Conferences related to Slurries

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 IEEE International Ultrasonics Symposium (IUS)

The conference covers all aspects of the technology associated with ultrasound generation and detection and their applications.


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM


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Periodicals related to Slurries

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Xplore Articles related to Slurries

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Research on hot-pressing technology of ferrite hard magnetic materials of light performance

1989 IEEE International Magnetics Conference (INTERMAG), 1989

None


Challenges of CMP Consumables Metrology

ICPT 2012 - International Conference on Planarization/CMP Technology, 2012

Chemical Mechanical Planarization (CMP) has become a method of choice for planarization of metal and oxide layers in microelectronics industry. CMP is a complex chemical and mechanical process that depends heavily on multiple consumable properties and process parameters, in particularly, on the properties of CMP slurries, pads and conditioning disks. This paper describes current gaps in CMP consumable metrologies and ...


Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine

ICPT 2012 - International Conference on Planarization/CMP Technology, 2012

During the process of chemical mechanical planarization (CMP) of copper interconnection of ultra large scale integration (ULSI), benzotriazole (BTA) is the most commonly used inhibitor in the slurry. In this paper, the adsorption mechanisms of BTA were studied by weight loss measurements. The inhibition efficiency increases with an increase in the concentration of BTA. The adsorption of BTA was found ...


Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide

ICPT 2012 - International Conference on Planarization/CMP Technology, 2012

This study focuses on the development of innovative formulations for silicon carbide and silicon nitride polishing with tuneable removal rates and selectivity with respect to silicon oxide dielectric films. The approach involves a unique combination of chemical and mechanical action to polish the inherently hard and chemically inert silicon carbide and silicon nitride films. It is hypothesized that chemical additives ...


Relationship between Spatial Wavelength Pad Surface Profile and Pattern Step-height Reduction with 28 nm Ceria Particle Slurry

ICPT 2012 - International Conference on Planarization/CMP Technology, 2012

SiO2 material removal rate with different size ceria particle slurries were measured. Pad hardness, roughness, pad surface-wafer contact area were observed. Spatial wavelength pad roughness analysis was conducted to quantify pad surface-wafer contact property. Three types of noble diamond disks were employed to generate different pad surface roughness. Harder pad increases blanket oxide film removal rate with larger ceria particle ...


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Educational Resources on Slurries

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IEEE.tv Videos

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IEEE-USA E-Books

  • Research on hot-pressing technology of ferrite hard magnetic materials of light performance

    None

  • Challenges of CMP Consumables Metrology

    Chemical Mechanical Planarization (CMP) has become a method of choice for planarization of metal and oxide layers in microelectronics industry. CMP is a complex chemical and mechanical process that depends heavily on multiple consumable properties and process parameters, in particularly, on the properties of CMP slurries, pads and conditioning disks. This paper describes current gaps in CMP consumable metrologies and explains approaches to the gaps closure.

  • Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and Glycine

    During the process of chemical mechanical planarization (CMP) of copper interconnection of ultra large scale integration (ULSI), benzotriazole (BTA) is the most commonly used inhibitor in the slurry. In this paper, the adsorption mechanisms of BTA were studied by weight loss measurements. The inhibition efficiency increases with an increase in the concentration of BTA. The adsorption of BTA was found to occur on the copper surface according to the Temkin isotherm in the acidic slurries and Langmuir isotherm in the alkaline slurries. The values of Gibbs energy of adsorption suggest the both physisorption and chemisorption of BTA on copper surface in both acidic and alkaline slurries. The results provide further insight into the material removal mechanism during CMP process. Keywords: CMP, Adsorption mechanism, BTA

  • Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide

    This study focuses on the development of innovative formulations for silicon carbide and silicon nitride polishing with tuneable removal rates and selectivity with respect to silicon oxide dielectric films. The approach involves a unique combination of chemical and mechanical action to polish the inherently hard and chemically inert silicon carbide and silicon nitride films. It is hypothesized that chemical additives activate and soften the silicon carbide and/or silicon nitride film surfaces, requiring only minimal abrasive action to remove the softened layers, while keeping the silicon oxide removal rates low. Insight into type of functional groups responsible for selective removal of silicon carbide and silicon nitride films is gained. The effects of the functional group and the backbone structure of the chemical additives are illustrated with several examples. Keywords: Silicon Nitride, Silicon Carbide, Planarization, Chemical Mechanical Polishing, Chemical Additives, Slurry

  • Relationship between Spatial Wavelength Pad Surface Profile and Pattern Step-height Reduction with 28 nm Ceria Particle Slurry

    SiO2 material removal rate with different size ceria particle slurries were measured. Pad hardness, roughness, pad surface-wafer contact area were observed. Spatial wavelength pad roughness analysis was conducted to quantify pad surface-wafer contact property. Three types of noble diamond disks were employed to generate different pad surface roughness. Harder pad increases blanket oxide film removal rate with larger ceria particle slurries, but no significant difference among pads with 28 nm wet colloidal ceria particle slurry. As pad hardness decreases, longer spatial wavelength surface roughness increases. The spatial wavelength pad roughness property, especially in longer wavelength region, has strong relationship with initial step height reduction speed. Semi-blocky type diamond disk creates longer wavelength pad roughness profile compared to the other disk types. Keywords: pad hardness, spatial wavelength, step height, diamond disk

  • Effect of Slurry Chemistry on W CMP Performance

    The removal mechanism of metal is firstly suggested by Kaufman[1]. In metal CMP, especially tungsten, a key step is W oxide formation on W Surface. Thus, the oxidizer is the most important component of slurry. Hydrogen peroxide (H2O2) that has a higher reduction potential is widely used as oxidizer. We could observe that slurry chemistries can affect to the CMP feature. The fundamentals of W CMP have not been fully understood. In this paper, the effect of slurry chemistry on W CMP performance such as tungsten oxide formation was investigated through surface analysis and electrochemical analysis.

  • Magnetic desulfurization of coal

    This work is probably the first systematic attempt at using high gradient magnetic separation techniques in coal slurries. The rationale for magnetic desulfurization of coal resides in the paramagnetism of pyrites and their liberation from the coal substance. Principles of magnetic separation are discussed. A model based on the balance of forces acting on a particle in the vicinity of a magnetized strand is developed. The experimental separator consisted of a laboratory column, packed with either steel wool or screens, inserted in the bore of a solenoid magnet. Experimental results, confirmed the effects of coal particle size and slurry velocity as predicted by the model. Evidence of magnetic action was obtained from the magnetization curves of the coal minerals in the products of separation. Preliminary economic analysis shows promise for the commercial application of the process. Directions for future research are indicated.

  • The Data Processing System of Coal Slurry Pipeline Pressure Based on AMFL

    Aiming at the problem of blocked pipe in coal slurry pipeline transportation process, the transportation experiment platform of coal slime pipeline is built for experiment and research. In order to analyze the pressure distribution and the blockage position of the pipeline, the data processing method was presented which combined average median filtering method and Lab VIEW-AMFL, the data acquisition system of coal slurry pipeline pressure was designed, include of the upper machine and lower machine. Here, the STC12C5A60S2 as the core of the system, collected coal slurry pipeline multiplex pressure data at different position, transmitted the data to the upper machine of Lab VIEW through the RS-232 serial communications, next, analyzed and displayed these data. And many experiments and tests were completed by simulating obstruction of different degree, achieved the multi- channel data acquisition system in Lab VIEW environment, the speed and accuracy of this method are higher than the traditional method.

  • Effect of CMP process on alignment accuracy

    In this paper, experimental results on alignment accuracy in STI (Shallow Trench Isolation) CMP (Chemical Mechanical Polishing) process is presented. The effect of alignment mark tone with sampling number on alignment accuracy is described for various CMP conditions. Our preliminary results show that alignment accuracy of concave alignment mark is better than convex alignment mark and CMP polishing uniformity affects the alignment accuracy in the case of over polishing.

  • Working points on-line intelligent optimization strategy for dredging slurry pipeline transportation

    Based on the analysis of the structure and boundary conditions of a dredge slurry pipeline transport system, a novel working points on-line intelligent optimization strategy was introduced, which uses the pipeline systempsilas specific energy consumption as its optimization goal. It can solve not only the problem of high energy consumption and low efficiency of the optimization methods which use output maximum as their goals, but also the problem that offline static optimization methods canpsilat be applied to the slurry pipeline transport systempsilas working points on-line continuous optimization. Based on the real time process data analysis, this method uses the intelligent technology, such as fuzzy decision and data fusion, to optimize the operating pointspsila parameters. This method doesnpsilat rely on the precise description of the characteristics of slurry pipeline transport system and it can be easily applied to the dredging operation, during which the soil and systempsilas characteristics vary from time to time. Field experiments were carried out to verify the novel optimization strategy. Experiment results show that this method can not only improve the dredging output, but also minimize the fluctuation of slurry concentration and velocity, thus the slurry pipeline transport systempsilas specific energy consumption is lower and its efficiency is higher.



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