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2021 IEEE Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.
INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
1990 IEEE International Magnetics Conference (INTERMAG), 1990
IEEE Transactions on Antennas and Propagation, 1997
IEEE Transactions on Magnetics, 2004
Alternating magnetic flux leakage testing is used for the detection of cracks on the surface of steel plates. In this paper, a new technique and precise inspection of how to detect plural cracks and their depth, which are located at very short distances from each other, is proposed. The leakage flux density of the parallel (x) component is used for ...
2009 8th International Conference on Reliability, Maintainability and Safety, 2009
Aero-engine blades always failure due to impact of foreign object damage in service. Damnification and consequent fracture failure of blade is one of the main failure modes for the compressor blades in aero-engine. Damage characteristic on blades caused by different kind of material are various. Observation on damaged surfaces, trace analysis and surface element analysis by means of SEM and ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015
Printed circuit boards are becoming denser as the electronic products have been reduced in size and improved in performance. Excellent reliability for High Accelerated Stress Test(HAST) resistance, crack resistance, and higher resolution are critical requirements for solder resist to be formed at the outermost layer of the printed circuit board, especially for the solder resist for substrate for the ball ...
IMS 2011 Microapps - A Multi-Level Conductor Surface Roughness Model
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
IMPASS: Intelligent Mobility Platform with Active Spoke System
Life Sciences: Surface Enhanced Raman Spectroscopy, and more
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
IEEE Magnetics Distinguished Lecture - Yoshichika Otani
BSIM Spice Model Enables FinFET and UTB IC Design
Making Orthogonal Transitions with Climbing Mini-Whegs
A Robot to Mine the Moon
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Silicon THz: an Opportunity for Innovation
Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy
IROS TV 2019-STAR LAB at the University of Surrey Space Technology for Autonomous systems & Robotics
Lighting the Way: Optical Sensors in the Life Sciences
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
Robotics History: Narratives and Networks Oral Histories: Larry Matthies
Demonstrations of Gravity-Independent Mobility and Drilling on Natural Rock using Microspines
HARI SRIKANTH - IEEE Magnetics Distinguished Lecture
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 5 of 7 - SQUID Instrumentation for Early Cancer Diagnostics
Alternating magnetic flux leakage testing is used for the detection of cracks on the surface of steel plates. In this paper, a new technique and precise inspection of how to detect plural cracks and their depth, which are located at very short distances from each other, is proposed. The leakage flux density of the parallel (x) component is used for the distinction of the plural cracks. Moreover, the depth of plural cracks is obtained by changing the exciting frequency and by detecting the perpendicular (z) component of leakage flux. The behavior of leakage flux is examined using three-dimensional edge- based hexahedral finite-element methods and compared with experimentation. The effect of hysteresis on magnetic phenomena is also examined.
Aero-engine blades always failure due to impact of foreign object damage in service. Damnification and consequent fracture failure of blade is one of the main failure modes for the compressor blades in aero-engine. Damage characteristic on blades caused by different kind of material are various. Observation on damaged surfaces, trace analysis and surface element analysis by means of SEM and X-ray energy spectrum are effective methods to estimate the attribute, component and outline of foreign object. In this paper, analysis on several cases of FOD are introduced. The features, principles and rules of several typical FOD modes are summarized through failure cases analysis.
Printed circuit boards are becoming denser as the electronic products have been reduced in size and improved in performance. Excellent reliability for High Accelerated Stress Test(HAST) resistance, crack resistance, and higher resolution are critical requirements for solder resist to be formed at the outermost layer of the printed circuit board, especially for the solder resist for substrate for the ball grid array packages. Increased demands for higher density package substrates drives finer line and space(L/S) from narrower pad pitch, and thinner layers, and requirements for solder resist is getting more critical. We have successfully established technology to enhance HAST reliability through reduction of chlorine ion impurities to improve anti- hydrolysis properties. This new technology significantly improves ion migration resistance resulting in a higher HAST reliability even with a thinner solder resist film. For crack resistance, a simulation has been designed to analyze the mechanism of cracking as well as a target of physical properties of the solder resist possessing superior crack resistance. Outstanding crack resistance was successfully achieved in the thermal shock test(TST), with the solder resist using the new technology based on the results from our simulation. As for the resolution, we optimized exposure wavelength and the refractive index of the material and successfully demonstrated good resolution in accordance with the design size.
A method for determining the three-dimensional depth profile of a surface- breaking crack-like feature is presented based on near-field surface acoustic wave signal responses. Three-dimensional finite element models were used to study the forward problem, where the characteristic near-field scattering of a surface acoustic wave incident on a simulated crack was investigated. Experimental validation of the modeling predictions was accomplished using a wedge transducer for surface wave generation and a scanning laser vibrometry system for surface wave detection. The characteristic near-field amplitude response in reflection and in transmission was measured and modeled for flat- bottom, angled, and curved-bottom localized notch features, where a simple linear inversion method was developed, which provided an effective means for characterizing and mapping the three-dimensional depth profile of surface- breaking crack-like features with depths in the micron to millimeter range.
A new sensor based on complementary split-ring resonators is presented to detect sub-millimeter surface cracks. The sensing mechanism is based on perturbing the electromagnetic field around an electrically small resonator, thus initiating a shift in the resonance frequency. The sensor is simple to fabricate and inexpensive as it is etched out in the ground plane of a microstrip-line using printed circuit board technology. The sensor exhibits a frequency shift of more than 240 MHz for a 100 μm crack.
Rail inspection using laser ultrasonic surface waves could provide a more reliable and efficient detection of surface cracks. This paper explored the interaction and propagation of Rayleigh waves with cracks which had a wide range of depths relative to the rail surface by finite element 2D model. A non-contact laser generation and detection system was established to detect depth defects. The time and frequency analysis of different depth defect signals are analyzed by simulation and experiment, and the quantitative evaluation of the surface defects in different depths are realized by fitting the relationship between damage factors - damage depths curve. It is found that surface waves are sensitive to shallow cracks and the larger the damage depth is, the larger the damage factor.
Infrared images resulting from back-scattered thermal waves in composite materials are corrupted by instrument noise and sample heat-spread function. This paper demonstrates that homomorphic deconvolution and "demultiplication" result in enhanced image quality for characterization of subsurface flaws in Kevlar and graphite composites. The choice of processing depends on material characteristics and extent of noise in the original image.<<ETX>>
Three-point bending tests on specimens cut from the Dy123 with X (X = 15, 20 and 25) mol% Dy211 single-grain bulks were carried out at room temperature. The average value of the Young's modulus increased with increase of the Dy211 content; these averages are 112, 123 and 133 GPa for X = 15, 20 and 25, respectively. The fracture strength also increased; the average values are 62, 78 and 87 MPa, respectively, and the ranges of data scatter became narrow; the Weibull coefficients are 5.1, 8.9 and 15.0, respectively. On the fracture surfaces of some specimens cut from the bottom region of the bulks, the segregated green phase was observed. By excluding these specimens, the Young's modulus and the fracture strength of the material without pores were estimated to be 168 GPa and 106 MPa, respectively.
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