12,966 resources related to

Electronic Packaging

Top Conferences on Electronic Packaging

2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

2022 59th ACM/IEEE Design Automation Conference (DAC)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE CPMT Symposium Japan (ICSJ)

Global Oceans 2020: Singapore - U.S. Gulf Coast

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

2019 IEEE Photonics Conference (IPC)

2018 IEEE Aerospace Conference

SC18: International Conference for High Performance Computing, Networking, Storage and Analysis

2018 9th Annual Power Electronics, Drives Systems and Technologies Conference (PEDSTC)

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 IEEE 18th International Power Electronics and Motion Control Conference (PEMC)

2018 IEEE International Vacuum Electronics Conference (IVEC)

2018 IEEE International Parallel and Distributed Processing Symposium (IPDPS)

2018 IEEE 36th VLSI Test Symposium (VTS)

2018 IEEE International Conference on Software Architecture (ICSA)

2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

MILCOM 2017 - 2017 IEEE Military Communications Conference (MILCOM)

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2017 Systems and Information Engineering Design Symposium (SIEDS)

2017 19th International Conference on Transparent Optical Networks (ICTON)

2017 International Topical Meeting on Microwave Photonics (MWP)

2017 IEEE International Conference on Robotics and Biomimetics (ROBIO)

2017 24th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

2017 Conference on Lasers and Electro-Optics (CLEO)

2017 International SoC Design Conference (ISOCC)

2017 IEEE AFRICON

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

2017 25th Telecommunication Forum (TELFOR)

2016 8th International Conference on Information Technology in Medicine and Education (ITME)

2016 IEEE International Conference on Semiconductor Electronics (ICSE)

2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting

2016 18th Mediterranean Electrotechnical Conference (MELECON)

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

2013 International Conference on Mechatronic Sciences, Electric Engineering and Computer (MEC)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2012 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)

2012 IEEE International Interconnect Technology Conference - IITC

2011 IEEE 6th International Workshop on Electronic Design, Test and Application (DELTA)

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Top Videos on Electronic Packaging

Interconnect Materials in Electronic Packaging

Advanced Electromagnetic Simulation Techniques for Analysis of Signal and Power Integrity in Multilayered Electronic Packaging Video

2020 & 2021 IEEE Electronics Packaging Technology Award- Mitsumasa Koyanagi, Peter Ramm & Chin C. Lee

Package Technology, Design, And Methodology Challenges And Solutions For High Bandwidth Electronic Systems

Additive Manufacturing Technologies for Custom-made Electronic Packaging -– Processes and Reliability

Advanced Packaging for Silicon Photonics Based Modules and Applications

Accelerated Testing and Design for Reliability in Electronic and Photonic Packaging Engineering

Care Innovations: Responsibility For Being Green

Pt. 2: Electronic & Photonic (Co)Packaging Technologies - Bill Bottoms - Industry Panel 2, IEEE Globecom, 2019

The Future is Heterogeneous Integration: The HI Roadmap 2021 Edition

Integrated Photonics, Heterogeneous Integration, and AIM Photonics Prototyping

EMC - Li Er-ping - Advanced Electromagnetic Simulation Techniques for Analysis of Signal and Power Integrity in Multilayered Electronic Packaging

Heterogeneous Integration: Packaging Opportunities and Challenges – A Reliability Perspective

Electrical Design Of Advanced Packaging In Computing Systems

Flexing, Bending And Stretching Toward Advances In Electronics For Medical And Industrial Applications

Interconnect Reliability: From the Chip to the System

Thermal and Failure Analysis of Advanced Microelectronic Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages

Sustainable Electronics – From Dumped E-Waste To A Circular Economy: What Is Needed?

A Study of Thermal Analysis Modeling Method for Press-pack IGBT Modules Considering Contact Surface Damage

Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism

Reliability Outlook and Challenges for Monolithic SiPh Applications in Foundary Viewpoint

Patrizio Vinciarelli, Newell Award: APEC 2019

Advanced Methodology for Assessing CPI-Induced Stress Effects on Chip Performance and Reliability

2011 IEEE Honors: IEEE James H. Mulligan, Jr. Education Medal - Raj Mittra

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Xplore Articles related to Electronic Packaging

Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates

Improving the thermal conductivity of epoxy resins with mesogenic units for **electronic packaging**

The effects of graphene-based films as heat spreaders for thermal management in **electronic packaging**

Study on Preparation of SiC Preform for **Electronic Packaging** Material

Simulation Calculation of Mechanical Performance of Particle Filled **Electronic Packaging** Polymer

Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

Study on microstructure and properties of Al/SiCp **electronic packaging** materials embedded metal components

Solder Preforms Composed of High Cu-content Sn-xCu Alloys for Power **Electronic Packaging** and Characterization of the Processing Performance and Joint's Properties

Aluminum coated spherical particles filled paraffin wax as a phase-change thermal interface materials

Preparation of Metallic Materials for **Electronic Packaging** Based on Space Environment

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Periodicals related to Electronic Packaging

Advanced Packaging, IEEE Transactions on

Aerospace and Electronic Systems Magazine, IEEE

Antennas and Propagation, IEEE Transactions on

Circuits and Systems II: Express Briefs, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Computer

Consumer Electronics, IEEE Transactions on

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Display Technology, Journal of

Electromagnetic Compatibility, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Geoscience and Remote Sensing Letters, IEEE

Industrial Informatics, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Mechatronics, IEEE/ASME Transactions on

Microelectromechanical Systems, Journal of

Microwave Magazine, IEEE

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Power Electronics, IEEE Transactions on

Semiconductor Manufacturing, IEEE Transactions on

Software, IEEE

Solid-State Circuits, IEEE Journal of

Spectrum, IEEE

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Electronic Packaging

Microwave and Millimeter-Wave Electronic Packaging

Analytical Techniques for Materials Characterization

Contributors

About the Editor

Frontmatter

Acronyms

Electrical Design Considerations

Ceramic Substrates

ComputerAided Engineering and Design

Processing Technologies

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Courses related to Electronic Packaging

High Level Thermal Estimation Flow

(CSDA) Software Maintenance

Fighting Against Counterfeit Drugs with Sproxil

(CSDP) Engineering Foundations

(CSDP) Software Construction, Methods and Tools

Software Engineering Process and IEEE Standards Bundle

Software Requirements for the Certified Software Development Associate (CSDA) and IEEE Standards Bundle

Software Engineering Process for the Certified Software Development Associate (CSDA) and IEEE Standards Bundle

Software Quality for the Certified Software Development Associate (CSDA) and IEEE Standards Bundle

Software Configuration Management and IEEE Standards Bundle

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Standards related to Electronic Packaging

(Replaced) IEEE Standard VHDL Language Reference Manual

IEEE Recommended Practices for the Implementation of a Metric Equipment Practice (IEEE Std 1301-1991)

IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

Standard for High Frequency Characterization for Low Temperature Co-Fired Ceramic (LTCC)Materials

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Top Organizations on Electronic Packaging

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Consumer Technology Society

Electromagnetic Compatibility

Electron Devices

Electronic Design Automation, Council on

Geoscience & Remote Sensing

Industrial Electronics

Industry Applications

Instrumentation & Measurement

Magnetics

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Power Electronics

Reliability

Robotics & Automation

Solid State Circuits

Systems, Man & Cybernetics

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Electronic Packaging

Wang Kaikun

Wang Lei

Wang Lu

Wang Yuzhi

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Electronic Packaging

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Related topics

Top Conferences on Electronic Packaging

Top Videos on Electronic Packaging

Xplore Articles related to Electronic Packaging

Periodicals related to Electronic Packaging

E-books related to Electronic Packaging

Courses related to Electronic Packaging

Standards related to Electronic Packaging

Top Organizations on Electronic Packaging

Most published Xplore authors for Electronic Packaging