Conferences related to Seminars

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2019 IEEE International Professional Communication Conference (ProComm)

The scope of the conference includes the study, development, improvement, and promotion ofeffective techniques for preparing, organizing, processing, editing, collecting, conserving,teaching, and disseminating any form of technical information by and to individuals and groupsby any method of communication. It also includes technical, scientific, industrial, and otheractivities that contribute to the techniques and products used in this field.


2018 19th International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices (EDM)

EDM 2018 is a significant event aimed at development of scientific schools working on foreground areas of Russian science and technology. The main areas are research, design and implementation of micro/nanostructures, radio and telecommunication devices, power electronicand mechatronic systems which are now related to the development of scientific and technological progress. The conference aims to gather young specialists of the differentuniversities of Russia, CIS and other countries. Invited Russian and foreign specialists will report about the development of science and technologies, perspectives of further development of modern electronics. This conference is focused primarily on the discussion of the fundamental theoretical and technological problems of designing and implementing products of micro- and nanoelectronics, simulation methods, and engineering experiments and physical interpretation of the results of these experiments.


2018 IEEE 34th International Conference on Data Engineering (ICDE)

The annual ICDE conference addresses research issues and state of the art in designing, building, managing, and evaluating advanced data systems and industrial applications.


2018 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference about educational innovations and research in engineering and computing. FIE 2018 continues a long tradition of disseminating results in these areas. It is an ideal forum for sharing ideas; learning about developments in computer science, engineering, and technology education; and interacting with colleagues in these fields.


2018 IEEE Global Engineering Education Conference (EDUCON)

The IEEE Global Engineering Education Conference (EDUCON) 2018 is the ninth in a series of conferences that rotate among central locations in IEEE Region 8 (Europe, Middle East and North Africa). EDUCON is the flagship conference of the IEEE Education Society.


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Periodicals related to Seminars

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Computational Intelligence Magazine, IEEE

The IEEE Computational Intelligence Magazine (CIM) publishes peer-reviewed articles that present emerging novel discoveries, important insights, or tutorial surveys in all areas of computational intelligence design and applications.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Design & Test of Computers, IEEE

IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


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Most published Xplore authors for Seminars

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Xplore Articles related to Seminars

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The IEE seminar on security of distributed control systems

The IEE Seminar on Security of Distributed Control Systems, 2005., 2005

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Sarnoff Labs: 'still crazy' but coping

IEEE Spectrum, 1988

The donation of RCA's David Sarnoff Research Laboratory to SRI International, following GE's acquisition of RCA, is described. Sarnoff's role as a contract research laboratory and its restructuring into three divisions-consumer electronics and information sciences, manufacturing and materials, and solid state-is discussed. Some of the projects of each division are highlighted. The challenge of marketing in Sarnoff's new role, as ...


Senior Seminar and Research: A one Quarter, Capstone Experience in Microelectronics Engineering at the Rochester Institute of Technology

Proceedings. Twenty-Second Annual conference Frontiers in Education, 1992

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Intra-Industry Affairs

LEOMA and the US Laser Industry: The Good and Bad Moves for Trade Associations in Emerging High-Tech Industries, None

LEOMA had several projects aimed solely within the industry itself, with the goal of improving the day-to-day operation of the industry. These projects focused on dissemination of information within the industry through several different surveys and seminars, and on reducing the industry's legal bills through an alternative dispute-resolution agreement. This chapter opens with a discussion on the LEOMA executive seminar. ...


The Transition From Employee To Consultant

Electro International, 1991, 1991

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Educational Resources on Seminars

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IEEE.tv Videos

MicroApps: New Calibration Method Simplifes Measurements of Fixtured Devices (Agilent Technologies)
MicroApps: Different Methods for Capacitor Modelling in High-Frequency PCB-Based Diplexers (National Instruments)
MicroApps: New Technologies and Techniques for Wideband Analysis (Agilent Technologies)
MicroApps: Phase Noise, Allan Variance, and Frequency Reference (Agilent Technologies)
MicroApps: A Streamlined Design Flow Featuring AWR Microwave Offce and Ansys HFSS (AWR)
MicroApps: Streamlining Radio Communication Link Design from Specifcation to Production (AWR)
MicroApps: Flexible RF Stimulus/Response Validation of Emerging Communications Standards (Agilent EEsof)
MicroApps: 802D11ac: Increased Throughput, but How Much? (National Instruments)
MicroApps: Implications of Emerging Technologies on Power Amplifer Manufacturing Test Speed (Agilent Technologies)
MicroApps: Recent Improvement on Y-Factor Noise Figure Measurement Uncertainty (Agilent Technologies)
MicroApps: Flexible Digital Modulation Testing for Satellite Regenerative Payloads (Agilent Technologies)
MicroApps: NI-AWR Integrated Framework for WLAN 802.11ac (AWR)
MicroApps: Radar Design Flow with NI-AWR Integrated Framework (National Instruments)
MicroApps: Advances in Load Pull Simulation (Agilent Technologies)
MicroApps: Effectively Maintain and Troubleshoot Mission Critical Communication Systems in the Field (Agilent Technologies)
MicroApps: Using Digitizers to Characterize Modern Phased Array Antennas
MicroApps: Measurement Advances for Differential and I/Q Devices (Agilent Technologies)
MicroApps: Anatomy of PXI (National Instruments)
MicroApps: Simplifying Microwave Power Amplifer Characterization using Power Meter & Sensors (Agilent Technologies)
MicroApps: Impairment Calibration in Quadrature Systems (National Instruments)

IEEE-USA E-Books

  • The IEE seminar on security of distributed control systems

    None

  • Sarnoff Labs: 'still crazy' but coping

    The donation of RCA's David Sarnoff Research Laboratory to SRI International, following GE's acquisition of RCA, is described. Sarnoff's role as a contract research laboratory and its restructuring into three divisions-consumer electronics and information sciences, manufacturing and materials, and solid state-is discussed. Some of the projects of each division are highlighted. The challenge of marketing in Sarnoff's new role, as it changes its culture from that of a captive research organization to that of one that goes out and sells its services, is noted. The impact of mergers, acquisitions, divestitures, and restructurings in general on corporate R&D in the US is examined.<<ETX>>

  • Senior Seminar and Research: A one Quarter, Capstone Experience in Microelectronics Engineering at the Rochester Institute of Technology

    None

  • Intra-Industry Affairs

    LEOMA had several projects aimed solely within the industry itself, with the goal of improving the day-to-day operation of the industry. These projects focused on dissemination of information within the industry through several different surveys and seminars, and on reducing the industry's legal bills through an alternative dispute-resolution agreement. This chapter opens with a discussion on the LEOMA executive seminar. The 1998 executive seminar was quite successful, both in terms of attendees and in terms of valuable information disseminated at the seminar. Thirty individuals, including several non-LEOMA members, participated in the seminar. The discussion of the COSE Report was universally perceived as very important. The chapter talks about the LEOMA compensation survey and the LEOMA human relations seminar. By mid-1996, nearly all LEOMA members, including all companies with sales over $4 million, had signed the LEOMA Alternative Dispute-Resolution Agreement.

  • The Transition From Employee To Consultant

    None

  • An Introduction to Engineering Through a "Freshman Seminar" Course

    None

  • Radar: A Case History of an Invention was prepared as a Term Report for a Research Seminar in Technological Innovation

    None

  • IEE Seminar on Security of Distributed Control Systems

    None

  • Pricing Model of  Small-Medium Enterprise Mutual Guarantee Bonds with Unexpected Defaults

    In many countries, small and medium-sized enterprises (SMEs) are the principal generators of new jobs and economic activity. If guarantee funds are to be effective, a majority of firms can obtain financial assistance through corporate bonds market. This paper describes the mutual guarantee bond which can be a viable solution to the problem of access to credit from capital market for small and middle-entrepreneurs. This work uses a jump diffusion process to estimate the price of mutual guarantee bonds made under the terms of the China Small Business Financing Program. First, a logistic structural model of mutual guarantee bond is built up. The model was then employed to design the logical pricing model of credit spread when an exogenous default process jumps for the first time. A geometrical attenuation function is introduced to reflect the unexpected default of intensities. Furthermore, the pricing model of collective small-medium corporate bonds as the spot interest rate is assumed to follow Vasicek model. Finally, the work tests the pricing model with one thousand times Monte Carlo methods and offer theoretical background and empirical evidence for further financial innovation as well.

  • An evaluation of components offset and solder spreadability using factorial experiments

    This article presents a comparison of various modifications of surfaces of components and the methods of soldering and their influences on the lead-free solders [1]. The parameters studied were the spreadability of solder and offset components. These properties depend not only on the type of solder but also on the modifying of the surface of components. To evaluate a series of samples we used 3D microscope HAWK QC 5000 NIS Elements BR. The method for analyses of factor effects was chosen the statistical method of Developing of Experiments (DOE) [2]. This work would help to facilitate the selection of suitable material combinations for achieving the highest quality solder joint.



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