Conferences related to Surface fitting

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


IGARSS 2020 - 2020 IEEE International Geoscience and Remote Sensing Symposium

All fields of satellite, airborne and ground remote sensing.


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Periodicals related to Surface fitting

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Surface fitting

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Xplore Articles related to Surface fitting

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Investigations of micropinches in the DPF78 plasma focus

IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993

None


Electron Transport in Thin-Base InP/InGaAs HBT's

50th Annual Device Research Conference, 1992

None


Multi-parameter ocean surface wind speed retrieval based on least square method

2016 IEEE International Geoscience and Remote Sensing Symposium (IGARSS), 2016

Analyzing and fitting the HY-2 satellite data by least square method (LSM), a multi-parameter polynomial regression model of retrieving ocean surface wind speed for HY-2 altimeter is presented in this paper. Its accuracy is about 0.157m/s when a single parameter of Ku band backscattering coefficient (σKu0) is introduced into the polynomial model, while the retrieval wind speed accuracy can be ...


Physical processes in the intermediate-layer plasma0vapor0metal at moment of ma-current cumulation on axis of the DFF-discharge

IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993

None


Particle emission of staged (na and us) time scales form focused discharges

IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993

None


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Educational Resources on Surface fitting

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IEEE-USA E-Books

  • Investigations of micropinches in the DPF78 plasma focus

    None

  • Electron Transport in Thin-Base InP/InGaAs HBT's

    None

  • Multi-parameter ocean surface wind speed retrieval based on least square method

    Analyzing and fitting the HY-2 satellite data by least square method (LSM), a multi-parameter polynomial regression model of retrieving ocean surface wind speed for HY-2 altimeter is presented in this paper. Its accuracy is about 0.157m/s when a single parameter of Ku band backscattering coefficient (σKu0) is introduced into the polynomial model, while the retrieval wind speed accuracy can be greatly improved when the polynomial model includes C band backscattering coefficient (σC0) and significant wave height (SWH), in addition to Ku band SWH and σKu0. The multi-parameter polynomial model based on LSM can be suitable for retrieving wind speed for HY-2 altimeter. The accuracy is good and acceptable.

  • Physical processes in the intermediate-layer plasma0vapor0metal at moment of ma-current cumulation on axis of the DFF-discharge

    None

  • Particle emission of staged (na and us) time scales form focused discharges

    None

  • Spectra reflectance characteristics of different snow and snow-covered land surface objects and mixed spectrum fitting

    The field spectroradiometer was used to measure spectra of different snow and snow-covered land surface objects in Beijing area. For a pure snow spectrum, the snow reflectance peaks appeared from visible to 800 nm band; there was an obvious absorption valley near the 1030 nm wavelength. Comparing with fresh snow, the reflection peaks of the old snow and melting snow showed decline to varying degrees in the ranges of 300-1300 nm, 1700-1800 nm, 2200-2300 nm. For the vegetation and snow mixed spectral characteristics, it indicated that the spectral reflectance increased for the snow-covered land types, due to influence of snow background in the range of 350-1300 nm. However, the spectrum reflectance of mixed pixel remained vegetation spectral characteristics. Based on the spectrum analysis of snow, vegetation, and mixed snow/vegetation pixels, the mixed spectral fitting equations were established, the results showed that there were good correlations between spectral curves by simulation fitting and observed ones.

  • Constructing fuzzy cognitive maps

    This paper describes the method for automatically constructing fuzzy cognitive maps based on the user-provided data. This method consists of finding the degree of similarity between any two variables (represented by numerical vectors), finding whether the relation between variables is direct or inverse, and with the help of the fuzzy expert system tool (FEST) it establishes the causality among variables.<<ETX>>

  • A Shaped Beam Dual Polarization Antenna for a Regional Satellite Communication System

    None

  • Applying functional networks to fit data points from B-spline surfaces

    A powerful extension of neural networks, the so-called functional network, was recently introduced. This kind of network is more versatile than neural networks and so can be successfully applied to several problems in computer- aided geometric design (CAGD). As an illustration, the simplest functional network representing tensor product surfaces is obtained. Then, functional network formalism is advantageously used to fit given sets of data from B-spline surfaces through a Bezier surface. The proposed method also determines the degree and coefficients (control points) of the approximating surface that fits the given data better. This new approach is very general and can also be applied to any other interesting family of approximating basis functions in CAGD.

  • Improving left ventricular border recognition using probability surfaces

    The authors present a method for automating the generation of search targets used in finding borders of the left ventricle (LV) from digital-subtraction angiography (DSA) images and thus further automating LV-border determination. This method uses a large clinical database of LV borders to generate a probability surface of expected border locations. A composite image of all observed border points is used to create a set of extraction lines that is overlaid on the LV of interest. Border points are found by using a dynamic search on the density matrix formed by extracting pixel values at the points defined by the extraction matrix. User interaction is only needed to define the valve plane, confirm the final border, and make corrections if needed. LV contours then be used to find end-diastole and end-systole volume and ejection fraction.<<ETX>>



Standards related to Surface fitting

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IEEE Standard for Metal-Enclosed Bus

This standard covers assemblies of metal-enclosed conductors along with associated interconnections, enclosures, and supporting structures. When switches and disconnecting links are included, they shall conform to this standard. This standard is concerned with performance characteristics of enclosed, rather than open, indoor and outdoor conductor assemblies with rated maximum operating voltages through 38 kV. While this standard does cover 600 volt ...


IEEE Standard for the Testing of Overhead Transmission and Distribution Line Hardware

This standard will cover the testing and acceptance requirements for overhead transmission and distribution line hardware.


IEEE Standard Requirements for High Voltage Switches



Jobs related to Surface fitting

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