6,387 resources related to Semiconductor diodes
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2021 IEEE Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
The scope of the 2020 IEEE/ASME AIM includes the following topics: Actuators, Automotive Systems, Bioengineering, Data Storage Systems, Electronic Packaging, Fault Diagnosis, Human-Machine Interfaces, Industry Applications, Information Technology, Intelligent Systems, Machine Vision, Manufacturing, Micro-Electro-Mechanical Systems, Micro/Nano Technology, Modeling and Design, System Identification and Adaptive Control, Motion Control, Vibration and Noise Control, Neural and Fuzzy Control, Opto-Electronic Systems, Optomechatronics, Prototyping, Real-Time and Hardware-in-the-Loop Simulation, Robotics, Sensors, System Integration, Transportation Systems, Smart Materials and Structures, Energy Harvesting and other frontier fields.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.
1961 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1961
1991 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1991
AIEE No 59-1962 (Supersedes AIEE No. 59, 1956 and 59A, 1962), 1962
Definitions given herein apply specifically to semiconductor components used for rectification or control of electric power, or both. For the purpose of this standard, a semiconductor rectifier component is a semiconductor rectifier cell, rectifier diode, or rectifier stack. Note that the name of the actual semiconductor material (selenium, silicon, etc.) may be substituted in place of the word "semiconductor" in ...
1960 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1960
1965 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1965
GaN HEMTs and Schottky Diodes
ITRI: Technology Advances in Flexible Displays and Substrates
2011 Medal of Honor - Morris Chang
APEC 2012 - Dan Kinzer Plenary
The Future of Semiconductor: Moore's Law Plus - IEEE Rebooting Computing Industry Summit 2017
Micrel Ripple Blocker
Semiconductor Nanowires for Optoeletronics Applications: An IPC Keynote with Chennupati Jagadish
Infineon: Innovative Semiconductor Solutions
APEC 2011-PSMA Power Technology Roadmap 2011 Summary
2011 IEEE Medal of Honor: Morris Chang
IEEE Medal of Honor Recipient (2008): Dr. Gordon Moore
Ching W. Tang, Stephen R. Forrest and Mark E. Thompson receive the IEEE Jun-Ichi Nishizawa Medal - Honors Ceremony 2017
Neuromorphic computing with integrated photonics and superconductors - Jeffrey Shainline: 2016 International Conference on Rebooting Computing
Semiconductor Laser Development at Hisense Photonics - Yanfeng Lao - IPC 2018
Honors 2020: Susumu Kohyama Wins the IEEE Robert N. Noyce Medal
IMS 2015: Jonas Zmuidzinas - John Tucker Special Tribute - The High-Frequency Limits of SIS Receivers
KeyTalks: Every Application Needs Power
Rebooting Computing: SRC Related Efforts - Steven Hillenius: 2016 International Conference on Rebooting Computing
Definitions given herein apply specifically to semiconductor components used for rectification or control of electric power, or both. For the purpose of this standard, a semiconductor rectifier component is a semiconductor rectifier cell, rectifier diode, or rectifier stack. Note that the name of the actual semiconductor material (selenium, silicon, etc.) may be substituted in place of the word "semiconductor" in the name of the components.Only those definitions likely to be needed by the user are included.
A monolithic IC operational amplifier that provides high speed in inverting applications has been developed. Full-power bandwidth of 2 MHz, open-loop gain of 300 at 1 MHz and stable response with capacitive load have been achieved.
A 5 × 9 telephone crosspoint array with DIP packaging will be described. Cost, control, space, insertion loss, isolation, power consumption and comparative reliability advantages will be assessed.