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1,449 resources related to
Intermetallic
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Top Conferences on Intermetallic
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM)
2026 IEEE International Conference on Plasma Science (ICOPS)
2022 45th International Spring Seminar on Electronics Technology (ISSE)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
2021 29th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
2019 IEEE International Reliability Physics Symposium (IRPS)
2019 IEEE Industry Applications Society Annual Meeting
2018 IEEE 8th International Nanoelectronics Conferences (INEC)
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)
2017 30th International Vacuum Nanoelectronics Conference (IVNC)
2017 IEEE International Conference on Prognostics and Health Management (ICPHM)
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)
2016 9th International Conference on Integrated Power Electronics Systems (CIPS)
2016 11th International Forum on Strategic Technology (IFOST)
2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)
2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)
2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)
2007 26th International Conference on Thermoelectrics (ICT 2007)
2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (AGEC)
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Top Videos on Intermetallic
Tutorial: Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations
Simulations of Reliability Issues in Microelectronic Packages
Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the Microbump in 3D IC
Electromigration and Thermomigration Behavior of Cu Microbumps in Stacked Die Assembly
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Xplore Articles related to Intermetallic
Secondary breakdown and hot spots in power transistors
Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
The correlation between the mechanical and electrochemical properties of solder joints
Phase transformation at high temperature and coercivity of Sm(Co,Cu,Fe,Zr)7-9 magnet alloys
New Ti-Sn **Intermetallic** Compound and $({\hbox {Nb}},{\hbox {Ti}})_{3}{\hbox {Sn}}$ Conductor
First-principles Investigation of the Structural and Electronic Properties of Cu Based **Intermetallic**s
Origin Of Strong Intrinsic Kerr Effect In FePt And FePd Ordered Compounds
Characterization of microstructure and properties of nanostructured Fe-Al/WC **intermetallic** composite coating deposited by cold spraying
Reliability of interfaces for lead-free solder bumps
Synthesis of coatings based on **intermetallic** titanium-aluminum by vacuum arc deposition
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Periodicals related to Intermetallic
Advanced Packaging, IEEE Transactions on
Applied Superconductivity, IEEE Transactions on
Components and Packaging Technologies, IEEE Transactions on
Device and Materials Reliability, IEEE Transactions on
Electron Device Letters, IEEE
Electron Devices, IEEE Transactions on
Electronics Packaging Manufacturing, IEEE Transactions on
Magnetics, IEEE Transactions on
Microelectromechanical Systems, Journal of
Microwave Theory and Techniques, IEEE Transactions on
Nanotechnology Magazine, IEEE
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E-books related to Intermetallic
Intermetallic Compounds and Ferrites
MBE Growth of Ge‐Based Diluted Magnetic Semiconductors
Major Driving Forces and Growth Mechanisms for Tin Whiskers
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Top Organizations on Intermetallic
Communications
Components, Packaging & Manufacturing Tech
Electron Devices
Industrial Electronics
Magnetics
Member and Geographic Activities
Microwave Theory & Techniques
Nanotechnology Council
Photonics
Reliability
Robotics & Automation
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Most published Xplore authors for Intermetallic
Fumihiro Inoue
Jaber Derakhshandeh
Carine Gerets
Eric Beyne
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