Conferences related to Very high speed integrated circuits

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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2018 16th IEEE International New Circuits and Systems Conference (NEWCAS)

NEWCAS2018 will encompass a wide range of special sessions and keynote talks given by prominent expertscovering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequency circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, device modeling, and embedded portable devices.

  • 2016 14th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequqncy circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, and embedded portable devices.

  • 2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS)

    The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared among the organizing entities. This collaboration will be oriented towards advanced research in adaptive systems which constitutes the highlights of the NEWCAS conference, but also areas related to analog and digital signal processing, low power consumption, and circuits and systems designs. The topics include, but are not limited to: Computer architecture and memories, Analog circuit design, Digital and mixed-signal circuit design, RF circuit design, Microsystems, sensors and actuators, Test and verification, Telecom, microwaves and RF, Technology Trends, Data and signal processing, Neural networks and artificial vision, CAD and design tools, Low-Power circ. & syst. techniques, Imaging & image sensors, Embedded hand-held devices, Biomed. circuits & systems, Energy Harvesting / Scavenging

  • 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS)

    will encompass a wide range of special sessions and keynote talks given by prominent experts covering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2012 IEEE 10th International New Circuits and Systems Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2011 IEEE 9th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2010 8th IEEE International NEWCAS Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2009 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2009)

    Advance in microelectronics in addition to signal analog processing, and their applications to telecommunications, artificial vision and biomedical. This include: system architectures, circuit (digital, analog and mixed) and system-level design, test and verification, data and signal processing, microsystems, memories and sensors and associated analog processing, mathematical methods and design tools.

  • 2008 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2008)

    Advanced research in microelectronics and microsystems constitutes the highlights of the NEWCAS conferences in addition to topics regarding analog data and signal processing and their applications well-established in the TAISA conferences.

  • 2006 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2006)

  • 2005 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2005)

  • 2004 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2004)


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Periodicals related to Very high speed integrated circuits

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems Magazine, IEEE


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Most published Xplore authors for Very high speed integrated circuits

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Xplore Articles related to Very high speed integrated circuits

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CBIC-V, a new very high speed complementary silicon bipolar IC process

Proceedings of the Bipolar Circuits and Technology Meeting, 1989

A complementary silicon bipolar process development for high-performance 5-V analog and mixed analog-digital applications is discussed. The process yields fast vertical pnp transistors (f/sub T/ approximately=5 GHz at 3 V) and npn transistors (f/sub T/ approximately=13 GHz at 3 V). A selective epitaxial growth technique is used for active device fabrication to achieve compact and planar dielectric component isolation. For ...


A Low Level Current Mode Gate and its Associated Novel Current Source for a High Speed, 16 Bit, Single Chip Microprocessor using C D I

1975 First European Solid State Circuits Conference (ESSCIRC), 1975

None


VHDL links design, test, and maintenance

IEEE Spectrum, 1989

The authors discuss the very high-speed integrated circuit (VHSIC) hardware description language (VHDL), a universal HDL that is being adopted for design tools throughout the electronics industry in the wake of its December 1987 approval as IEEE Standard 1076-1987. The main purpose of VHDL is to allow designers to model, synthesize, and simulate components, chips, and systems from the most ...


The engineering information system program

Digest of Papers. COMPCON Spring 88 Thirty-Third IEEE Computer Society International Conference, 1988

Organizations that use design automation tools are forced to integrate an assorted set of design aids developed either internally or by different vendors. The integration task is complicated by the multiuser, distributed, heterogeneous design environment and the unique, proprietary, internal data representation of each vendor's design system. The author discusses one solution to this problem, the engineering information system (EIS) ...


DFT and BIST techniques for the future

Proceedings of the Ninth Asian Test Symposium, 2000

In this age of increasingly complex multi-million gate system-on-chip (SoC) device designs, coupled with multinational design and fabrication strategies to speed time to market for new products, new strategies are needed for insuring that new integrated circuit (IC) designs can be tested to very high levels of quality with very economical production test times.


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Educational Resources on Very high speed integrated circuits

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IEEE-USA E-Books

  • CBIC-V, a new very high speed complementary silicon bipolar IC process

    A complementary silicon bipolar process development for high-performance 5-V analog and mixed analog-digital applications is discussed. The process yields fast vertical pnp transistors (f/sub T/ approximately=5 GHz at 3 V) and npn transistors (f/sub T/ approximately=13 GHz at 3 V). A selective epitaxial growth technique is used for active device fabrication to achieve compact and planar dielectric component isolation. For a reduced thermal budget, rapid thermal annealing and low-temperature chemical-vapor-deposited dielectrics are used extensively. Circuit components are interconnected by two-level Ti-Pt-Au metallization.<<ETX>>

  • A Low Level Current Mode Gate and its Associated Novel Current Source for a High Speed, 16 Bit, Single Chip Microprocessor using C D I

    None

  • VHDL links design, test, and maintenance

    The authors discuss the very high-speed integrated circuit (VHSIC) hardware description language (VHDL), a universal HDL that is being adopted for design tools throughout the electronics industry in the wake of its December 1987 approval as IEEE Standard 1076-1987. The main purpose of VHDL is to allow designers to model, synthesize, and simulate components, chips, and systems from the most abstract behavioral level through logic gates. The authors briefly consider some existing HDLs, examine some VHDL tools that are now in use in industry and at universities, describe the benefits of VHDL, and relate the experiences of some users.<<ETX>>

  • The engineering information system program

    Organizations that use design automation tools are forced to integrate an assorted set of design aids developed either internally or by different vendors. The integration task is complicated by the multiuser, distributed, heterogeneous design environment and the unique, proprietary, internal data representation of each vendor's design system. The author discusses one solution to this problem, the engineering information system (EIS) program, the purpose of which is to reduce the present difficulties involved with integrating different vendors' design tools by developing a candidate set of interface standards and demonstrating their usefulness. The program goals and organization are described.<<ETX>>

  • DFT and BIST techniques for the future

    In this age of increasingly complex multi-million gate system-on-chip (SoC) device designs, coupled with multinational design and fabrication strategies to speed time to market for new products, new strategies are needed for insuring that new integrated circuit (IC) designs can be tested to very high levels of quality with very economical production test times.

  • IEEE Draft Standard Test Access Port and Boundary Scan Architecture

    Circuitry that may be built into an integrated circuit to assist in the test, maintenance and support of assembled printed circuit boards is defined. The circuitry includes a standard interface through which instructions and test data are communicated. A set of test features is defined, including a boundary-scan register, such that the component is able to respond to a minimum set of instructions designed to assist with testing of assembled printed circuit boards. Also, a language is defined that allows rigorous description of the component-specific aspects of such testability features.

  • Impact of New Chip Technologies on Consumer Products

    New chip technologies have become available at an unprecedented pace. The driving force has largely been the EDP industry because computers can use any increase in speed, density and complexity that could be achieved. In the trail of this EDP progress Consumer Products have picked their grains to get a share in the success and provide new (CD, cordless phone) or improved (digital tv, vcr) functions to consumers. This paper provides, by means of concrete examples, a indication of the challenges that consumer electronics products pose to the IC technologies. It is shown what sort of technological improvements are needed to make new or improved functions possible under the stringent consumer rules of low cost, high reliability and easy-to-use.

  • Towards an EMC roadmap for Integrated Circuits

    The following document gathers a collection of information and trends about integrated circuit (IC) technology to build a tentative roadmap for ElectroMagnetic Compatibility (EMC) of ICs until year 2020, with focus on embedded system-on-chip (SoC) for automotive and consumer electronics applications.

  • A novel 3-D BiCMOS technology using selective epitaxy growth (SEG) and lateral solid phase epitaxial (LSPE)

    In this paper, a novel three-dimensional (3-D) BiCMOS technology is proposed and demonstrated. In this technology, the NMOS transistor is fabricated on the bulk substrate (bottom layer) and the PMOS transistor is fabricated on the single-crystal top layer obtained using the selective epitaxy growth (SEG) and lateral solid phase epitaxy (LSPE). In addition, the BJT is fabricated in the SEG region. The mobility of the PMOS transistors fabricated on the top layer is only approximately 5% lower than that of the PMOS fabricated on SOI, and the BJTs also have high performance with a peak f/sub T/ of 17 GHz and f/sub max/ of 14 GHz at V/sub ce/=3 V. This 3-D BiCMOS technology is very promising for low power, high speed, and high frequency integrated circuit applications.

  • 40 Gb/s, 3 volt InP HBT ICs for a fiber optic demonstrator system

    We have designed and fabricated an InP HBT chip set intended for a 40 Gb/s fiber optic demonstrator system. The chip set consists of 14 different digital- and analog-ICs, and the project is a joint-venture between Ericsson Microwave Systems AB and Hughes Research Laboratories. The project goal is to demonstrate 40 Gb/s fiber optical operation, to learn how to design very high speed/high frequency integrated circuits, and to expand our knowledge on circuit behaviour prediction.



Standards related to Very high speed integrated circuits

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No standards are currently tagged "Very high speed integrated circuits"


Jobs related to Very high speed integrated circuits

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