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Conferences related to Yarn

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE/ACM 42nd International Conference on Software Engineering (ICSE)

ICSE is the premier forum for researchers to present and discuss the most recent innovations,trends, outcomes, experiences, and challenges in the field of software engineering. The scopeis broad and includes all original and unpublished results of empirical, conceptual, experimental,and theoretical software engineering research.


IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.


Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


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Periodicals related to Yarn

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Computer Architecture Letters

Rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessors computer systems, computer architecture workload characterization, performance evaluation and simulation techniques, and power-aware computing


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


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Most published Xplore authors for Yarn

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Xplore Articles related to Yarn

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The characteristics and power requirements of spinning frames — II

Electrical Engineering, 1940

THIS PAPER is a continuation of the investigation on the characteristics and power requirements of spinning frames presented at the AIEE North Eastern District meeting, Springfield, Mass., May 3–5, 1939, and published in this volume of AIEE Transactions, pages 1–4 (January section).


Photoelectric weft-straightener control

Electrical Engineering, 1938

THE PROCESS of weaving consists of interlacing spun threads at right angles on a loom, figure 1. In the woven material thus formed, of which cotton cloth is a very common example, the lengthwise threads are designated as the “warp” and the crosswise or filling threads are designated as the “weft,” figure 2.


Marine science project: For sea

OCEANS '85 - Ocean Engineering and the Environment, 1985

There is an identified need for effective, certified and tested curricular materials in the marine sciences. Florentary and secondary students need information about the marine environment in order to prepare them to make ecologically sound decisions regarding the future use of the oceans. Elementary and secondary teachers need the information and the skills necessary to teach the marine sciences.


International Cooperation in Pollution Control in Southeast Asia

OCEANS '87, 1987

None


Linear-selection, core-memory techniques using transistors

1958 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1958

Presents an abstract of the conference paper.


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Educational Resources on Yarn

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IEEE-USA E-Books

  • The characteristics and power requirements of spinning frames — II

    THIS PAPER is a continuation of the investigation on the characteristics and power requirements of spinning frames presented at the AIEE North Eastern District meeting, Springfield, Mass., May 3–5, 1939, and published in this volume of AIEE Transactions, pages 1–4 (January section).

  • Photoelectric weft-straightener control

    THE PROCESS of weaving consists of interlacing spun threads at right angles on a loom, figure 1. In the woven material thus formed, of which cotton cloth is a very common example, the lengthwise threads are designated as the “warp” and the crosswise or filling threads are designated as the “weft,” figure 2.

  • Marine science project: For sea

    There is an identified need for effective, certified and tested curricular materials in the marine sciences. Florentary and secondary students need information about the marine environment in order to prepare them to make ecologically sound decisions regarding the future use of the oceans. Elementary and secondary teachers need the information and the skills necessary to teach the marine sciences.

  • International Cooperation in Pollution Control in Southeast Asia

    None

  • Linear-selection, core-memory techniques using transistors

    Presents an abstract of the conference paper.

  • Parallel Multi-Cue Tracking Based on Particle Filter

    This paper is a new attempt to introduce a "parallel multi-cue" particle filter tracking method. It combines multiple features distribution and multiple thread programming method to facilitate 2D video tracking from a monocular view. The method's benefits lie in its speed, its robustness. Speed is improved by parallel operation of multiple thread which dispose different cues at one time; robustness is implemented by multiple cues. The proposed method is demonstrated on head tracking with a non-stationary camera in unconstrained environments. Result shows it is speedier and robust again background noise such as cluttered background, occlusion, color distracters and illumination change than conventional single thread PF and single thread PF with multi-cue.

  • Invocation chaining: manipulating lightweight objects across heavyweight boundaries

    Invocation batching combines multiple object invocations into a single message; result chaining makes results from one batched invocation available to the other invocations batched with it. Invocation chaining, or the combination of invocation batching with result chaining, is the key to allowing lightweight objects to be manipulated efficiently across heavyweight boundaries, whether between machines, between address spaces, or between user and kernel. By reducing the number of boundary crossings, invocation chaining reduces the total cost of invocation, making it more effective than previous solutions such as asynchronous messaging. This paper describes an initial implementation of invocation chaining.<<ETX>>

  • The distance transform algorithm on a two-processor computer

    This paper contains the description of the implementation of the weighted distance transform for digital image analysis on a two-processor shared memory computer. The computer is a SMP (symmetric multiprocessing) computer and the algorithm is implemented using POSIX threads.

  • Memory latency and thread migration challenges for distributed shared memory systems

    Distributed shared memory systems have received considerable interest since the concept was originally proposed by Kai Li (1986). In such systems networks of workstations can be used to solve computationally intensive problems. Straightforward implementation of DSMs have suffered performance penalties. This has led to various relaxed memory consistency models that offer opportunities for optimizing performance of DSM systems. To further improve the performance and eliminate false sharing, various DSM systems have tried numerous ad hoc techniques (e.g. combining several messages into a single message, permitting multiple writers to the same page). In a majority of these systems, the DSMs have been implemented on top of an existing OS kernel. This in itself has limited the performance as well as flexibility. The authors propose a new multithreaded-architecture for tolerating memory latencies. They also present some challenges to DSM system for supporting the multithreaded programming model and how the new architectures can aid in this regard.

  • Power-Performance Trade-Off of a Dependable Multicore Processor

    As deep submicron technologies are advanced, new challenges, such as power consumption and soft errors, are emerging. A naive technique, which utilizes emerging multicore processors and relies upon thread-level redundancy to detect soft errors, is power hungry. Another technique, which relies upon instruction-level redundancy, diminishes computing performance seriously. This paper investigates trade-off between power and performance of a dependable multicore processor, which is named multiple clustered core processor (MCCP). It is proposed to hybrid thread- and instruction-level redundancy to achieve both large power efficiency and small performance loss. Detailed simulations show that the MCCP exploiting the hybrid technique improves power efficiency in energy-delay product by 13% when it is compared with the one exploiting the naive thread-level technique.



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