Soldering

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that the workpieces are not melted. (Wikipedia.org)


Conferences related to Soldering

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.


2019 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges.


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2018 IEEE 8th International Nanoelectronics Conferences (INEC)

IEEE-INEC 2018 is the 8th in a series of very successful conferences initiated by Nanotech Chapter of IEEE Singapore Section. It provides an international forum for the presentation and discussion of recent advances in the areas of Nanoelectronics, Nanodevices, Nanosystems and IoT.


Periodicals related to Soldering

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Most published Xplore authors for Soldering

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Xplore Articles related to Soldering

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Surface mount on the solder side-a modified process compatible with standard wave soldering

Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle, 1988

A modified surface-mount (SM) process suitable for the solder side is described. This process permits wave soldering with standard wave soldering equipment eliminating the problems of solder skips and eliminating the special handling precautions necessary to avoid knocking off glued SM components before wave soldering. The process consists in reflow soldering and adhesive curing simultaneously the solder-side components. This is ...


IEE Colloquium on 'Advances in Interconnection Technology' (Digest No.082)

IEE Colloquium on Advances in Interconnection Technology, 1991

None


Advanced Non-Soldering Interconnection

Electro International, 1991, 1991

The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led ...


Influences of Impurities on wave soldering properties for Sn-9Zn solders

2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2005

Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the ...


Reflow soldering processes development using infrared thermography

2009 32nd International Spring Seminar on Electronics Technology, 2009

Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at ...


Educational Resources on Soldering

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IEEE.tv Videos

IEEE-USA E-Books

  • Surface mount on the solder side-a modified process compatible with standard wave soldering

    A modified surface-mount (SM) process suitable for the solder side is described. This process permits wave soldering with standard wave soldering equipment eliminating the problems of solder skips and eliminating the special handling precautions necessary to avoid knocking off glued SM components before wave soldering. The process consists in reflow soldering and adhesive curing simultaneously the solder-side components. This is done prior to conventional mixed-technology assembly (SM and leaded component on the primary side). As the solder-side SM components are already soldered a conventional wave-soldering machine can be used with no solder skips. An added benefit is that the soldered and glued solder-side SM components are so solidly attached that there is no fear of knocking them off in board handling prior to wave soldering. Advantages, disadvantages, and concerns of the modified adhesive process are reviewed. Experimental results comparing the process with the conventional adhesive process are presented.<<ETX>>

  • IEE Colloquium on 'Advances in Interconnection Technology' (Digest No.082)

    None

  • Advanced Non-Soldering Interconnection

    The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.

  • Influences of Impurities on wave soldering properties for Sn-9Zn solders

    Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the soldering process becomes higher. With regards to protecting electronic components from heat, the soldering process in low temperature is desirable. Therefore, Sn-Zn system solders are expected as the candidate solders able to produce PWBs in lower temperature soldering process. Sn-8Zn-3Bi solder is practically used for the reflow soldering process. However, the wave soldering process using Sn-Zn solders has scarcely been investigated. So, the study of the influences of Cu addition on wave soldering before is investigated. In this study, the influence of several kinds of impurity on the properties of wave soldering for Sn-Zn system solder is discussed by using small sized wave soldering equipment. As a result, it was found that the solderabilities of Sn-Zn solder became worse by the addition of Cu, especially in solder bridging. It is thought that this is because of the rise of liquidus line on Sn-9Zn alloy to the addition of Cu. Therefore, the impurity level of Cu on Sn-9Zn solder should control under the content of 0.1%

  • Reflow soldering processes development using infrared thermography

    Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. The printed circuit board (PCB) of the device is relatively big with different electronic components density in different zones of its surface. Used electronic components demand precise soldering cycle parameters realization. Temperature monitoring of the whole PCB's surface necessary for technological operation development practically is impossible by conventional measurement techniques. Good results are obtained using IR thermography with IR camera for the middle IR spectral region. Results of this investigation allow adjusting proper regime of operation of the soldering equipment and successful realization of soldering processes.

  • Development of reflow soldering processes using heaters' operation control

    Investigation deals with development of reflow soldering processes for some kinds of electronics components, difficult for soldering to PCBs, such as BGA (ball grid array) packages and LEDs mounted on metal substrates. Soldering processes for such kind of objects are complicated and failures are more probable. To solve these problems new kind of soldering equipment is proposed to be used. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. Experiments show that by proper control of the operation of the heaters, of gas flow circulation and by some small changes in the heating camera desirable temperature profiles can be realized and problems with soldering can be solved successfully.

  • Active Thermomechanical Stress Cancellation of Solder Joints in SMD Integrated Circuits

    One of the main difficulties that prevent the use of integrated circuits (IC) with BGA packages in space is the early fatigue of their solder joints. Early solder fatigue originates in the thermomechanical stress cycles produced by the different coefficients of thermal expansion (CTE) of the printed circuit board (PCB) and the IC package and the temperature fluctuations that they suffer during a space mission. In this work we propose an active cancellation mechanism to extend the lifetime of the solder joints with minimum energy consumption and show the simulation results from its modeling.

  • Applications '90: industrial electronics

    Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed- circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated power functions in power electronics systems.<<ETX>>

  • Systematic procedures for digital system realization from logic design to production

    None

  • IEE Colloquium on 'Interconnection Technology' (Digest No.1994/220)

    None


Standards related to Soldering

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No standards are currently tagged "Soldering"