Silicon carbide

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Silicon carbide (SiC), also known as carborundum, is a compound of silicon and carbon with chemical formula SiC. (Wikipedia.org)






Conferences related to Silicon carbide

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


ICC 2021 - IEEE International Conference on Communications

IEEE ICC is one of the two flagship IEEE conferences in the field of communications; Montreal is to host this conference in 2021. Each annual IEEE ICC conference typically attracts approximately 1,500-2,000 attendees, and will present over 1,000 research works over its duration. As well as being an opportunity to share pioneering research ideas and developments, the conference is also an excellent networking and publicity event, giving the opportunity for businesses and clients to link together, and presenting the scope for companies to publicize themselves and their products among the leaders of communications industries from all over the world.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Silicon carbide

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Silicon carbide

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Xplore Articles related to Silicon carbide

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On Achievable Rates Over Time-Varying Rayleigh Fading Channels

IEEE Transactions on Communications, 2006

None


New Approach for Error Compensation in Coded V-BLAST OFDM Systems

IEEE Transactions on Communications, 2006

None


Design of a digital muti-curve time-overcurrent relay

IEEE Power Engineering Review, 1991

None


DC arrester test philosophies on recent HVDC projects as use

IEEE Power Engineering Review, 1991

None


Multisystem Rolling Stocks

Electrical Railway Transportation Systems, None

Multisystem rolling stocks employs a traditional configuration for the input stage, which is based on the line frequency transformer and four‐quadrant converters that are tuned to comply with electromagnetic compatibility standards. It is necessary to run the main transformer with different voltage levels and different frequencies, as well as use it as an inductor in the systems. This chapter focuses ...


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Educational Resources on Silicon carbide

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IEEE-USA E-Books

  • On Achievable Rates Over Time-Varying Rayleigh Fading Channels

    None

  • New Approach for Error Compensation in Coded V-BLAST OFDM Systems

    None

  • Design of a digital muti-curve time-overcurrent relay

    None

  • DC arrester test philosophies on recent HVDC projects as use

    None

  • Multisystem Rolling Stocks

    Multisystem rolling stocks employs a traditional configuration for the input stage, which is based on the line frequency transformer and four‐quadrant converters that are tuned to comply with electromagnetic compatibility standards. It is necessary to run the main transformer with different voltage levels and different frequencies, as well as use it as an inductor in the systems. This chapter focuses on the operation of the following multilevel transformers: multivoltage and multifrequency transformers and power electronic traction transformers (PETTs). Multilevel structures allow higher voltage to be adopted in DC section, achieving the goal of increasing the transmittable power with equal transmission losses. The chapter then considers two boost converters whose absorbed current waves have a phase shift of a generic angle. The logical choice for controlling the 4Q converter follows current tracking logic, for which the modulation index m does not appear directly in the control algorithm.

  • A 1Mb DRAM with 33MHz serial I/O ports

    None

  • Entropy Coding With Variable-Length Rewriting Systems

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  • Ultra Heat-Shock Resistant Die Attachment for Silicon Carbide With Pure Zinc

    An ultra heat-shock resistant die-attach structure for a silicon carbide power device was developed. A silicon carbide die with a gold/titanium nitride coating was soldered with pure zinc onto a DBC with a silicon nitride insulator plate. This die-attach structure could resist severe thermal shock in air temperatures between -50°C and 300°C. No substantial change in microstructure was observed at the soldering interface, while conventional high-lead solder forms severe cracking. This die-attach structure can be also applied to other types of high-temperature device applications.

  • Approximate Minimum BER Power Allocation for MIMO Spatial Multiplexing Systems

    None

  • Enhanced Contention Resolution Aloha - ECRA

    Random Access (RA) Medium Access (MAC) protocols are simple and effective when the nature of the traffic is unpredictable and random. In the following paper, a novel RA protocol called Enhanced Contention Resolution ALOHA (ECRA) is presented. This evolution, based on the previous Contention Resolution ALOHA (CRA) protocol, exploits the nature of the interference in unslotted Aloha- like channels for trying to resolve most of the partial collision that can occur there. In the paper, the idea behind ECRA is presented together with numerical simulations and a mathematical analysis of its performance gain. It is shown that relevant performance increases in both throughput and Packet Error Rate (PER) can be reached by ECRA with respect to CRA. A comparison with Contention Resolution Diversity Slotted ALOHA (CRDSA) is also provided.



Standards related to Silicon carbide

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No standards are currently tagged "Silicon carbide"


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