Semiconductor device manufacture
4,144 resources related to Semiconductor device manufacture
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2021 IEEE Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.
IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...
Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS), 1994
Deficiencies in the traditional approach to ensuring product reliability (e.g. package level testing) were first noted way back in the early 1970's. However, it was not until the late 1980's to early 1990's that WLRC was seriously considered and began to be implemented across the industry. This new approach for achieving greater levels of reliability required a fundamental change from ...
Proceedings of International Symposium on Semiconductor Manufacturing, 1995
Tries to evaluate the investment effect ofthe whole factory by grasping the process cost precisely, classifying its structure, and identifying useless cost factors. As an evaluation index, we defined and used the CPO (Cost of Process Ownership), which is the cost per wafer in each process step based on the configuration of equipment installed in the factory and the configuration ...
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405), 1999
In semiconductor manufacturing, front end scaling (i.e. Moore's Law) continues to hold for the forseeable future. Unfortunately, the back-end processes of package assembly, burn-in and test all require wafer singulation before any of these processes can occur. Singulation immediately forces a linearly increasing cost model, scaling with the number of die/wafer, and prevents a wafer scaling cost model. FormFactor looked ...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1999
The manufacturing of high-quality and reliable semiconductor memories is very important. Many memory testing algorithms have been proposed to improve the quality of semiconductor memories by screening out different memory functional faults. However, the relationships between memory function fault types and the types of defects which cause the functional faults are not well understood. Therefore, the effectiveness of memory testing ...
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, 1992
Overview of SDRJ - Yoshihiro Hayashi at INC 2019
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
Obtaining a US patent with Dr. William Tonti
The Era of AI Hardware - 2018 IEEE Industry Summit on the Future of Computing
Robotics History: Narratives and Networks Oral Histories:Hendrik Van Brussel
One HTS Josephson Junction, An Array of Applications: Has anything come from HTS devices in the last 30 years?
Micrel Ripple Blocker
IMS 2011 Microapps - Beyond the S-Parameter: The Benefits of Nonlinear Device Models
ASC-2014 SQUIDs 50th Anniversary: 2 of 6 - John Clarke - The Ubiquitous SQUID
2011 Medal of Honor - Morris Chang
Semiconductor Nanowires for Optoeletronics Applications: An IPC Keynote with Chennupati Jagadish
APEC 2012 - Dan Kinzer Plenary
LPIRC: On Device Vision, Google AI-Style
IMS 2011 Microapps - Advanced Terahertz Device Characterization
Infineon: Innovative Semiconductor Solutions
The Future of Semiconductor: Moore's Law Plus - IEEE Rebooting Computing Industry Summit 2017
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
2011 IEEE Medal of Honor: Morris Chang
Deficiencies in the traditional approach to ensuring product reliability (e.g. package level testing) were first noted way back in the early 1970's. However, it was not until the late 1980's to early 1990's that WLRC was seriously considered and began to be implemented across the industry. This new approach for achieving greater levels of reliability required a fundamental change from the mind set of reliability verification on finished products (screening the outputs) to comprehending and controlling the various factors that determine reliability (controlling the inputs). This mind set is known as "building-in" or "designing-in" reliability and envisions a total reliability assurance and improvement strategy that is executed at all stages of semiconductor manufacturing. To meet the challenge of continuous improvement, it is now a corporate policy that a WLRC program be required at all R&D and production facilities with the intention of determining and eliminating all faults at their source of origin. Emphasis is placed on the use of wafer level reliability testing for introducing and qualifying new semiconductor technology and controlling production once technology has been transferred to the wafer fab. The description, philosophy and issues of integrating the WLRC program into a manufacturing environment have been described previously. Here a practical application is presented. As an example, the development, execution and results of a WLR qualification and production control plan for an advanced, submicron, triple-level metal CMOS process is provided.
Tries to evaluate the investment effect ofthe whole factory by grasping the process cost precisely, classifying its structure, and identifying useless cost factors. As an evaluation index, we defined and used the CPO (Cost of Process Ownership), which is the cost per wafer in each process step based on the configuration of equipment installed in the factory and the configuration of product types manufactured there. This index was developed by making some improvements to the CEO (Cost of Equipment Ownership) model. We will report the definition ofthe CPO we are using and some examples of CPO utilization.
In semiconductor manufacturing, front end scaling (i.e. Moore's Law) continues to hold for the forseeable future. Unfortunately, the back-end processes of package assembly, burn-in and test all require wafer singulation before any of these processes can occur. Singulation immediately forces a linearly increasing cost model, scaling with the number of die/wafer, and prevents a wafer scaling cost model. FormFactor looked at the issues preventing wafer- level back-end processing, and postulated that the highest probability of success would require an approach that integrated the previously separate disciplines of materials, package assembly, burn-in, and test. The connection element to the test and burn-in systems was identified as a primary enabler or inhibitor. In this paper, we briefly describe a wafer-level back-end flow, the chip scale package that this process defines, and the early results observed with this flow and package.
The manufacturing of high-quality and reliable semiconductor memories is very important. Many memory testing algorithms have been proposed to improve the quality of semiconductor memories by screening out different memory functional faults. However, the relationships between memory function fault types and the types of defects which cause the functional faults are not well understood. Therefore, the effectiveness of memory testing algorithms based on the functional fault models cannot be realistically determined. This paper evaluates the effectiveness of the memory testing algorithms based on the defect coverage by comparing the defect coverage of known memory testing algorithms and the functional fault coverage of the same testing algorithms using the same defect statistics. The experimental results show that the differences among the defect coverage of the 11 memory testing algorithms other than checkerboard and sliding diagonal tests were not significant as previously believed using memory functional fault coverage as the coverage metric.
Throughout its history, the CATV industry has seen an increasing demand for extended system bandwidth. The latest move raises the upper frequency limit to 400 MHz, thus providing space for 52 channels.
A ceramic BGA packaging technology for broadband applications such as LMDS and SONET/SDH is described. The package is designed for the bandwidth of DC-32 GHz. Manufactured on VIA/PLANE/sup (R)/ using semiconductor processing techniques in an array format, it provides the ability to assemble and test the devices in arrays for maximum productivity. The paper describes the electromagnetic modeling, design, manufacture and testing of the package. Its electrical performance is compared with the theoretical model. The thermal model of the package with device on PCB is also presented. The package attributes are compared with the conventional leaded, microstrip/stripline and leadless formats.
Developing testable products cost-effectively requires that a standard, such as JTAG and the IEEE P-1149, be adopted. The system developer and semiconductor manufacturer need to share in this development effort to accelerate adoption. The system developer must gain a better understanding of the total cost of ownership for a testable vs. a nontestable product and the semiconductor manufacturer must be willing to provide initial product offerings before a well defined and quantified market exists. Efforts must be put in place to implement standards in software tools and data formats required to support test.<<ETX>>
Burn-in effectiveness is modeled as a function of time, temperature, electrical stress, stress coverage and failure mechanism. Actual field data for a variety of products is used to validate or deduce the relevant burn-in parameters. The modeling of burn-in is discussed to show the importance of the acceleration and stress coverage of the burn-in and of the failure distribution of the product. The modeling of burn-in is used to explain the failure characteristics of products which experience burn-in. The modeling of the characteristics of the failure distribution of burned-in product was used to analyze several experimental or reliability data sets to either validate or deduce the relevant parameter estimates for the specific burn-in. The modeling also extracts the relevant burn-in parameters from an analysis of field reliability performance.<<ETX>>
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry. Thermal transient testing, a well known technique for thermal characterization of IC packages can be a suitable method for detecting hermeticity failures in packaged semiconductor and MEMS devices. In the paper this measuring technique is evaluated. Experiments were done on different measurement setups at different environment temperature and RH levels. Based on the results, a new method for package hermeticity testing is proposed.
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