Conferences related to Soldering
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2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
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2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)
Promote science and engineering of photovoltaic materials, devices, systems and applications
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2017 IEEE 44th Photovoltaic Specialists Conference (PVSC)
scientific and engineering technical conference covering all aspects of photovoltaics materials, devices, systems and reliability
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2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)
scientific and engineering technical conference covering all aspects of photovoltaics materials, devices, systems and reliability
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2015 IEEE 42nd Photovoltaic Specialists Conference (PVSC)
scientific and engineering technical conference covering all aspects of photovoltaics materials, devices, systems and reliability
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2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)
The PVSC is a technical conference dedicated to the science and application of photovoltaics for solar electricity generation. Technical Program Areas: 1. Fundamentals and New Concepts for Future Technologies 2. Thin Film Polycrystalline Photovoltaics 3. III-V and Concentrator Technologies 4. Crystalline Silicon Technologies 5. Thin Film Silicon Based PV Technologies 6. Organic Photovoltaics 7. Space Technologies 8. Characterization and Measurement Methods 9. PV Modules and Manufacturing 10. PV Systems and Applications 11. PV Velocity Forum
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2013 IEEE 39th Photovoltaic Specialists Conference (PVSC)
With this conference, we will continue the Photovoltaic Specialist's role as the premier technical conference covering all aspects of PV technology from basic material science to installed system performance. We also continue our vibrant Industrial Exhibition that brings our PV scientist and engineers together with the PV industry.
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2012 IEEE 38th Photovoltaic Specialists Conference (PVSC)
Discuss the latest technology in the field of Photovoltaics.
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2011 37th IEEE Photovoltaic Specialists Conference (PVSC)
Discuss the latest technology in the field of Photovoltaics.
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2010 35th IEEE Photovoltaic Specialists Conference (PVSC)
Discuss latest tecnololgy in the field of Photovoltaics
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2009 34th IEEE Photovoltaic Specialists Conference (PVSC)
To present groundbreaking research papers on all aspects of PV relevant materials, devices, systems and applications.
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2008 33rd IEEE Photovoltaic Specialists Conference (PVSC)
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2006 IEEE 4th World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC & PSEC)
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2005 31st IEEE Photovoltaic Specialists Conference (PVSC)
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2003 IEEE 3rd World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC & PSEC)
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2002 29th IEEE Photovoltaic Specialists Conference (PVSC)
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2000 28th IEEE Photovoltaic Specialists Conference (PVSC)
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1998 IEEE 2nd World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC & PSEC)
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1997 26th IEEE Photovoltaic Specialists Conference (PVSC)
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1996 25th IEEE Photovoltaic Specialists Conference (PVSC)
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Premier components, packaging and technology
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2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
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2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)
ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
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2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
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2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)
ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
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2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)
Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.
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2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)
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2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)
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2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)
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2005 IEEE 55th Electronic Components and Technology Conference (ECTC 2005)
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2004 IEEE 54th Electronic Components and Technology Conference (ECTC 2004)
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2003 IEEE 53rd Electronic Components and Technology Conference (ECTC 2003)
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2002 IEEE 52nd Electronic Components and Technology Conference (ECTC 2002)
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2001 IEEE 51st Electronic Components and Technology Conference (ECTC 2001)
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2000 IEEE 50th Electronic Components and Technology Conference (ECTC 2000)
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1999 IEEE 49th Electronic Components and Technology Conference (ECTC '99)
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1998 IEEE 48th Electronic Components and Technology Conference (ECTC '98)
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1997 IEEE 47th Electronic Components and Technology Conference (ECTC '97)
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1996 IEEE 46th Electronic Components and Technology Conference (ECTC '96)
2019 IEEE International Reliability Physics Symposium (IRPS)
Meeting of academia and research professionals to discuss reliability challenges.
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2018 IEEE International Reliability Physics Symposium (IRPS)
Reliability issues associated with semiconductors, foundries, IoT and other areas
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2017 IEEE International Reliability Physics Symposium (IRPS)
Study of reliability as applied to semiconductor manufacturing, automotive, PV, and other engineering disciplines. International participation.
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2016 IEEE International Reliability Physics Symposium (IRPS)
IRPS addresses state-of-the-art developments in the Reliability Physics of devices, materials, circuits, and products used in electronics industry. IRPS is the venue where important reliability challenges and solutions are first discussed.
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2015 IEEE International Reliability Physics Symposium (IRPS)
Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components
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2014 IEEE International Reliability Physics Symposium (IRPS)
reliability, physics, irps
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2013 IEEE International Reliability Physics Symposium (IRPS)
Reliability studies and applications related to physics in the areas of electronics and solar
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2012 IEEE International Reliability Physics Symposium (IRPS)
For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability.
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2011 IEEE International Reliability Physics Symposium (IRPS)
Reliability analysis related to electronics, semiconductors, solar including test.
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2010 IEEE International Reliability Physics Symposium (IRPS)
Reliability issues related to the electronics industry including solutions
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2009 IEEE International Reliability Physics Symposium (IRPS)
IRPS is the premiere conference in microelectronic reliability and the physics of failure of microelectronic components. This includes the identification of new or the improvement in the understanding and modeling of failure mechanisms in electronic and optoelectronic devices, materials, and systems, as well as the impact of device and circuit design, as well as material and process selection on reliability.
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2008 IEEE International Reliability Physics Symposium (IRPS)
The IRPS offers its attendees technical sessions, tutorials, workshops, a year-in-review seminar and a poster session, all covering state-of-the-art developments in electronic and optoelectronic reliability as well as equipment demonstrations during the symposium.
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2007 IEEE International Reliability Physics Symposium (IRPS)
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2006 IEEE International Reliability Physics Symposium (IRPS)
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2005 IEEE International Reliability Physics Symposium (IRPS)
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2004 IEEE International Reliability Physics Symposium (IRPS)
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2003 IEEE International Reliability Physics Symposium (IRPS)
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2002 IEEE International Reliability Physics Symposium (IRPS)
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2001 IEEE International Reliability Physics Symposium (IRPS)
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2000 IEEE International Reliability Physics Symposium (IRPS)
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1999 IEEE International Reliability Physics Symposium (IRPS)
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1998 IEEE International Reliability Physics Symposium (IRPS)
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1997 IEEE International Reliability Physics Symposium (IRPS)
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1996 IEEE International Reliability Physics Symposium (IRPS)
IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
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IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
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IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
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IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society
The scope of IECON 2017 is in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.
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IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society
IECON 2016 is the 42th Annual Conference of the IEEE Industrial Electronics Society, focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.The objectives of the conference are to provide high quality research and professional interactions for the advancement of science, technology, and fellowship. Papers with new research results are encouraged for submission. IECON 2016 will be held concurrently with the IEEE IES Industry Forum.The world’s industry, research, and academia are cordially invited to participate in the wealth of presentations, tutorials, special sessions, exibitions and social activities, and furthermore, enjoy beautiful Florence.
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IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society
1. Power Electronics & Energy Conversion2. Renewable Energy & Sustainable Development3. Power Systems4. Electrical Machines & Drives5. Mechatronics, Robotics & System Integration6. Motion Control & Haptics7. Control System & Its Applications8. Electric Vehicles & Traction Control9. Sensors, Actuators & Micro/Nanotechnology10. Assistive & Rehabilitation Systems11. Electronic System on Chip & Real Time Embedded Control12. Signal and Image Processing & Computational Intelligence13. Factory Automation & Industrial Informatics14. Information Processing & Its Applications15. Information Communication Technology Based Transportation Systems16. Social Innovation Systems
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IECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society
Applications of power electronics, artificial intelligence, robotics, and nanotechnology in electrification of automotive, military, biomedical, and utility industries.
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IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
Industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.
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IECON 2012 - 38th Annual Conference of IEEE Industrial Electronics
The conference will be focusing on industrial and manufacturing theory and applications of electronics,power, sustainable development, controls, communications, instrumentation and computational intelligence.
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IECON 2011 - 37th Annual Conference of IEEE Industrial Electronics
industrial applications of electronics, control, robotics, signal processing, computational and artificial intelligence, sensors and actuators, instrumentation electronics, computer networks, internet and multimedia technologies.
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IECON 2010 - 36th Annual Conference of IEEE Industrial Electronics
IECON is an international conference on industrial applications of electronics, control, robotics, signal processing, computational and artificial intelligence, sensors and actuators, instrumentation electronics, computer networks, internet and multimedia technologies. The objectives of the conference are to provide high quality research and professional interactions for the advancement of science, technology, and fellowship.
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IECON 2009 - 35th Annual Conference of IEEE Industrial Electronics
Applications of electronics, instrumentation, control and computational intelligence to industrial and manufacturing systems and process. Major themes include power electronics, drives, sensors, actuators, signal processing, motion control, robotics, mechatronics, factory and building automation, and informatics. Emerging technologies and applications such as renewable energy, electronics reuse, and education.
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IECON 2008 - 34th Annual Conference of IEEE Industrial Electronics
Applications of electronics, instrumentation, control and computational intelligence to industrial and manufacturing systems and process. Major themes include power electronics, drives, sensors, actuators, signal processing, motion control, robotics, mechatronics, factory and building automation, and informatics. Emerging technologies and applications such as renewable energy, electronics reuse, and education. Conference will be held
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IECON 2007 - 33rd Annual Conference of IEEE Industrial Electronics
IECON'07 is an international conference on industrial applications of electronics, control, robotics, signal processing, computational and artificial intelligence, sensors and actuators, instrumentation electronics, computer networks, internet and multimedia technologies. The objectives of the conference are to provide high quality research and professional interactions for the advancement of science, technology and fellowship.
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IECON 2006 - 32nd Annual Conference of IEEE Industrial Electronics
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IECON 2005 - 31st Annual Conference of IEEE Industrial Electronics
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IECON 2004 - 30th Annual Conference of IEEE Industrial Electronics
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IECON 2003- 29th Annual Conference of IEEE Industrial Electronics
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IECON 2002- 28th Annual Conference of IEEE Industrial Electronics
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IECON 2001- 27th Annual Conference of IEEE Industrial Electronics
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IECON 2000- 26th Annual Conference of IEEE Industrial Electronics
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IECON '99 - 25th Annual Conference of IEEE Industrial Electronics
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IECON '98 - 24TH Annual Conference of IEEE Industrial Electronics
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IECON '97 - 23rd Annual Conference of IEEE Industrial Electronics
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IECON '96 - 22nd Annual Conference of IEEE Industrial Electronics
2018 13th European Microwave Integrated Circuits Conference (EuMIC)
The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.
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2017 12th European Microwave Integrated Circuits Conference (EuMIC)
The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.
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2016 11th European Microwave Integrated Circuits Conference (EuMIC)
The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.
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2015 10th European Microwave Integrated Circuits Conference (EuMIC)
The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.
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2014 9th European Microwave Integrated Circuits Conference (EuMIC)
The EuMIC conference is jointly organized by GAAS
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2013 European Microwave Integrated Circuit Conference (EuMIC)
RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.
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2012 European Microwave Integrated Circuit Conference (EuMIC)
Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.
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2011 European Microwave Integrated Circuit Conference (EuMIC)
RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.
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2010 European Microwave Integrated Circuits Conference (EuMIC)
EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs
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2009 European Microwave Integrated Circuits Conference (EuMIC)
The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.
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2008 European Microwave Integrated Circuits Conference (EuMIC)
The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.
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2007 European Microwave Integrated Circuits Conference (EuMIC)
RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.
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2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)
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GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium
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Periodicals related to Soldering
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Advanced Packaging, IEEE Transactions on
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Aerospace and Electronic Systems Magazine, IEEE
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Antennas and Propagation, IEEE Transactions on
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Applied Superconductivity, IEEE Transactions on
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Components and Packaging Technologies, IEEE Transactions on
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
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Xplore Articles related to Soldering
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Surface mount on the solder side-a modified process compatible with standard wave soldering
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle, 1988
A modified surface-mount (SM) process suitable for the solder side is described. This process permits wave soldering with standard wave soldering equipment eliminating the problems of solder skips and eliminating the special handling precautions necessary to avoid knocking off glued SM components before wave soldering. The process consists in reflow soldering and adhesive curing simultaneously the solder-side components. This is ...
IEE Colloquium on 'Advances in Interconnection Technology' (Digest No.082)
IEE Colloquium on Advances in Interconnection Technology, 1991
None
Advanced Non-Soldering Interconnection
Electro International, 1991, 1991
The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led ...
Influences of Impurities on wave soldering properties for Sn-9Zn solders
2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2005
Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the ...
Reflow soldering processes development using infrared thermography
2009 32nd International Spring Seminar on Electronics Technology, 2009
Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at ...
More Xplore Articles
Educational Resources on Soldering
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IEEE-USA E-Books
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Surface mount on the solder side-a modified process compatible with standard wave soldering
A modified surface-mount (SM) process suitable for the solder side is
described. This process permits wave soldering with standard wave soldering
equipment eliminating the problems of solder skips and eliminating the special
handling precautions necessary to avoid knocking off glued SM components
before wave soldering. The process consists in reflow soldering and adhesive
curing simultaneously the solder-side components. This is done prior to
conventional mixed-technology assembly (SM and leaded component on the primary
side). As the solder-side SM components are already soldered a conventional
wave-soldering machine can be used with no solder skips. An added benefit is
that the soldered and glued solder-side SM components are so solidly attached
that there is no fear of knocking them off in board handling prior to wave
soldering. Advantages, disadvantages, and concerns of the modified adhesive
process are reviewed. Experimental results comparing the process with the
conventional adhesive process are presented.<<ETX>>
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IEE Colloquium on 'Advances in Interconnection Technology' (Digest No.082)
None
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Advanced Non-Soldering Interconnection
The number of soldered joints per circuit is rapidly increasing, especially on
surface mounted boards. As a result, defective solder joints are becoming the
dominant cause of board failures. Also, there is a move to closer spacing of
connections which leads to solder bridging and difficulty of flux removal and
joint inspection. These, coupled with other solder disadvantages, have led the
military and industrial companies to look for alternative component connection
methods. Because of the high cost of components and the circuit substrates it
is mandatory to be able to replace defective parts easily.
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Influences of Impurities on wave soldering properties for Sn-9Zn solders
Environmental and health concerns with Pb have led to development of lead-free
solders to replace commercial Sn-Pb solders in electronic packaging
applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the
reflow soldering process and the wave soldering process. However, its melting
temperature is about 30 K higher than that of Sn-Pb eutectic, so the
temperature on the soldering process becomes higher. With regards to
protecting electronic components from heat, the soldering process in low
temperature is desirable. Therefore, Sn-Zn system solders are expected as the
candidate solders able to produce PWBs in lower temperature soldering process.
Sn-8Zn-3Bi solder is practically used for the reflow soldering process.
However, the wave soldering process using Sn-Zn solders has scarcely been
investigated. So, the study of the influences of Cu addition on wave soldering
before is investigated. In this study, the influence of several kinds of
impurity on the properties of wave soldering for Sn-Zn system solder is
discussed by using small sized wave soldering equipment. As a result, it was
found that the solderabilities of Sn-Zn solder became worse by the addition of
Cu, especially in solder bridging. It is thought that this is because of the
rise of liquidus line on Sn-9Zn alloy to the addition of Cu. Therefore, the
impurity level of Cu on Sn-9Zn solder should control under the content of 0.1%
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Reflow soldering processes development using infrared thermography
Investigation deals with application of new kind of soldering equipment and
development of reflow soldering processes for electronic devices using this
equipment. It is based on low inert heaters for the middle IR spectral region.
Due to low inertia of the heaters temperature changes in the soldering camera
may be controlled precisely and the soldering cycle may be realized at the
same place without conveyor belt. The printed circuit board (PCB) of the
device is relatively big with different electronic components density in
different zones of its surface. Used electronic components demand precise
soldering cycle parameters realization. Temperature monitoring of the whole
PCB's surface necessary for technological operation development practically is
impossible by conventional measurement techniques. Good results are obtained
using IR thermography with IR camera for the middle IR spectral region.
Results of this investigation allow adjusting proper regime of operation of
the soldering equipment and successful realization of soldering processes.
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Development of reflow soldering processes using heaters' operation control
Investigation deals with development of reflow soldering processes for some
kinds of electronics components, difficult for soldering to PCBs, such as BGA
(ball grid array) packages and LEDs mounted on metal substrates. Soldering
processes for such kind of objects are complicated and failures are more
probable. To solve these problems new kind of soldering equipment is proposed
to be used. It is based on low inert heaters for the middle IR spectral
region. Due to low inertia of the heaters temperature changes in the soldering
camera may be controlled precisely and the soldering cycle may be realized at
the same place without conveyor belt. Experiments show that by proper control
of the operation of the heaters, of gas flow circulation and by some small
changes in the heating camera desirable temperature profiles can be realized
and problems with soldering can be solved successfully.
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Active Thermomechanical Stress Cancellation of Solder Joints in SMD Integrated Circuits
One of the main difficulties that prevent the use of integrated circuits (IC)
with BGA packages in space is the early fatigue of their solder joints. Early
solder fatigue originates in the thermomechanical stress cycles produced by
the different coefficients of thermal expansion (CTE) of the printed circuit
board (PCB) and the IC package and the temperature fluctuations that they
suffer during a space mission. In this work we propose an active cancellation
mechanism to extend the lifetime of the solder joints with minimum energy
consumption and show the simulation results from its modeling.
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Applications '90: industrial electronics
Advances in industrial electronics during 1989 are described. These include:
the use of X-ray scanning-beam laminography to check solder joints on printed-
circuit boards; pressure microsensors based on changing resonance frequency by
applied force; emergence of the service industry as a market for robots; a
computerized facility that allows rapid acquisitions of manufactured parts;
and increased use of modular integrated power functions in power electronics
systems.<<ETX>>
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Systematic procedures for digital system realization from logic design to production
None
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IEE Colloquium on 'Interconnection Technology' (Digest No.1994/220)
None
Standards related to Soldering
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No standards are currently tagged "Soldering"
Jobs related to Soldering
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iPhone Hardware Technician
Apple, Inc.
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IC Packaging Intern
Apple, Inc.
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Associate Hardware Engineer
Apple, Inc.
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FEA Engineer
Apple, Inc.
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RF Lab Manager- Hardware Wireless Design
Apple, Inc.
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Audio Product Design Lab Technician
Apple, Inc.
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Electrical Design Engineer, Laser Products
Thorlabs
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Sr. NFC HW Design Engineer
Apple, Inc.
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Hardware System Integration (Mac/iPad)
Apple, Inc.
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Hardware System Integration Engineer
Apple, Inc.
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Hardware System Integration (Mac/iPad)
Apple, Inc.
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Assembler
Schweitzer Engineering Laboratories, Inc.
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Assembler
Schweitzer Engineering Laboratories, Inc.