive adhesives

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Top Conferences on Nonconductive adhesives

Xplore Articles related to Nonconductive adhesives

Periodicals related to Nonconductive adhesives

Top Organizations on Nonconductive adhesives

Most published Xplore authors for Nonconductive adhesives