Conferences related to Stress control

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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Stress control

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Stress control

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Xplore Articles related to Stress control

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Deep submergence photographic port

1970 IEEE International Conference on Engineering in the Ocean Environment - Digest of Technical Papers, 1970

None


Web Wrinkling Effects on Web Modeling

1987 American Control Conference, 1987

In modelling web handling system as controlled dynamic system the model of the web selected can effect system behavior. Webs are membranes capable of resisting tensile stresses but incapable of resisting compressive stresses due to buckling or `wrinkling'. This allows at least two unique web models tobe formed. The first model assumes that the web line tension is large enough ...


SWMC fast layer-identification algorithm of penetration acceleration signal

2010 International Conference On Computer Design and Applications, 2010

The signal achieved by accelerator in the process of the hard-layer penetration is a typical non-stationary random signal with very large peak pulse amplitude, quite short action time and blurry local characteristic. In addition, the high frequency contained in the signal is so abundant that the traditional time-frequency analysis and non-parameter modeling methods are difficult to effectively analyze and process ...


Controllability of group translations

Proceedings of the 2001 American Control Conference. (Cat. No.01CH37148), 2001

We analyze controllability of group translations. Compact groups are shown to be controllable if the input set is of positive measure and contains an ergodic element. A particular example is that of torus translations /spl theta//spl rarr//spl theta/+/spl omega/, where /spl omega/ is chosen from an input set U/spl sub/T which are proven to be controllable if the input set ...


Effects of High Temperature Stress on Transgene Expression and DNA Methylation Pattern

2010 4th International Conference on Bioinformatics and Biomedical Engineering, 2010

Studies about the variation of DNA methylation pattern under high temperature stress (37°C) contribute to a comprehensive understanding of the apparent regulation of biological functions. Based on the in vitro cultivation of genetically modified birch (_Betula platyphylla_Suk.) clones for high- temperature stress, the paper detected exogenous gene transcription level differences with RT-PCR. Methylation-sensitive amplified polymorphism (MSAP) analysis the variation of ...


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Educational Resources on Stress control

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IEEE-USA E-Books

  • Deep submergence photographic port

    None

  • Web Wrinkling Effects on Web Modeling

    In modelling web handling system as controlled dynamic system the model of the web selected can effect system behavior. Webs are membranes capable of resisting tensile stresses but incapable of resisting compressive stresses due to buckling or `wrinkling'. This allows at least two unique web models tobe formed. The first model assumes that the web line tension is large enough that bending of a web, due to a controller or roll misalignment, does not produce compressive stresses. Thus the web can be modeled as a beam in bending. The second model assumes that the web has wrinkled and now must be modeled as a series of ribbons between wrinkles. Results of an experimental investigation are presented to help determine which web model is valid such that an appropriate control strategy can be implemented.

  • SWMC fast layer-identification algorithm of penetration acceleration signal

    The signal achieved by accelerator in the process of the hard-layer penetration is a typical non-stationary random signal with very large peak pulse amplitude, quite short action time and blurry local characteristic. In addition, the high frequency contained in the signal is so abundant that the traditional time-frequency analysis and non-parameter modeling methods are difficult to effectively analyze and process this kind of signal. On the basis of the analyzing the components of the penetration signal, the EEMD algorithm and Hilbert-Huang transform are used to abstract the instantaneous characteristic of the multi-layer penetration acceleration signal, and the characteristic of penetrating layer is achieved in the decomposed IMF. According to the characteristic, a fast SWMC algorithm is studied to real-time identify the layer characteristic for precise burst control. Finally, the accuracy of the algorithm is well verified in the SIMULINK simulation platform.

  • Controllability of group translations

    We analyze controllability of group translations. Compact groups are shown to be controllable if the input set is of positive measure and contains an ergodic element. A particular example is that of torus translations /spl theta//spl rarr//spl theta/+/spl omega/, where /spl omega/ is chosen from an input set U/spl sub/T which are proven to be controllable if the input set is of non-zero measure. Controllability of R/sup n/ under addition is discussed.

  • Effects of High Temperature Stress on Transgene Expression and DNA Methylation Pattern

    Studies about the variation of DNA methylation pattern under high temperature stress (37°C) contribute to a comprehensive understanding of the apparent regulation of biological functions. Based on the in vitro cultivation of genetically modified birch (_Betula platyphylla_Suk.) clones for high- temperature stress, the paper detected exogenous gene transcription level differences with RT-PCR. Methylation-sensitive amplified polymorphism (MSAP) analysis the variation of DNA methylation pattern in transgenic birch. In this paper we used ten pairs of primers MSAP to deal with genetically modified DNA screening birch. The study revealed that high temperature stress can lead the level of transcriptional expression of transgene decrease, while endogenous levels of DNA methylation, including the overall methylation, the lateral semi-cytosine methylation as well as the inside of cytosine methylation level of the whole is almost twice than the control.

  • A programmable 256K CMOS EPROM with on-chip test circuits

    None

  • Research on third harmonic injection control strategy of improved Z-source inverter

    Compared to previous Z-source inverter topology, improved Z-source inverter has advantages such as low Z-source capacitor voltage stress and inherent inrush current limitation. This paper investigates the third harmonic injection control strategy of improved Z-source inverter. Compared to simple boost control, it can reduce the voltage stress and Z-source inductor current ripple. Theoretical analysis, simulation and experimental results were presented to demonstrate the features of the control.

  • Comprehensive Evaluation on Drought Resistance of Some Ground Covers

    The paper studies the drought resistance and performance of five ground covers (<i>Sedum</i> <i>lineare</i>, <i>Sedum</i> <i>lineare</i> dasiaPu Fupsila, <i>Sedum</i> <i>elatinoides</i>, <i>Zephyranthes</i> <i>candida</i>, <i>Ophiopogon</i> <i>japonicus</i>) under drought-stress through the testing of artificial climatic cabinet. We choose soil moisture content, relative water content of leaves, relative electric conductivity, chlorophyll, SOD, malondialdehyde (MDA), proline (Pro), etc., to be the indexes of adaptability. Based on the related analysis of data, which came from both detection and observation, we carry on the comprehensive evaluation on the five ground covers by using the subordinative function method. The results indicate that their drought resistance in the order from strong to weak is <i>Z.</i> <i>candida</i> &gt; <i>S.</i> <i>elatinoide</i> &gt; <i>S.lineare</i> &gt; <i>S.</i> <i>lineare</i> dasiaPu Fupsila &gt; <i>O.</i> <i>japonicus</i>.

  • Controlled stress in germanosilicate glasses deposited by plasma-enhanced chemical vapor deposition

    Summary form only given. As structures in integrated microelectronic devices become smaller, there is a need for passivation and interconnection layers that exhibit controllable stress and have good reflow properties at reduced temperatures in order to stay within thermal budgets. One possibility for this material is germanium-silicon oxides, or germanosilicates. Germanosilicate films have been deposited at 200/spl deg/C by Plasma Enhanced Chemical Vapor Deposition utilizing germane, silane, oxygen, and argon in an inductively- coupled plasma generated by twin coils in a horizontal reactor tube. Film composition was varied by altering the germane to silane ratio at constant total flow. Solubility tests in boiling water indicate that the films are stable above 50% SiO/sub 2/. Compositional analysis was performed by Electron Dispersive Spectroscopy (EDS), and was found to be linear with hydride input percentages. Variable Angle Spectroscopic Ellipsometry (VASE) indicates that the index of refraction is roughly linear, although lower than the ideal from bulk samples in all cases. Stress levels were characterized by a single-beam laser cantilever system with the oxides deposited on bare silicon wafers. Results indicate that stress levels are on the order of 10/sup 8/ dynes/cm/sup 2/ for the entire range of germanosilicate films, compressive at pure SiO/sub 2/ and tensile for films of 10% GeO/sub 2/ and higher.

  • Thermal stress and relaxation behaviour of Al(Cu) submicron interconnects

    This paper addresses the reliability problem of stress-induced void formation in submicron Al(Cu) interconnect metallization. The discussion is focused on the driving force for void formation which is investigated by examining the nature of the thermal stress and its relaxation characteristics of submicron interconnect structures. The recent experimental results obtained by bending beam and X-ray diffraction techniques on the thermal stress and stress relaxation in Al(Cu) interconnect metallization are reviewed. The results reveal that as passivated Al(Cu) lines become narrower, the metal exhibits increasingly elastic behaviour with higher stress levels, a combination of stress characteristics which favour void formation. Stress relaxation behaviour has been investigated in Al(Cu) line structures with line widths of 3, 1 and 0.5 microns at 150, 200 and 250/spl deg/C. Results are consistent with a thermally activated dislocation glide mechanism and the kinetics is controlled by a combined effects of mass transport (diffusion) and shear stress (driving force). Results of these studies and their impact on stress voiding are discussed.



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