Wire drawing

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Wire drawing is a metalworking process used to reduce the cross-section of a wire by pulling the wire through a single, or series of, drawing die(s). There are many applications for wire drawing, including electrical wiring, cables, tension-loaded structural components, springs, paper clips, spokes for wheels, and stringed musical instruments. (Wikipedia.org)






Conferences related to Wire drawing

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions


2019 49th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN)

Promote the exchange of ideas between academia and industry in the field of computer and networks dependability


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Periodicals related to Wire drawing

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Wire drawing

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Xplore Articles related to Wire drawing

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Manufacturing flat coil configurations for stepper motors

Proceedings:Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1995

An increasing number of stepper motor coils are becoming small, thin and rectangular. Many of these can be wound by either fly winding or spindle winding. To aid in selecting a manufacturing process, the spindle winding process for these coils is analyzed, a proposal to improve it is suggested, and the spindle and fly winding processes are compared.


Superconducting properties depending on the processing parameters of Nb/sub 3/Al wires by the clad-chip extrusion method and the rapid-heating, quenching and transformation treatment

IEEE Transactions on Applied Superconductivity, 2004

Superconducting properties depending on the processing parameters of Nb/sub 3/Al wire fabrication are presented. The adopted process consists of the clad- chip extrusion (CCE) method and the rapid-heating, quenching, and transformation (RHQT) treatment. The former (CCE) is a fabrication method for Nb/Al composite wire. It is characterized by the extrusion of thin chips of Nb/Al clad-rolled sheet. The latter (RHQT) ...


Recent Developments in Fixed Resistors

IRE Transactions on Component Parts, 1959

The commoner types of resistor used in electronic apparatus are discussed in terms of recent developments. In most cases developments have been largely progressive improvements without fundamental changes in the component. Some of the more interesting of recently developed types are also considered, these being metal films and metal oxide films and combinations. Their potentialities are outlined. The paper concludes ...


Development of stabilized Nb<inf>3</inf>Sn wire containing a reduced number of filaments

IEEE Transactions on Magnetics, 1981

Progress is reported on the development of production techniques for stabilized Nb3Sn multifilament wire based on reaction of niobium clad NbSn2powder filaments. The superconducting properties - Tcabove 17.9 K and Jc(4.2 K, 14 T) of 2.2 × 109A/m2- are shown to be independent of filament diameter. The requirement of adiabatic stability imposes an upper limit of approximately 900 μm2on the ...


A Preliminary EBSD Study of Microstructures and Microtextures Evolution during Au Stud and Flip-chip Thermosonic Bonding

2006 7th International Conference on Electronic Packaging Technology, 2006

Microstructures and microtextures of the Au bumps after ball bonding and flip- chip bonding were analyzed using electron backscatter diffraction (EBSD) technique. For comparison, the microstructure and texture of gold wire and gold free air ball (FAB) were also examined. It is demonstrated that process parameters, such as bonding power, bonding force and temperature have significant influences on the microstructure ...


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Educational Resources on Wire drawing

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IEEE-USA E-Books

  • Manufacturing flat coil configurations for stepper motors

    An increasing number of stepper motor coils are becoming small, thin and rectangular. Many of these can be wound by either fly winding or spindle winding. To aid in selecting a manufacturing process, the spindle winding process for these coils is analyzed, a proposal to improve it is suggested, and the spindle and fly winding processes are compared.

  • Superconducting properties depending on the processing parameters of Nb/sub 3/Al wires by the clad-chip extrusion method and the rapid-heating, quenching and transformation treatment

    Superconducting properties depending on the processing parameters of Nb/sub 3/Al wire fabrication are presented. The adopted process consists of the clad- chip extrusion (CCE) method and the rapid-heating, quenching, and transformation (RHQT) treatment. The former (CCE) is a fabrication method for Nb/Al composite wire. It is characterized by the extrusion of thin chips of Nb/Al clad-rolled sheet. The latter (RHQT) is a heat-treatment method to transform the CCE-processed Nb/Al composite wire into the Nb/sub 3/Al intermetallic compound. The focused processing parameters are the chemical composition and the thickness of Nb/Al layers in the composite, and the cold working of the bcc supersaturated solid solution Nb(Al)/sub ss/ wire after the rapid-heating and quenching treatment. The results are as follows. A nearly stoichiometric composition of the CCE-processed precursor wire is optimum for enhancing the critical transition temperature T/sub c/ and the critical current density J/sub c/ of the Nb/sub 3/Al wire after the RHQT treatment. The thinner the Nb/Al layers in the CCE-processed wire, the higher the J/sub c/ and T/sub c/ of the RHQT-treated Nb/sub 3/Al wire. The as-quenched Nb(Al)/sub ss/ wire can be drawn to nearly 50% reduction at room temperature. Such cold working of the Nb(Al)/sub ss/ wire before transformation is an effective operation to improve J/sub c/-B property of the transformed Nb/sub 3/Al wire by the following treatment.

  • Recent Developments in Fixed Resistors

    The commoner types of resistor used in electronic apparatus are discussed in terms of recent developments. In most cases developments have been largely progressive improvements without fundamental changes in the component. Some of the more interesting of recently developed types are also considered, these being metal films and metal oxide films and combinations. Their potentialities are outlined. The paper concludes with some account of resistors that are in the process of development and may be available soon. Improvement and development in pyrolytic carbon resistors is foreseen and wider availability and use of metal and metal oxide films are predicted.

  • Development of stabilized Nb<inf>3</inf>Sn wire containing a reduced number of filaments

    Progress is reported on the development of production techniques for stabilized Nb3Sn multifilament wire based on reaction of niobium clad NbSn2powder filaments. The superconducting properties - Tcabove 17.9 K and Jc(4.2 K, 14 T) of 2.2 × 109A/m2- are shown to be independent of filament diameter. The requirement of adiabatic stability imposes an upper limit of approximately 900 μm2on the cross sectional area of Nb3Sn in the filaments. A production sequence based on wire drawing is illustrated by a 0.56 mm 19-filament wire with a Cu/s.c. ratio of 6.0, which has a critical current of 152 A at 4.2 K and 8 T. Development work on a more economic reduction by extrusion is being continued.

  • A Preliminary EBSD Study of Microstructures and Microtextures Evolution during Au Stud and Flip-chip Thermosonic Bonding

    Microstructures and microtextures of the Au bumps after ball bonding and flip- chip bonding were analyzed using electron backscatter diffraction (EBSD) technique. For comparison, the microstructure and texture of gold wire and gold free air ball (FAB) were also examined. It is demonstrated that process parameters, such as bonding power, bonding force and temperature have significant influences on the microstructure and microtextures of the gold bumps. The deformation of the bumps is generally non-uniform. The &lt;111&gt; and &lt;100&gt; structures in gold bumps are the inheritance of the original columnar structure in FAB. In the subsequent flip chip bonding, severed deformation occurs with a typical compression texture of &lt;110&gt;, but not a strong preferred orientation as under the pure compressive loading. The non- uniform deformation behavior, the associated microstructure defects, the texture and their changes of the Au bumps under the vertical force and the horizontal ultrasonic wave applied are, for the first time, presented and discussed

  • A Microprocessor-Based Statistical Analysis Subsystem

    This paper describes a microprocessor-based subsystem which was developed to provide a statistical description of the diameter of an arbitrary length of wire during the drawina or insulation process. The instrument, built around a 4-bit Intel microprocessor, computes the mean and standard deviation of 1000 data samples over a length of wire determined by the setting on a Binary-Coded Decimal (BCD) thumbwheel switch. The sample period may be varied from 2 milliseconds to 10 seconds. The statistical quantities are output on analog channels as well as digital displays. In addition to the statistical computation, the instrument has the option of playing back the data at arbitrary speeds and generatinq histograms of the data samples. The techniques described in this paper can be inexpensively implemented to provide a statistical description of many laboratory or production processes with a minimum of operator intervention.

  • Drawing of Insulated Sodium Conductor

    The preparation of high strength, small diameter sodium wire is discussed. A new production method consisting of simultaneous extrusion of conductor and insulation followed by high speed drawing and annealing of the composite is described. The influence of polyethylene properties and process conditions on the characteristics of the wire is shown. Resistance to damage through crushing is of particular note because the soft conductor does not act as an anvil to cut the insulation. The wire has high tensile strength, especially in the smaller sizes. Permeability to water vapor is a problem but practical means of combating it already are in use in other services. Development of reliable long life connectors is required for future applications.

  • New Fe-Cr-Mo glass-sealable semi-hard magnet alloys for remanent reed contacts

    New, cobalt-free, glass-sealable, semi-hard magnet alloys based on an Fe-Cr-Mo system have been developed as a potential substitution of Co-Fe base alloys such as Type 27 Remendur (49Co-48Fe-3V) in remanent reed contact switch applications.Fe-11\sim15Cr-4\sim5Mo(wt.%) alloys can be processed to exhibit desirable magnetic properties ofBr\sim14-15KG, Br/Bs∼0.9 and Hc\sim25-35Oe. These alloys maintain a sufficient ductility and formability even after a severe wire drawing. Magnetic hardening of the deformed wire is achieved by subsequent low temperature aging heat treatment. The new alloys are easy to process, exhibit a significantly lower value of λs than Remendur, and are glass sealable with the same type of glass used for Remendur. The feasibility of substitution for the high-cobalt and expensive Remendur in remanent reed contact switches has been demonstrated in the laboratory.

  • Metallurgy, fabrication, and superconducting properties of multifilamentary Nb<inf>3</inf>Al composites

    The control of metallurgical structure during fabrication that will improve the superconducting properties of multifilamentary, aluminium-stabilized, Nb3Al composites is described. Composites are fabricated by placing niobium rods in an aluminum matrix, and then drawing to wire. Nb3Al is formed at temperatures exceeding 1800°C for ∼5 s and ordered at 750°C for 48 h. A critical current, Jc(H), in excess of 105A/cm2(F_{p} \sim 7 \times 10^{8}dynes/cm3) at 7 T and a Tcto 18.2 K are obtained. Attempts to improve Jc(H) by controlling the grain size in the Nb3Al diffused layer are discussed. Precipitates, arising from the addition of carbon during Nb3Al layer growth, do not appear to be effective as grain-boundary or flux pinners. When 1% Zr is added to the Nb, the growth of the Nb3Al layer is accelerated, Tcis lowered and Jc(H) is not significantly improved. Jc(H) rapidly decreases with an increase in Nb3Al or (Nb-Zr)3Al layer thickness, d. Jc(H) is independent of d in composites with d ≳ 1.5 μm. In general, the Nb3Al grain size appears comparable to d for d ≤ 1 μm. Significant improvement of Jc(H) for Nb3Al superconducting composites reacted at temperatures above 1800°C (to achieve Tc> 17 K) is achieved only by maintaining the layer thickness well below d ∼ 1.0 μm.

  • Large Barkhausen Effect and Matteucci Effect in Cold-Drawn and Torsion Annealed Amorphous Magnetostrictive Wires

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