3,465 resources related to Surface contamination
- Topics related to Surface contamination
- IEEE Organizations related to Surface contamination
- Conferences related to Surface contamination
- Periodicals related to Surface contamination
- Most published Xplore authors for Surface contamination
The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.
INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.
This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.
All fields of satellite, airborne and ground remote sensing.
OCEANS 2020 - SINGAPORE
An OCEANS conference is a major forum for scientists, engineers, and end-users throughout the world to present and discuss the latest research results, ideas, developments, and applications in all areas of oceanic science and engineering. Each conference has a specific theme chosen by the conference technical program committee. All papers presented at the conference are subsequently archived in the IEEE Xplore online database. The OCEANS conference comprises a scientific program with oral and poster presentations, and a state of the art exhibition in the field of ocean engineering and marine technology. In addition, each conference can have tutorials, workshops, panel discussions, technical tours, awards ceremonies, receptions, and other professional and social activities.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.
Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
IEEE Power Engineering Review, 1991
IEEE Power Engineering Review, 1991
Fundamentals of Computational Intelligence: Neural Networks, Fuzzy Systems, and Evolutionary Computation, None
This chapter focuses on the radial-basis function (RBF) network as an alternative to multilayer perceptrons. It will be interesting to find that in a multilayer perceptron, the function approximation is defined by a nested set of weighted summations, while in a RBF network, the approximation is defined by a single weighted sum. The chapter focuses on the use of a ...
IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993
2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC), 2018
The heterojunction interdigitated back-contact (HJ IBC) cell technology enables remarkably high cell efficiencies, but requirescomplex processing for the rear-side patterning of the interdigitated a-Si:H electron and hole hetero-contacts. Therefore, the HJ IBC process flow must be simplified into a sequence that is cost-effective and industrially-compatible. Towards this goal, a litho-free, all-dry process sequence is being developed. As part of this ...
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
IMPASS: Intelligent Mobility Platform with Active Spoke System
Life Sciences: Surface Enhanced Raman Spectroscopy, and more
IEEE Magnetics Distinguished Lecture - Yoshichika Otani
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
BSIM Spice Model Enables FinFET and UTB IC Design
IRDS: Yield Enhancement - Slava Libman at INC 2019
Making Orthogonal Transitions with Climbing Mini-Whegs
A Robot to Mine the Moon
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Silicon THz: an Opportunity for Innovation
IROS TV 2019-STAR LAB at the University of Surrey Space Technology for Autonomous systems & Robotics
Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy
Lighting the Way: Optical Sensors in the Life Sciences
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
Demonstrations of Gravity-Independent Mobility and Drilling on Natural Rock using Microspines
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 5 of 7 - SQUID Instrumentation for Early Cancer Diagnostics
Lunar Industrialization: The First Step to the Solar System
This chapter focuses on the radial-basis function (RBF) network as an alternative to multilayer perceptrons. It will be interesting to find that in a multilayer perceptron, the function approximation is defined by a nested set of weighted summations, while in a RBF network, the approximation is defined by a single weighted sum. The chapter focuses on the use of a Gaussian function as the radial-basis function. The reason behind the choice of the Gaussian function as the radial-basis function in building RBF networks is that it has many desirable properties, which will become evident as the discussion progresses. It is important to point out that RBF networks and multilayer perceptrons can be trained in alternative ways besides those presented. For multilayer perceptrons, the backpropagation algorithm is simple to compute locally and it performs stochastic gradient descent in weight space when the algorithm is implemented in an online learning mode.
The heterojunction interdigitated back-contact (HJ IBC) cell technology enables remarkably high cell efficiencies, but requirescomplex processing for the rear-side patterning of the interdigitated a-Si:H electron and hole hetero-contacts. Therefore, the HJ IBC process flow must be simplified into a sequence that is cost-effective and industrially-compatible. Towards this goal, a litho-free, all-dry process sequence is being developed. As part of this simplified process flow, a novel in situ dry clean process called “nano- envelope” clean is developed to replace the wet cleaning after dry etching of a-Si:H. Surface contaminationanalysis and passivation studies prove that the developed dry clean is as effective as the standard wet clean. Since the “nano-envelope” clean can bedone in the same PECVD tool, the sequence from dry etching to repassivation can be done fully in situ.
Summary form only given. The storage of ultra-high purity (UHP) gases is a critical issue to the electronics industry. To prepare a storage vessel or delivery manifold for ultra-high purity gas service, all the atmospheric contaminants must be thoroughly removed from the system. Of these contaminants, atmospheric moisture is the most difficult to remove. It readily condenses on metal surfaces in multiple layers with a large heat adsorption. Typically, moisture is removed by purging or evacuation for long periods of time. In some cases it takes several weeks to adequately remove moisture from a delivery system. This is an expensive, time consuming process. Sometimes systems are heated to high temperature to reduce the time required to remove moisture. However, heating is not always practical, and it does nothing to prevent re-adsorption of water if the system is again exposed to ambient atmosphere. In many cases, moisture is the critical contaminant in the gas delivery system. This is especially true when the ultra-high purity gas is corrosive. Gases such as hydrogen chloride, hydrogen bromide, fluorine, tungsten hexafluoride and other halogen containing gases will severely corrode many metals if moisture is present. Corrosion of the storage vessel or delivery manifold can result in introduction of particle or gas-phase impurities into the ultra-high purity gas, or in extreme cases, result in failure of the system. Components such as valves, regulators, and mass now controllers are very susceptible to failure due to corrosion and frequently need to be replaced. This paper describes a new method for rapidly removing moisture from metal surfaces used in the packaging and delivery of high purity bulk and corrosive-speciality gases. Furthermore, the process passivates the metal by forming a hydrophobic surface that prevents water from readsorbing. Reagents of the type RsiXYZ where R is an alkyl group and at least one of X, Y, or Z is a hydrolyzable group are shown to enhance the removal of surface adsorbed moisture and gaseous product (HX). The HX by-product and unreacted RsiXYZ are rapidly and completely purged from the system. Since water is removed from the surface by chemical reaction rather than by simple purging, the initial dry down is faster. In addition to removing adsorbed water, the treatment incorporates a stable organosilicon group into the surface which greatly reduces the polar character associated with the OH terminated surface. The treated surface is hydrophobic inhibiting water from re-adsorbing during a subsequent moisture exposure. Stainless steel surfaces passivated in this manner are shown to have improved corrosion resistance compared to unpassivated stainless steel.
Advanced methods for low temperature bonding are reviewed and discussed in terms of the concept of the surface activation and the future outlook of their development in 3D integration. As one of the methods, a new attempt for room temperature bonding is introduced, which enables to bond inorganic materials such as Si oxides, glasses and sapphire as well as single crystalline piezoelectric materials. The method is based on the concept of the surface activated bonding (SAB) with certain modification including formation of Fe nano-adhesion layer which accompanied by additional Si intermediate layer formed by a special ion beam source. It was found that wafers of such materials can be bonded very strongly without any heat treatment at room temperature.
In advanced technology nodes, many new materials have been introduced to improve the device capability. This means new particle sources are also introduced through more complicated process. Hence, the defect control will be more important for manufacturing and yield improvement. In this paper we addressed one type of residue defect found on surface of amorphous silicon film. The defect source and forming mechanism were revealed by our experiments. Finally, the cleaning method was shared that can remove this defect.
The guide specifies procedures for testing equipment when external insulation of the test object is subjected to combinations of contamination, ice, snow, or cold fog. The methods are applicable only to tests on equipment with a rated voltage above 1 kV.The guide specifies procedures for testing equipment when external insulation of the test object is subjected to combinations of contamination, ...