Conferences related to Substrates

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.



Periodicals related to Substrates

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.



Most published Xplore authors for Substrates

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Xplore Articles related to Substrates

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An approximate complex image green's function for a truncated dielectric substrate

Symposium on Antenna Technology and Applied Electromagnetics [ANTEM 1994], 1994

In MIC's and printed antennas the dielectric substrates always have finite extent. Rigorous analysis of the truncation effects requires the solution of an integral equation with MoM. This is usually numerically intense especially for 3-D structures. In this paper the truncation effects are incorporated directly in an approximate Green's function. The Characteristic Green's Function (CGF) technique is combined with the ...


Designing of Smart Antenna for improved directivity and gain at terahertz frequency range

2016 Progress in Electromagnetic Research Symposium (PIERS), 2016

In the present scenario the challenge is to transmit the data at rate 10 gigabits per second for the terahertz frequency regime. One prominent technique that can proffer solution for the efficient transmission at this frequency wideband is Smart Antenna. This research work proposed and examined smart antennas also known as adaptive array antennas at terahertz frequency range. The prototype ...


A new type of gallium arsenide field-effect phototransistor

1971 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1971

A gallium-arsenide field-effect phototransistor, which responds to infrared radiation at a wavelength of 1.5 μ will be covered. The device is fabricated from chromium-doped semi-insulating GaAs with a thin epitaxial N-type surface layer.


Efficient Analysis of Substrate Integrated Waveguide Devices Using Hybrid Mode Matching Between Cylindrical and Guided Modes

IEEE Transactions on Microwave Theory and Techniques, 2012

In this paper, a new method to efficiently analyze substrate integrated waveguide (SIW) based devices with multiple accessing ports is presented. The problem is considered as a 2-D electromagnetic problem assuming no field variation normal to the dielectric substrate. The incident and scattered fields from each circular cylinder are expanded with cylindrical modes, and the fields in the waveguide ports ...


Compressed Dipoles Resonating at Higher Order Modes With Enhanced Directivity

IEEE Transactions on Antennas and Propagation, 2017

A compressed dipole operating at higher order modes is proposed and investigated for the enhancement of boresight directivity. Compared with conventional dipoles in free space, the length of the proposed dipole is compressed although the currents on the compressed dipole still sinusoidally distribute. The traces of calculated compressed dipole's directivity against compressibility show that the directivity of a compressed dipole ...



Educational Resources on Substrates

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IEEE-USA E-Books

  • An approximate complex image green's function for a truncated dielectric substrate

    In MIC's and printed antennas the dielectric substrates always have finite extent. Rigorous analysis of the truncation effects requires the solution of an integral equation with MoM. This is usually numerically intense especially for 3-D structures. In this paper the truncation effects are incorporated directly in an approximate Green's function. The Characteristic Green's Function (CGF) technique is combined with the complex images method to derive the Green's function. The derived Green's function exhibits excellent agreement with the available rigorous MoM solution of the problem.

  • Designing of Smart Antenna for improved directivity and gain at terahertz frequency range

    In the present scenario the challenge is to transmit the data at rate 10 gigabits per second for the terahertz frequency regime. One prominent technique that can proffer solution for the efficient transmission at this frequency wideband is Smart Antenna. This research work proposed and examined smart antennas also known as adaptive array antennas at terahertz frequency range. The prototype antenna is suitably operating in the range of 300 GHz to 3 THz for wireless local area network applications that uses high-frequency radio waves. The antenna has been put together on a Rogers RT Duroid dielectric substrate of Svensson/Djordjevic loss type with dielectric permittivity of εr= 2.33, loss factor/tangent (tan δ) of 1.2 * 10-3, relative permeability (μr) = 1 and the thickness of h = 0.80 mm. Rogers RT Duroid dielectric substrate has been taken as our substrate due to the low dielectric loss which make it suitable for high-frequency laminate over the FR-4 substrate. The antenna receives input power and radiated power at 15.55 Watts in a specific direction, focusing the desired signals from where they come forth allowing for increased radiation efficiency of 100% and mitigate interfering signals from unwanted sources. The antenna has a peak directivity of 17.6 dB, this made it possible for the maximum power transfer. The simulated results are shown in Fig. 1 to Fig. 3. The sum of the far fields E radiated from the array is equation where Eiis the far field of the ith antenna given as: equation.

  • A new type of gallium arsenide field-effect phototransistor

    A gallium-arsenide field-effect phototransistor, which responds to infrared radiation at a wavelength of 1.5 μ will be covered. The device is fabricated from chromium-doped semi-insulating GaAs with a thin epitaxial N-type surface layer.

  • Efficient Analysis of Substrate Integrated Waveguide Devices Using Hybrid Mode Matching Between Cylindrical and Guided Modes

    In this paper, a new method to efficiently analyze substrate integrated waveguide (SIW) based devices with multiple accessing ports is presented. The problem is considered as a 2-D electromagnetic problem assuming no field variation normal to the dielectric substrate. The incident and scattered fields from each circular cylinder are expanded with cylindrical modes, and the fields in the waveguide ports are expanded using progressive and regressive modal summations. The addition theorems of Bessel and Hankel functions are used to analyze the full-wave behavior of the SIW device. In order to extract the circuital parameters, the hybrid mode-matching between guided and cylindrical modes is done by projecting continuity equations in a circular boundary containing the whole SIW structure over the inner modes of each region. Applying this new technique, it is possible to analyze multiple port devices by solving a set of integrals that can be easily approached analytically or by using the inverse fast Fourier transform, avoiding the use of non efficient numerical methods. It is shown that the new method runs faster than commercial software packages and other techniques recently published.

  • Compressed Dipoles Resonating at Higher Order Modes With Enhanced Directivity

    A compressed dipole operating at higher order modes is proposed and investigated for the enhancement of boresight directivity. Compared with conventional dipoles in free space, the length of the proposed dipole is compressed although the currents on the compressed dipole still sinusoidally distribute. The traces of calculated compressed dipole's directivity against compressibility show that the directivity of a compressed dipole operating at higher resonant modes is larger than conventional dipoles for the well selected compressibility. This paper shows that printing the dipole onto a piece of dielectric substrate can achieve the desired compressibility. The relationship between the compressibility and relative permittivity of the dielectric slab provides the guidance to realize the selected compressibility. As an example, a thin linear compressed dipole resonating at the third mode is designed, fabricated, and measured to validate the method. The measured broadside gain of the proposed compressed dipole reaches up to 4.6 dBi, 75% or 2.45 dBi higher than a conventional dipole.

  • Electromagnetic Analysis for Inhomogeneous Interconnect and Packaging Structures Based on Volume-Surface Integral Equations

    Electromagnetic analysis for interconnect and packaging structures usually relies on the solutions of surface integral equations (SIEs) in integral equation solvers. Though the SIEs are necessary for the conductors in the structures, one has to assume a homogeneity of material for each layer of a substrate if SIEs are used for the substrate. When the inhomogeneity of materials in the substrate has to be taken into account, then volume integral equations (VIEs) are indispensable. In this paper, we consider the inhomogeneous materials of substrate and replace the SIEs with the VIEs to form volume-surface integral equations (VSIEs) for the entire structures. Also, the use of VIEs could alleviate low-frequency effects, remove the need of selecting a basis function for magnetic current, and facilitate geometric discretization in some scenarios. The VSIEs are solved with the method of moments by using the Rao-Wilton-Glisson basis function to represent the surface current on the conductors and Schaubert-Wilton-Glisson basis function to expand the volume current inside the substrate. To avoid the inconvenience of charge density in the traditional implementation of the VIEs, we suggest that the dyadic Green's function be kept in its original form without moving the gradient operator onto the basis and testing functions. Numerical examples are presented to demonstrate the effectiveness of the approach.

  • Silicon-on-sapphire: A Practical Material

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  • High Mobility Poly-Si TFTs Fabricated by a Novel Excimer-Laser Crystallization Method

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  • An integrated buffer amplifier

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  • CMOS Transistors under Uniaxial Stress on Ultra-Thin Chips for Applications in Bendable Image Sensors

    In this work characteristics of CMOS transistors on ultra-thin silicon chips embedded into a polyimide foil are discussed. The thinning and the encapsulation processes are presented and the piezoresistive coefficients of both n- and pMOS transistors are experimentally determined. Moreover, the dependence of the threshold voltage and subthreshold slope on uniaxial tensile and compressive stress is examined. Keywords - flexible ultra-thin silicon chips; uniaxial stress; bending machine;piezoresistance; chip-in-foil



Standards related to Substrates

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