Conferences related to Space cooling

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Space cooling

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


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Most published Xplore authors for Space cooling

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Xplore Articles related to Space cooling

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High Tc Superconducting Active Antennas For Space

IEEE Conference Record - Abstracts. 1991 IEEE International Conference on Plasma Science, 1991

None


Discussion on “forced-oil and forced-water circulation for cooling oil-insulated transformers,” at Chicago, May 24, 1907

Proceedings of the American Institute of Electrical Engineers, 1907

Mr. Chesney points out one thing that should be considered in two ways, the extra floor space required. It is true that if one considers the space taken by the condenser outfit for cooling the oil and the extra pumping apparatus necessary, more floor space may be required, but that extra floor space can usually be found in most stations. ...


Packet Transport Trends: IP/MPLS Success Challenged as Deployment Footprint Expands

IEEE Communications Magazine, 2008

For most of the last decade, the prevailing industry assumption was that large public networks would migrate all services, transport, and switching to a single end-to-end IP/MPLS network - convergence. This assumption was validated by significant growth in IP/MPLS investment. Looking to the future, economic forces that affect suppliers, as much as operators, are challenging this assumption, and other scenarios ...


A Dynamic Cooling Load Calculation Method for Cooled Ceiling Systems

2009 International Conference on Energy and Environment Technology, 2009

The purpose of this research was to develop a sensible cooling load calculation method for cooled ceiling (CC) systems. It was presented that cooling load of CC systems are different from those of the all-air (AA) systems by analyzing heat transfer mechanisms of CC panels and AA systems. A cooling load calculation method for CC systems was developed based on ...


Two-dimensional Simulation Of A Two-phase, Regenerative Pumped Radiator Loop Utilizing Direct Contact Heat Transfer With Phase Change

Proceedings of the 25th Intersociety Energy Conversion Engineering Conference, 1990

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Educational Resources on Space cooling

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IEEE-USA E-Books

  • High Tc Superconducting Active Antennas For Space

    None

  • Discussion on “forced-oil and forced-water circulation for cooling oil-insulated transformers,” at Chicago, May 24, 1907

    Mr. Chesney points out one thing that should be considered in two ways, the extra floor space required. It is true that if one considers the space taken by the condenser outfit for cooling the oil and the extra pumping apparatus necessary, more floor space may be required, but that extra floor space can usually be found in most stations. The space necessary for the cooling apparatus, the pump and condenser, is not so great as the space occupied by the transformer, and they can usually be put away in some corner in the station. Also in several cases I have found it advisable to install this cooling coil, not in a part of the station but, say, in the tail-race, using the water from the turbine to do the cooling. There is not, therefore, the complication of extra pumping facilities; there would be one set of pumps similar to those that are ordinarily used for forced water circulation in a water-cooled transformer.

  • Packet Transport Trends: IP/MPLS Success Challenged as Deployment Footprint Expands

    For most of the last decade, the prevailing industry assumption was that large public networks would migrate all services, transport, and switching to a single end-to-end IP/MPLS network - convergence. This assumption was validated by significant growth in IP/MPLS investment. Looking to the future, economic forces that affect suppliers, as much as operators, are challenging this assumption, and other scenarios now seem plausible.

  • A Dynamic Cooling Load Calculation Method for Cooled Ceiling Systems

    The purpose of this research was to develop a sensible cooling load calculation method for cooled ceiling (CC) systems. It was presented that cooling load of CC systems are different from those of the all-air (AA) systems by analyzing heat transfer mechanisms of CC panels and AA systems. A cooling load calculation method for CC systems was developed based on the room-heat-balance analysis model. The propose method can be used to estimate cooling loads of CC systems and those of ventilation systems which combined with the CC systems simultaneity. According to the calculation for a model room in Taiyuan, the peak load and average load of CC systems are higher than those of AA systems when the same design temperature of indoor air is adopted. It is revealed that an accurate cooling load calculation method should be used to estimate design cooling loads.

  • Two-dimensional Simulation Of A Two-phase, Regenerative Pumped Radiator Loop Utilizing Direct Contact Heat Transfer With Phase Change

    None

  • Energy Conservation in Existing Building Highlights & Retrofits

    Bell Canada is a telecommunication company operating in the provinces of Ontario and Quebec as well as the North West Territories of Canada. Over 4 000 buildings of all sizes, housing telecommunication equipment, are scattered throughout the territory served by the company.

  • Space-based sentinels for measurement of infrared cooling in the thermosphere for space weather nowcasting and forecasting

    Infrared radiative cooling by nitric oxide (NO) and carbon dioxide (CO2) modulates the thermosphere's density and thermal response to geomagnetic storms. Satellite tracking and collision avoidance planning require accurate density forecasts during these events. Over the past several years, failed density forecasts have been tied to the onset of rapid and significant cooling due to production of NO and its associated radiative cooling via emission of infrared radiation at 5.3 µm. These results have been diagnosed, after the fact, through analyses of measurements of infrared cooling made by the Sounding of the Atmosphere using Broadband Emission Radiometry instrument now in orbit over 16 years on the National Aeronautics and Space Administration Thermosphere, Ionosphere, Mesosphere Energetics and Dynamics satellite. Radiative cooling rates for NO and CO2 have been further shown to be directly correlated with composition and exospheric temperature changes during geomagnetic storms. These results strongly suggest that a network of smallsats observing the infrared radiative cooling of the thermosphere could serve as space weather sentinels. These sentinels would observe and provide radiative cooling rate data in real time to generate nowcasts of density and aerodynamic drag on space vehicles. Currently, radiative cooling is not directly considered in operational space weather forecast models. In addition, recent research has shown that different geomagnetic storm types generate substantially different infrared radiative response, and hence, substantially different thermospheric density response. The ability to identify these storms, and to measure and predict the Earth's response to them, should enable substantial improvement in thermospheric density forecasts.

  • Robust Matched Filters for Target Detection in Hyperspectral Imaging Data

    Most detection algorithms for hyperspectral imaging applications assume a target with a perfectly known spectral signature. In practice, the target signature is either imperfectly measured (target mismatch) and/or it exhibits spectral variability. The objective of this paper is to introduce a robust matched filter that takes the uncertainty and/or variability of target signatures into account. It is shown that, if we describe this uncertainty with an ellipsoid in the spectral space, we can design a matched filter that provides a response of the same magnitude for all spectra within this ellipsoid. Thus, by changing the size of this ellipsoid, we can control the "spectral selectivity" of the matched filter. The ability of the robust matched filter to deal effectively with target mismatch and spectral variability is demonstrated with hyperspectral imaging data from the HYDICE sensor.

  • A bunch stacking (emittance exchange) scheme for a muon collider

    An emittance exchange scheme was studied with a simple simulation model where time-separated muon minibunches were stacked transversely through mini-bunch kicker, a solenoid delay channel, and a septum-type kicker. By stacking N mini muon bunches, we obtain the longitudinal phase space reduction of 1/N in maximum, which then be converted into the increased muon transverse phase space by a factor N in minimum due to the 6 dimensional phase space conservation. Limitations in the efficiency of the emittance exchange in this scheme was discussed. The emittance exchange is a key element to obtain the 10E-5 to 10E-6 phase space cooling in the 6 dimensional muon phase space for a mu+mu-collider.

  • K-Rb-lamp-pumped conductively cooled Nd:YAG laser

    None



Standards related to Space cooling

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IEEE Standard for Space Applications Module, Extended Height Format E Form Factor

This standard establishes the design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments. The requirements herein serve to specify the mechanical design of the module.



Jobs related to Space cooling

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