Conferences related to Software packages

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS '96

  • OCEANS '97

  • OCEANS '98

  • OCEANS '99

  • OCEANS 2000

  • OCEANS 2001

  • OCEANS 2002

  • OCEANS 2003

  • OCEANS 2004

  • OCEANS 2005

  • OCEANS 2006

  • OCEANS 2007

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2009

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications


2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

IECON is focusing on industrial and manufacturing theory and applications of electronics, controls, communications, instrumentation and computational intelligence.



Periodicals related to Software packages

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computational Biology and Bioinformatics, IEEE/ACM Transactions on

Specific topics of interest include, but are not limited to, sequence analysis, comparison and alignment methods; motif, gene and signal recognition; molecular evolution; phylogenetics and phylogenomics; determination or prediction of the structure of RNA and Protein in two and three dimensions; DNA twisting and folding; gene expression and gene regulatory networks; deduction of metabolic pathways; micro-array design and analysis; proteomics; ...



Most published Xplore authors for Software packages

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Xplore Articles related to Software packages

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Network Interactions and Packaged Software: A Win-Win Opportunity

Proceedings. Twenty-Second Annual conference Frontiers in Education, 1992

None


High end microprocessors: Third generation

1979 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1979

This session will focus on the current generation of microprocessors now becoming available from semiconductor manufacturers, which feature, generally, new and innovative architecture proposed to solve system and software problems, such as high level language support, increased addressability, and a rich variety of data types. The role of these new developments for users will be accented.


(CSDA) Software Requirements

(CSDA) Software Requirements, 01/18/2012

This tutorial is part of a series of eLearning courses designed to help you prepare for the examination to become a Certified Software Development Associate (CSDA) or to learn more about specific software engineering topics. Courses in this series address one or more of the fifteen Knowledge Areas that comprise the Software Engineering Body of Knowledge - or SWEBOK, upon ...


Software patterns: Design utilities

Computer, 1996

None


High-end microprocessors

1978 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1978

The problems associated with technology developments, packaging, chip and system characteristics for next generation high-end microprocessors now beginning to appear on the market will be explored in this session.



Educational Resources on Software packages

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IEEE-USA E-Books

  • Network Interactions and Packaged Software: A Win-Win Opportunity

    None

  • High end microprocessors: Third generation

    This session will focus on the current generation of microprocessors now becoming available from semiconductor manufacturers, which feature, generally, new and innovative architecture proposed to solve system and software problems, such as high level language support, increased addressability, and a rich variety of data types. The role of these new developments for users will be accented.

  • (CSDA) Software Requirements

    This tutorial is part of a series of eLearning courses designed to help you prepare for the examination to become a Certified Software Development Associate (CSDA) or to learn more about specific software engineering topics. Courses in this series address one or more of the fifteen Knowledge Areas that comprise the Software Engineering Body of Knowledge - or SWEBOK, upon which the Certification Exam is based. This course is intended to assess your understanding of software requirements through inline quizzes and feedback. The CSDA credential is intended for graduating software engineers and entry- level software professionals and serves to bridge the gap between your educational experience and real-world work requirements. The Software Requirements Knowledge Area (KA) is concerned with the elicitation, analysis, specification and validation of software requirements. It is widely acknowledged within the software industry that software engineering projects are critically vulnerable when these activities are performed poorly. Software requirements express the needs and constraints placed on a software product that contribute to the solution of some real-world problem.

  • Software patterns: Design utilities

    None

  • High-end microprocessors

    The problems associated with technology developments, packaging, chip and system characteristics for next generation high-end microprocessors now beginning to appear on the market will be explored in this session.

  • Displaying processed data

    Data acquisition software that can be used to capture, analyze, view, and assimilate data on product performance is discussed. The capabilities of such software are described. Tables giving information on representative packages are provided.<<ETX>>

  • PC-CAPP-a computer-assisted process planning system for prismatic components

    The paper reports the design and implementation of a computer-assisted process planning system (PC-CAPP) for prismatic components used in the batch production of portable electric tools. The software incorporates various modules for component feature representation; automatic machine, toolings and process parameter selection; set-up planning; production time calculation and finally the report generation. The user-friendly software package has been developed on an IBM PC/XT compatible system. It provides a quick and efficient method for generating consistent process plans.<<ETX>>

  • IEE Colloquium on 'Hypertext' (Digest No.142)

    None

  • Design of zero-current-switching fixed frequency boost and buck converters with coupled inductors

    A boost power converter and a buck power converter are introduced in this paper. The input/output current can be made continuous with extra low ripple using a coupled inductor. Configurations and control strategy for this type of power converter are quite simple. This type of converter has been analyzed by using the MICROTRAN (EMTP) simulation package.<<ETX>>

  • IEE Colloquium on 'Integrity of Automotive Electronic Systems' (Digest No.063)

    None



Standards related to Software packages

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No standards are currently tagged "Software packages"