Conferences related to Young's modulus

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


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Periodicals related to Young's modulus

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


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Most published Xplore authors for Young's modulus

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Xplore Articles related to Young's modulus

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A longitudinal feasibility study on AAA growth vs. ultrasound elastography

2014 IEEE International Ultrasonics Symposium, 2014

To improve risk stratification of abdominal aortic aneurysms, ultrasound elastography could provide insight in changes in mechanical properties of the aneurysmal wall. In this feasibility study, 2-D US elastography was performed in AAA patients in a longitudinal study. Several patients with non-growing, slow growing and fast growing AAAs were imaged using 2D ultrasound. The RF- data were processed to estimate ...


A laser tunable piezoelectric energy harvester

2015 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2015

In this study, a tunable piezoelectric energy harvester manipulated by the light-activated shape memory polymer (LaSMP) is presented. A laminated cantilever beam consists of an elastic substrate, a light-activated shape memory polymer layer and piezoelectric patches is used as energy harvester. LaSMP layer could change its Young's modulus under the exposure of UV lights and harvester's natural frequency is regulated ...


The effect of electron beam irradiation in presence Of TMPTA as an initiator on tensile properties of linear low density polyethylene/poyl(vinyl alcohol) blends

2011 IEEE Colloquium on Humanities, Science and Engineering, 2011

The effect of electron beam (EB) irradiation on the thermal and tensile properties of unmodified and modified linear low density polyethylene/poly(vinyl alcohol) (LLDPE/PVA) blends with trimethylolpropane triacrylate (TMPTA) were investigated irradiated at 50, 100 and 150 kGy. The LLDPE/PVA blends were prepared by melt mixing. LLDPE/PVA (php/php) blends ratio between 90/10 to 40/60 was studied. The effects of TMPTA on ...


Influence of thermal treatment on mechanical characteristics of Al-Si-Cu thin films evaluated by biaxial tensile testing

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, 2011

In this article, the influence of annealing on the mechanical characteristics of sputtered aluminum-silicon copper (Al-Si-Cu) thin films is described. The in-plane biaxial tensile tester developed by the authors was used for uniaxial and biaxial tensile tests in ambient air. In uniaxial test results, the Young's modulus did not depend on annealing, whereas the yield stress was influenced by annealing. ...


Material and mechanical characterization of PECVD deposited a-SiC:H with H<inf>2</inf> dilution

2014 IEEE 2nd International Conference on Emerging Electronics (ICEE), 2014

In this paper, we report optical and mechanical properties of low temperature plasma enhanced chemical vapor-deposited (PECVD) amorphous hydrogenated silicon carbide (a-SiC:H) thin films. Initial screening of this process using hydrogen-dilution was performed with a two-level, three-parameter design of experiments (DOE) with eight samples. In this process regime, it was determined that the main parameters affecting silicon carbide (SiC) deposition ...


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IEEE-USA E-Books

  • A longitudinal feasibility study on AAA growth vs. ultrasound elastography

    To improve risk stratification of abdominal aortic aneurysms, ultrasound elastography could provide insight in changes in mechanical properties of the aneurysmal wall. In this feasibility study, 2-D US elastography was performed in AAA patients in a longitudinal study. Several patients with non-growing, slow growing and fast growing AAAs were imaged using 2D ultrasound. The RF- data were processed to estimate the mechanical properties, e.g., compliance (C), distensibility (D) and incremental Young's modulus (E<sub>inc</sub>). An improved RF-based tracking algorithm was used to estimate the volume changes over time, assuming rotational symmetry of the aneurysm. The estimated parameters and possible changes were compared between the three groups. Incremental moduli ranging from 1- 8 MPa were found. The distensibility ranged from 2 to 10 MPa<sup>-1</sup>. The relative increase in E<sub>inc</sub> was -10 to 100% for the patients with no growth, 25% -125% for the medium group and 75% to 700% for the patients with fast growth. Distensibility also decreased by a factor 5. The largest increase in stiffness corresponded to the largest increase in diameter. These preliminary findings imply that large changes in mechanical properties occur in the aneurysmal wall in periods of considerable growth. Automated segmentation and higher frame rates might decrease the intra-subject variability. Finally, the inclusion of more patients is required to strengthen the evidence found.

  • A laser tunable piezoelectric energy harvester

    In this study, a tunable piezoelectric energy harvester manipulated by the light-activated shape memory polymer (LaSMP) is presented. A laminated cantilever beam consists of an elastic substrate, a light-activated shape memory polymer layer and piezoelectric patches is used as energy harvester. LaSMP layer could change its Young's modulus under the exposure of UV lights and harvester's natural frequency is regulated through the modulus change function of LaSMP. The tuned natural frequency of the harvester could match the external base excitation frequency and thus to achieve broadband resonance energy harvesting responses. For the first mode, the effective power increases from 1.18×10-4μW to 1.3×10-3μW when the natural frequency changes from 6.12Hz to 5.94Hz. For the second mode, the effective power increases from 0.003μW to 0.0304μW and for the third mode, it increases from 0.0086μW to 0.0879μW.

  • The effect of electron beam irradiation in presence Of TMPTA as an initiator on tensile properties of linear low density polyethylene/poyl(vinyl alcohol) blends

    The effect of electron beam (EB) irradiation on the thermal and tensile properties of unmodified and modified linear low density polyethylene/poly(vinyl alcohol) (LLDPE/PVA) blends with trimethylolpropane triacrylate (TMPTA) were investigated irradiated at 50, 100 and 150 kGy. The LLDPE/PVA blends were prepared by melt mixing. LLDPE/PVA (php/php) blends ratio between 90/10 to 40/60 was studied. The effects of TMPTA on gel content, FTIR and tensile properties of LLDPE/PVA blends were investigated. The results indicated that, the presence of TMPTA increased the tensile properties compared to blends without TMPTA due to more crosslinking formation. The degree of crosslinking was quantified by gel content measurements and verify with FTIR analysis.

  • Influence of thermal treatment on mechanical characteristics of Al-Si-Cu thin films evaluated by biaxial tensile testing

    In this article, the influence of annealing on the mechanical characteristics of sputtered aluminum-silicon copper (Al-Si-Cu) thin films is described. The in-plane biaxial tensile tester developed by the authors was used for uniaxial and biaxial tensile tests in ambient air. In uniaxial test results, the Young's modulus did not depend on annealing, whereas the yield stress was influenced by annealing. However, both the characteristics were not dependent on strain rate. After biaxial tests with various strain rate ratios, yield stresses were determined by using finite element analysis result. The yield locus in non-annealed films was different from that in annealed films. The yield locus for non-annealed and annealed films could be respectively fitted by using Hill equation with different R values, which indicates that annealed films can deform easily to transversal direction. From Auger spectroscopic analyses, Al<sub>2</sub>Cu precipitation was made at grain boundary by annealing. The precipitation played a role as a bond between grains; consequently, transversal strain in annealed films would have become larger.

  • Material and mechanical characterization of PECVD deposited a-SiC:H with H<inf>2</inf> dilution

    In this paper, we report optical and mechanical properties of low temperature plasma enhanced chemical vapor-deposited (PECVD) amorphous hydrogenated silicon carbide (a-SiC:H) thin films. Initial screening of this process using hydrogen-dilution was performed with a two-level, three-parameter design of experiments (DOE) with eight samples. In this process regime, it was determined that the main parameters affecting silicon carbide (SiC) deposition were the RF power and the hydrogen flow rate. Based on the DOE results, a further set of four samples was prepared to modulate deposition rate and stoichiometry. Material characterization of these samples using Fourier transform infrared spectroscopy (FTIR), X-ray photolectron spectroscopy (XPS), surface profilometry and ellipsometry is presented. Further, to determine the mechanical properties, cantilevers were fabricated and characterized using scanning electron microscopy (SEM) and laser Doppler vibrometry (LDV). Based on the resonant frequency measurement and film density, the Young's modulus for the films was determined.

  • Using the Atomic Force Microscopy for nanocomposites local mechanical characterization: Towards the interphase measurement

    The nanocomposite materials development represents a very attractive route to upgrade polymer properties commonly used in electrical insulation systems. It was recently shown that some fundamental insulation features such as breakdown strength, partial discharge resistance, treeing lifetime or space charge accumulation may be significantly modified by using nanocharged materials. The origin of these modifications is often attributed to a nanoscale transition zone between a nanoparticle and surrounding matrix called the interphase. In spite of this importance, one can hardly find quantitative data on the transitional zone properties. In the current study, we show that it is possible to quantitatively evaluate the interphase mechanical properties by using the Peak Force Quantitative Nano-Mechanical (PF QNM) mode of the Atomic Force Microscopy (AFM) on polyimide/hexagonal-boron nitride nanocomposites. Local mechanical results allow the interphase thickness measurement. Experimental results show a perfect correlation with theoretical models.

  • A simple technique to determine the anisotropy of Young's modulus of single crystal silicon using coupled micro-cantilevers

    This paper reports on a simple technique to measure the anisotropy of the Young's modulus of single crystal silicon using a coupled cantilever structure fabricated in the silicon. We demonstrate that it is possible to determine the Young's modulus of five silicon micro-cantilevers, whose orientations range from 30γ to 55γ to the wafer flat, by measuring the resonance frequencies of just one single cantilever of the coupled structure in a “perturbed” and “unperturbed” state. In this work the perturbation of the coupled system was achieved by shortening one of the cantilevers using focused ion beam milling. The resulting Young's modulus values from this experiment agree very well with the theoretical values with a difference of less than 2.5%.

  • Encapsulation processes and materials for advanced package

    As one approach of advanced packaging technologies, high reliability Liquid Mold UnderFill (Liquid MUF) materials and unique process will be presented here. Liquid MUF materials have the features of high adhesion, low CTE and low modulus. It is possible to alleviate the stress of the solder of each device mounted in the package, and they have excellent reliability too. These materials are adjusted the workability depending on the application. Moreover, because of low viscosity, the Liquid MUF material could be mold-underfilled with relatively lower stress to large Flip Chip devices with small gap and narrow pitch compared to the conventional solid materials. As for the processes of the liquid materials, printing, dispensing and compression molding are applicable. In this paper, the printing process, especially vacuum printing encapsulation systems (VPES) and pressure curing systems, will be mainly discussed. In addition, module package structure that achieved by these material and process development will be also explained in detail.

  • A study on young's modulus of electroplated gold cantilevers for MEMS devices

    This paper presents evaluation of the effective Young's modulus of electroplated gold micro-cantilevers. Young's modulus is one of the fundamental parameters to design MEMS (microelectromechanical systems) components. Gold electroplated MEMS structures can be used to develop highly- sensitive MEMS sensors, such as accelerometers. With a resonant frequency method, we evaluate gold-electroplated Ti/Au cantilevers by varying both the length and the width. The experimental results showed that the Young's modulus was dependent on the width, and it was found that the Young's modulus increased with an increase in the width, which would be useful to design MEMS devices.

  • Mechanical Properties of Dy123 Low Porosity Bulk Superconductors at Liquid Nitrogen Temperature

    Mechanical properties of DyBa<sub>2</sub>Cu<sub>3</sub>O<sub>x</sub> (Dy123) single-grain bulks were evaluated at 77 K through bending tests of specimens cut from the bulks. While a Dy123 bulk fabricated in air had pores in the inner region of it, Dy123 bulks fabricated by heating precursors in O<sub>2</sub> atmosphere had few pores. The bending strengths of the porous bulk and the low porosity bulks at 77 K were higher than those at room temperature evaluated in the previous study. Effects of the distributions of pores and Ag particles in the Dy123 bulks on the mechanical properties at 77 K were discussed.



Standards related to Young's modulus

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IEEE Guide for Bus Design in Air Insulated Substations

The information in this design guide is applicable to both rigid bus and strain bus designs for outdoor and indoor,air-insulated, alternating current substations. Ampacity, radio influence, vibration, and electromechanical forces resulting from gravity, wind, fault current, and thermal expansion are considered. Design criteria for conductor and insulator strength calculations are included. This guide does not consider the following: a) The ...



Jobs related to Young's modulus

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