Conferences related to Soldering equipment

Back to Top

2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

The conference will provide a forum for discussions and presentations of advancements inknowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


More Conferences

Periodicals related to Soldering equipment

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


More Periodicals

Most published Xplore authors for Soldering equipment

Back to Top

Xplore Articles related to Soldering equipment

Back to Top

Low Cost Flip Chip Technology

IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference], 1997

None


Thermal aspects of soldering equipments

26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003., 2003

The soldering equipment mainly determines the quality of soldering process. Assuring the right temperature is one of the goals imposed by a reliable soldering process. The soldering environment must be controlled to fulfill a lot of requirements. The main issue is to avoid exceeding the maximum admitted absorbed energy (temperature*time). On the other side, an insufficient heating (less absorbed energy ...


Introducing engineering to young women through nontraditional products

32nd Annual Frontiers in Education, 2002

Faculty members at Mass Bay Community College (MBCC) and the University of Maine (UM) are finding ways to use nontraditional products to attract and retain women students. At MBCC young women exploring engineering careers create jewelry designs using three-dimensional Computer Aided Design and Drafting (3D-CADD) software. Students enrolled in engineering graphics courses select their own products to represent graphically. At ...


Influences of Impurities on wave soldering properties for Sn-9Zn solders

2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2005

Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the ...


In situ non contact temperature measurements on PCB during soldering process

2008 31st International Spring Seminar on Electronics Technology, 2008

The paper deals with investigation of non-contact electronic components' temperature measurements during soldering of surface mounted devices (SMD) to printed circuit boards (PCB). Approach and equipment for non contact temperature measurements with infrared (IR) thermometer is proposed. Measurements of electronic components' temperature on the PCB are difficult and practically impossible for a lot of electronic components during soldering process. In ...


More Xplore Articles

Educational Resources on Soldering equipment

Back to Top

IEEE-USA E-Books

  • Low Cost Flip Chip Technology

    None

  • Thermal aspects of soldering equipments

    The soldering equipment mainly determines the quality of soldering process. Assuring the right temperature is one of the goals imposed by a reliable soldering process. The soldering environment must be controlled to fulfill a lot of requirements. The main issue is to avoid exceeding the maximum admitted absorbed energy (temperature*time). On the other side, an insufficient heating (less absorbed energy by the solder joint) does inadequate joints or even unsoldering. The reality offers numerous examples of unsoldered areas caused by lack of energy. The soldering equipments may be ordered according how does their job: asynchrony (making joint after joint) and synchrony, making all joint together. The paper intends to present thermal modeling and simulation of a lot of soldering tools. These equipments are studied from thermal point of view. The tools are simulated in a software environment to meet the soldering requirements for a usually application.

  • Introducing engineering to young women through nontraditional products

    Faculty members at Mass Bay Community College (MBCC) and the University of Maine (UM) are finding ways to use nontraditional products to attract and retain women students. At MBCC young women exploring engineering careers create jewelry designs using three-dimensional Computer Aided Design and Drafting (3D-CADD) software. Students enrolled in engineering graphics courses select their own products to represent graphically. At UM girls introduced to 3D-CADD software are encouraged to imagine objects to model. The UM Women in the Curriculum (WIC) program has awarded grants for mentoring girls at a summer 3D-CADD camp and for a study of the feasibility of developing a weave room in the School of Engineering Technology. A small stained glass laboratory where young women can use 3D-CADD, small machine tools, and soldering equipment is also under development.

  • Influences of Impurities on wave soldering properties for Sn-9Zn solders

    Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the soldering process becomes higher. With regards to protecting electronic components from heat, the soldering process in low temperature is desirable. Therefore, Sn-Zn system solders are expected as the candidate solders able to produce PWBs in lower temperature soldering process. Sn-8Zn-3Bi solder is practically used for the reflow soldering process. However, the wave soldering process using Sn-Zn solders has scarcely been investigated. So, the study of the influences of Cu addition on wave soldering before is investigated. In this study, the influence of several kinds of impurity on the properties of wave soldering for Sn-Zn system solder is discussed by using small sized wave soldering equipment. As a result, it was found that the solderabilities of Sn-Zn solder became worse by the addition of Cu, especially in solder bridging. It is thought that this is because of the rise of liquidus line on Sn-9Zn alloy to the addition of Cu. Therefore, the impurity level of Cu on Sn-9Zn solder should control under the content of 0.1%

  • In situ non contact temperature measurements on PCB during soldering process

    The paper deals with investigation of non-contact electronic components' temperature measurements during soldering of surface mounted devices (SMD) to printed circuit boards (PCB). Approach and equipment for non contact temperature measurements with infrared (IR) thermometer is proposed. Measurements of electronic components' temperature on the PCB are difficult and practically impossible for a lot of electronic components during soldering process. In this paper the results concerning possibility for IR temperature measurements' application for in situ control of soldering processes are presented. Soldering equipment is based on low inert heaters for the middle IR spectral region without conveyor belt and allows realizing precise measurement and control (in situ) of the temperature on the PCB during the soldering processes, possibility of individual temperature profile for every printed board in dependence of its size, electronic components density and others. Contact temperature measurements (by thermocouples) in a few point on PCB allows controlling the soldering process, but the temperature is measured mostly in one or two points. Application of proposed method and equipment allows to optimize temperature regimes' control during soldering cycles and to avoid thermal damages of electronic components.

  • Reflow soldering processes development using infrared thermography

    Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. The printed circuit board (PCB) of the device is relatively big with different electronic components density in different zones of its surface. Used electronic components demand precise soldering cycle parameters realization. Temperature monitoring of the whole PCB's surface necessary for technological operation development practically is impossible by conventional measurement techniques. Good results are obtained using IR thermography with IR camera for the middle IR spectral region. Results of this investigation allow adjusting proper regime of operation of the soldering equipment and successful realization of soldering processes.

  • Contributions on low-cost /spl mu/BGA soldering/re-soldering methods

    The /spl mu/BGA soldering process is usually performed in special soldering equipment, under extreme conditions of humidity and temperature. The re- working process of such devices is not recommended due to the complex equipment needed for de-soldering and re-soldering of /spl mu/BGA capsules. However, the rapid prototyping process of electronic modules sometimes calls for some "home-made" methods to re-work the /spl mu/BGA capsules. The paper proposes a low-cost solution for /spl mu/BGA soldering/re-soldering process by using mostly common tools for re-working. The main topics covered by the paper are: balls array growth/re-growth process, hand soldering/re-soldering of /spl mu/BGA capsules, tips on oven soldering/re-soldering of /spl mu/BGA modules, testing the /spl mu/BGA soldering and humidity cautions on /spl mu/BGA soldering. The paper also proposes a new method of calibration for the soldering temperature of a small oven.

  • Development of reflow soldering processes using heaters' operation control

    Investigation deals with development of reflow soldering processes for some kinds of electronics components, difficult for soldering to PCBs, such as BGA (ball grid array) packages and LEDs mounted on metal substrates. Soldering processes for such kind of objects are complicated and failures are more probable. To solve these problems new kind of soldering equipment is proposed to be used. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. Experiments show that by proper control of the operation of the heaters, of gas flow circulation and by some small changes in the heating camera desirable temperature profiles can be realized and problems with soldering can be solved successfully.

  • Heat transfer modeling for soldering processes of SMD's to printed circuit boards using low inert infrared heaters

    The investigation deals with soldering processes modeling in machines for surface mounting technologies (SMT) with new type of low inert heaters for the middle infrared spectral region. Its purpose is to be used for electronic control in soldering techniques for surface mounted devices (SMD). The approach to thermodynamic processes description is considered. The main parameters of heat transfer processes are analyzed. The proposed model describes heat transfer processes in soldering camera as a function of time and camera dimensions. The influence of the main parameters of heaters' operation and hot gas circulation in the camera on the temperature distribution upon the PCB (printed circuit boards) is investigated

  • Thermal management system for reflow oven

    The internal thermal environment of a reflow oven is a complex 3D temperature distribution. Controlling an accurate reflow process requires to know the inside temperature distribution. Not all soldering equipments have mobile temperature systems built in. Usually, the oven designer doesn't include a monitoring measurement system that can control the instantaneous temperature at the PCB level. The lack of completed information about each solder joint, could produce an unstable quality of the soldering process. This is the reason we started a project to build a high-resolution temperature measurement system. The sensors are wire thermocouples to assure a high mobility. The system core contains a data acquisition card developed in our center. The application software takes into account the requirements for accurate temperature measurements. All details of this project are described in the paper.



Standards related to Soldering equipment

Back to Top

No standards are currently tagged "Soldering equipment"


Jobs related to Soldering equipment

Back to Top