Conferences related to Surface cracks

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


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Periodicals related to Surface cracks

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Surface cracks

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Xplore Articles related to Surface cracks

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Validation of three dimensional eddy-current probe-flaw interaction model ofr surface breaking cracks

1990 IEEE International Magnetics Conference (INTERMAG), 1990

None


Correction to "Application Of Incremental Length Diffraction Coefficients To Calculate The Pattern Effects Of The Rim And Surface Cracks Of A Reflector Antenna"

IEEE Transactions on Antennas and Propagation, 1997

None


Proposal of detecting method of plural cracks and their depth by alternating flux leakage testing: 3-D nonlinear eddy current analysis and experiment

IEEE Transactions on Magnetics, 2004

Alternating magnetic flux leakage testing is used for the detection of cracks on the surface of steel plates. In this paper, a new technique and precise inspection of how to detect plural cracks and their depth, which are located at very short distances from each other, is proposed. The leakage flux density of the parallel (x) component is used for ...


Failure analysis on foreign object damage of aero-engine compressor blade

2009 8th International Conference on Reliability, Maintainability and Safety, 2009

Aero-engine blades always failure due to impact of foreign object damage in service. Damnification and consequent fracture failure of blade is one of the main failure modes for the compressor blades in aero-engine. Damage characteristic on blades caused by different kind of material are various. Observation on damaged surfaces, trace analysis and surface element analysis by means of SEM and ...


Development of photosensitive solder resist with high reliability for semiconductor package

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015

Printed circuit boards are becoming denser as the electronic products have been reduced in size and improved in performance. Excellent reliability for High Accelerated Stress Test(HAST) resistance, crack resistance, and higher resolution are critical requirements for solder resist to be formed at the outermost layer of the printed circuit board, especially for the solder resist for substrate for the ball ...


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Educational Resources on Surface cracks

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IEEE-USA E-Books

  • Validation of three dimensional eddy-current probe-flaw interaction model ofr surface breaking cracks

    None

  • Correction to "Application Of Incremental Length Diffraction Coefficients To Calculate The Pattern Effects Of The Rim And Surface Cracks Of A Reflector Antenna"

    None

  • Proposal of detecting method of plural cracks and their depth by alternating flux leakage testing: 3-D nonlinear eddy current analysis and experiment

    Alternating magnetic flux leakage testing is used for the detection of cracks on the surface of steel plates. In this paper, a new technique and precise inspection of how to detect plural cracks and their depth, which are located at very short distances from each other, is proposed. The leakage flux density of the parallel (x) component is used for the distinction of the plural cracks. Moreover, the depth of plural cracks is obtained by changing the exciting frequency and by detecting the perpendicular (z) component of leakage flux. The behavior of leakage flux is examined using three-dimensional edge- based hexahedral finite-element methods and compared with experimentation. The effect of hysteresis on magnetic phenomena is also examined.

  • Failure analysis on foreign object damage of aero-engine compressor blade

    Aero-engine blades always failure due to impact of foreign object damage in service. Damnification and consequent fracture failure of blade is one of the main failure modes for the compressor blades in aero-engine. Damage characteristic on blades caused by different kind of material are various. Observation on damaged surfaces, trace analysis and surface element analysis by means of SEM and X-ray energy spectrum are effective methods to estimate the attribute, component and outline of foreign object. In this paper, analysis on several cases of FOD are introduced. The features, principles and rules of several typical FOD modes are summarized through failure cases analysis.

  • Development of photosensitive solder resist with high reliability for semiconductor package

    Printed circuit boards are becoming denser as the electronic products have been reduced in size and improved in performance. Excellent reliability for High Accelerated Stress Test(HAST) resistance, crack resistance, and higher resolution are critical requirements for solder resist to be formed at the outermost layer of the printed circuit board, especially for the solder resist for substrate for the ball grid array packages. Increased demands for higher density package substrates drives finer line and space(L/S) from narrower pad pitch, and thinner layers, and requirements for solder resist is getting more critical. We have successfully established technology to enhance HAST reliability through reduction of chlorine ion impurities to improve anti- hydrolysis properties. This new technology significantly improves ion migration resistance resulting in a higher HAST reliability even with a thinner solder resist film. For crack resistance, a simulation has been designed to analyze the mechanism of cracking as well as a target of physical properties of the solder resist possessing superior crack resistance. Outstanding crack resistance was successfully achieved in the thermal shock test(TST), with the solder resist using the new technology based on the results from our simulation. As for the resolution, we optimized exposure wavelength and the refractive index of the material and successfully demonstrated good resolution in accordance with the design size.

  • Three-dimensional crack depth profile assessment using near-field surface acoustic wave signal response

    A method for determining the three-dimensional depth profile of a surface- breaking crack-like feature is presented based on near-field surface acoustic wave signal responses. Three-dimensional finite element models were used to study the forward problem, where the characteristic near-field scattering of a surface acoustic wave incident on a simulated crack was investigated. Experimental validation of the modeling predictions was accomplished using a wedge transducer for surface wave generation and a scanning laser vibrometry system for surface wave detection. The characteristic near-field amplitude response in reflection and in transmission was measured and modeled for flat- bottom, angled, and curved-bottom localized notch features, where a simple linear inversion method was developed, which provided an effective means for characterizing and mapping the three-dimensional depth profile of surface- breaking crack-like features with depths in the micron to millimeter range.

  • Complementary Split-Ring Resonator for Crack Detection in Metallic Surfaces

    A new sensor based on complementary split-ring resonators is presented to detect sub-millimeter surface cracks. The sensing mechanism is based on perturbing the electromagnetic field around an electrically small resonator, thus initiating a shift in the resonance frequency. The sensor is simple to fabricate and inexpensive as it is etched out in the ground plane of a microstrip-line using printed circuit board technology. The sensor exhibits a frequency shift of more than 240 MHz for a 100 μm crack.

  • Non-contact ultrasonic detection of rail surface defects in different depths

    Rail inspection using laser ultrasonic surface waves could provide a more reliable and efficient detection of surface cracks. This paper explored the interaction and propagation of Rayleigh waves with cracks which had a wide range of depths relative to the rail surface by finite element 2D model. A non-contact laser generation and detection system was established to detect depth defects. The time and frequency analysis of different depth defect signals are analyzed by simulation and experiment, and the quantitative evaluation of the surface defects in different depths are realized by fitting the relationship between damage factors - damage depths curve. It is found that surface waves are sensitive to shallow cracks and the larger the damage depth is, the larger the damage factor.

  • Thermal-wave image processing for characterization of subsurface flaws in materials

    Infrared images resulting from back-scattered thermal waves in composite materials are corrupted by instrument noise and sample heat-spread function. This paper demonstrates that homomorphic deconvolution and "demultiplication" result in enhanced image quality for characterization of subsurface flaws in Kevlar and graphite composites. The choice of processing depends on material characteristics and extent of noise in the original image.<<ETX>>

  • Effects of Dy211 Content on Bending Mechanical Properties of Dy123 Bulks at Room Temperature

    Three-point bending tests on specimens cut from the Dy123 with X (X = 15, 20 and 25) mol% Dy211 single-grain bulks were carried out at room temperature. The average value of the Young's modulus increased with increase of the Dy211 content; these averages are 112, 123 and 133 GPa for X = 15, 20 and 25, respectively. The fracture strength also increased; the average values are 62, 78 and 87 MPa, respectively, and the ranges of data scatter became narrow; the Weibull coefficients are 5.1, 8.9 and 15.0, respectively. On the fracture surfaces of some specimens cut from the bottom region of the bulks, the segregated green phase was observed. By excluding these specimens, the Young's modulus and the fracture strength of the material without pores were estimated to be 168 GPa and 106 MPa, respectively.



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