Conferences related to Wafer scale integration

Back to Top

2021 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2019 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2017 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

  • 2015 IEEE International Electron Devices Meeting (IEDM)

    the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2014 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2013 IEEE International Electron Devices Meeting (IEDM)

    IEDM is the world s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

  • 2012 IEEE International Electron Devices Meeting (IEDM)

  • 2011 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, Reliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices.

  • 2010 IEEE International Electron Devices Meeting (IEDM)

  • 2009 IEEE International Electron Devices Meeting (IEDM)

    CMOS Devices Technology, Characterization, REliability and Yield, Displays, sensors and displays, memory technology, modeling and simulation, process technology, solid state and nanoelectronic devices

  • 2008 IEEE International Electron Devices Meeting (IEDM)

    Over the last 53 years, the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.

  • 2007 IEEE International Electron Devices Meeting (IEDM)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


More Conferences

Periodicals related to Wafer scale integration

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Circuits and Systems Magazine, IEEE


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


More Periodicals

Most published Xplore authors for Wafer scale integration

Back to Top

Xplore Articles related to Wafer scale integration

Back to Top

Wafer Level Autoclave

International Report on Wafer Level Reliability Workshop, 1992

None


Yield statistics for large area ICs

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

This report will cover an examination of Poisson statistics and their inadequacy to represent defects in large area chips on a wafer. Measurements of defects will be cited and the consequences on redundancy methods will be discussed.


Wafer scale integration

1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1984

With lowering defect densities in LSI fabrication technologies interest in wafer scale integration has revived. The process holds the promise of higher performance, lower cost, and increased packing density, particularly at the system level. However, it is necessary to consider if recent advances are sufficient to outweigh problems in testing, repairability and system configuration, ancl flexibility. To be assessed too ...


The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

International Report on Wafer Level Reliability Workshop, 1992

None


Summary Report: Wafer Level Reliability Testing Discussion Group

International Report on Wafer Level Reliability Workshop, 1992

None


More Xplore Articles

Educational Resources on Wafer scale integration

Back to Top

IEEE.tv Videos

KeyTalk with Ljubisa Stevanovic: From SiC MOSFET Devices to MW-scale Power Converters - APEC 2017
Electrically-Pumped 1.31 μm MQW Lasers by Direct Epitaxy on Wafer-Bonded InP-on-SOI Substrate - Yingtao Hu - Closing Ceremony, IPC 2018
Microfluidic devices for precision biological measurement: Stephen Quake
IMS 2012 Microapps - Performing Accurate Wafer-Level TRL Calibration with Custom Calibration Sets using WinCal
IMS 2012 Microapps - Strengths and Limitations of the SOLR Wafer Level S-Parameter Calibration Technique
2015 IEEE Honors: IEEE-RSE James Clerk Maxwell Medal - Lynn Conway
The Design of Wearable Robots for Lower-Extremity Human Augmentation
Towards a distributed mm-scale chronically-implantable neural interface - IEEE Brain Workshop
Neural Processor Design Enabled by Memristor Technology - Hai Li: 2016 International Conference on Rebooting Computing
ASC-2014 SQUIDs 50th Anniversary: 2 of 6 - John Clarke - The Ubiquitous SQUID
Flywheel Energy Storage for the 21st Century: APEC 2019
Validating Cyber-Physical Energy Systems, Part 1: IECON 2018
Validating Cyber-Physical Energy Systems, Part 4: IECON 2018
Validating Cyber-Physical Energy Systems, Part 3: IECON 2018
Robotics History: Narratives and Networks Oral Histories:Herman Bruyninckx
Heterogeneous Integration Roadmap
Fast Scale Prototyping for Folded Millirobots
Large Scale Data Mining Using Genetics-Based Machine Learning 3
Validating Cyber-Physical Energy Systems, Part 2: IECON 2018
Grid Integration Systems and Mobility with Keynote Sila Kiliccote - IEEE WIE ILC 2017

IEEE-USA E-Books

  • Wafer Level Autoclave

    None

  • Yield statistics for large area ICs

    This report will cover an examination of Poisson statistics and their inadequacy to represent defects in large area chips on a wafer. Measurements of defects will be cited and the consequences on redundancy methods will be discussed.

  • Wafer scale integration

    With lowering defect densities in LSI fabrication technologies interest in wafer scale integration has revived. The process holds the promise of higher performance, lower cost, and increased packing density, particularly at the system level. However, it is necessary to consider if recent advances are sufficient to outweigh problems in testing, repairability and system configuration, ancl flexibility. To be assessed too are the problems that limited early implementations in the 60s and if they can be overcome; and if wafer scale integration will provide new opportunities such as systolic arrays, connection-oriented architectures and other related disciplines . . . Panelists will discuss unique technological approaches and the future potentials along with limitations that may arise.

  • The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

    None

  • Summary Report: Wafer Level Reliability Testing Discussion Group

    None

  • Statistical error analysis of VLSI architectures: methodology and a case study

    A methodology is presented for the statistical analysis of the arithmetic error of VLSI architectures. Attention is focused on predicting the arithmetic errors of the overall architecture as a function of register lengths, the type of word representations used, and the precision of the arithmetic blocks (adder/subtracters, multipliers, shifters, dividers, etc.). The methodology is demonstrated by application to a newly developed for use in a large-scale signal processing wafer architecture, a L-U decomposition array. The wafer design, intended for radar signal processing, is part of an ongoing effort on restructurable wafer-scale integration for large-scale signal processing.<<ETX>>

  • Directions in silicon-on-silicon MCMs

    The author reports on research on silicon-based multi-chip module (MCM) technology at AT&T Bell Laboratories, including cost-driven mixed signal applications and the benefits of re-designing chips specifically for the low loading environment of MCMs.<<ETX>>

  • Battle management onboard processing for SDI

    The problem of the SDI (strategic defense initiative) onboard battle management processing is addressed. A brief overview of the general requirements for wartime space processing is presented, and the processing requirements which are specific to the battle management problem are discussed. Processor architecture and implementation using 05- mu m very high speed integrated circuit II (VHSIC II) superchip monolithic wafer-scale integration are considered. The sizing for both the VHSIC II and conventional LSI implementations is given. It is concluded that a spaceborne battle management processor capable of the throughput rate needed for the difficult SDI midcourse war scenario is feasible using advanced technology and an architecture tailored to the specifics of the problem. The critical effect of power consumption on spacecraft cost appears to militate against the use of conventional processor architectures and LSI implementation. Demanding specifications for survivability and reliability can be met by the use of a hierarchical fault-tolerant architecture based on the superchips. The battle management processor design, capable of over a billion operations per second, has a volume of 2.3 ft/sup 3/, a weight of 125 lb, and a power consumption of 1500 W. An LSI version with the same throughput would be significantly larger, heavier, and more power consumptive. The use of superchip or equivalent technology appears to be the key to achieving both the required high throughput and the 10-yr on-orbit lifetime.<<ETX>>

  • Approaches for the repair of VLSI/WSI RRAMs by row/column deletion

    The authors present two approaches for the repair of large random access memory (RAM) in which redundant rows and columns have been added as spares. These devices, referred to as redundant RAMs, are repaired to achieve acceptable yields at production time. The first approach, namely, the faulty- line-covering technique, is a refinement of the fault-driven approach. This approach finds the optimal repair-solution within a smaller number of iterations than the fault-driven algorithm. Simulation results show that the faulty-line-covering technique will execute much faster under all fault distributions. The second approach uses a heuristic criterion in the generation of the repair-solution. This heuristic criterion permits a very fast repair. The criterion is based on the calculation of efficient coefficients for the rows and columns of the memory. Two techniques for coefficient selection are proposed.<>

  • Distributed syndrome decoding for regular interconnected structures

    Distributed syndrome decoding algorithms to locate faulty PEs (processing elements) in large-scale regular interconnected structures based on the concepts of system-level diagnosis are developed. These algorithms operate in a systolic manner to locate the faulty processors. The computational complexities of these algorithms are either linear or sublinear, depending on the architecture of the system. Their implementation complexities and diagnosis capabilites differ substantially. The conditions that a fault pattern should satisfy for correct and complete diagnosis and the maximum global size of fault sets which can be diagnosed successfully using these algorithms are also identified.<<ETX>>



Standards related to Wafer scale integration

Back to Top

No standards are currently tagged "Wafer scale integration"


Jobs related to Wafer scale integration

Back to Top