Conferences related to Scanning probe data storage

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2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


GLOBECOM 2020 - 2020 IEEE Global Communications Conference

IEEE Global Communications Conference (GLOBECOM) is one of the IEEE Communications Society’s two flagship conferences dedicated to driving innovation in nearly every aspect of communications. Each year, more than 2,900 scientific researchers and their management submit proposals for program sessions to be held at the annual conference. After extensive peer review, the best of the proposals are selected for the conference program, which includes technical papers, tutorials, workshops and industry sessions designed specifically to advance technologies, systems and infrastructure that are continuing to reshape the world and provide all users with access to an unprecedented spectrum of high-speed, seamless and cost-effective global telecommunications services.


ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

The ICASSP meeting is the world's largest and most comprehensive technical conference focused on signal processing and its applications. The conference will feature world-class speakers, tutorials, exhibits, and over 50 lecture and poster sessions.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


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Periodicals related to Scanning probe data storage

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Scanning probe data storage

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Xplore Articles related to Scanning probe data storage

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Conductive Polymer Patternd Media for Scanning Multiprobe Data Storage

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007

This paper reports on the fabrication and evauation of a conductive polymer dot array as a patterned medium for scanning multiprobe data storage system based on the technology of scanning probe microscopy (SPM). The dot array was formed by electron beam lithography and selective electrolytic polymerization from self-assembled monolayer on Au surface. The conductance of the conductive polymer dots was ...


Air-bearing sliders and plane-plane-concave tips for atomic force microscope cantilevers

Journal of Microelectromechanical Systems, 2000

This paper explores strategies for fabricating and maintaining a sharp atomic force microscope (AFM) tip suitable for AFM data storage applications. To this end, AFM cantilevers have been incorporated into micromachined sled carriers and air-bearing sliders. These supports act to limit the maximum loading force on the AFM tip and allow for improved vibration immunity for the AFM cantilever in ...


Liar!

IEEE Spectrum, 2010

I'm here to investigate No Lie MRI, a San Diego company that is offering US $5000 "truth-verification" sessions. Around my head, a superconducting electromagnet cooled to within a few degrees of absolute zero generates a magnetic field that's about 50000 times as strong as Earth's.


A new approach for CMOS-compatible fabrication of cantilever/tip systems for probe-storage applications

2009 Ph.D. Research in Microelectronics and Electronics, 2009

In this work an original approach for the fabrication of the mechanical part of the Millipede, a MEMS-based scanning-probe data storage system, is reported. It allows the integration of both mechanical and electronic parts on the same wafer, by using CMOS-compatible processes. The proposed approach is based on the selective etching of p-type silicon, used as a sacrificial layer, with ...


An Analog Frontend Chip for a MEMS-Based Parallel Scanning-Probe Data-Storage System

2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers., 2006

We present a 32-channel analog frontend chip for a parallel scanning-probe data-storage system ("millipede"-project). The chip include all circuitry required to control the thermomechanical write-process that forms nanoscale indentations in a polymer surface. The on-chip read-channel circuitry is able to reliably detect the tiny signal-current obtained with the thermoelectrical read-process in the presence of a 1000 times larger bias current


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Educational Resources on Scanning probe data storage

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IEEE.tv Videos

Q&A with Dr. Sorel Reisman: IEEE Big Data Podcast, Episode 2
The Memory of Cars Talk by Tom Coughlin
What's New in Storage Devices - Jim Gathman from IBM
Future of Computing: Memory/Storage - Steve Pawlowski - ICRC San Mateo, 2019
Towards a distributed mm-scale chronically-implantable neural interface - IEEE Brain Workshop
IEEE World Forum on Internet of Things - Milan, Italy - Sara Foresti - Data Security and Privacy in the Internet of Things - Part 3
Q&A with Dejan Milojicic: IEEE Big Data Podcast, Episode 7
Technology for Health Summit 2017 - Panel II: Managing the data deluge linked to connected technology in health
A Discussion on Hard Drives
Kees Immink, 2017 IEEE Medal of Honor
Q&A with Dr. K. J. Ray Liu: IEEE Big Data Podcast, Episode 11
A 200um x 200um x 100um, 63nW, 2.4GHz Injectable Fully-Monolithic Wireless BioSensing System: RFIC Industry Showcase 2017
Implantable, Insertable and Wearable Micro-optical Devices for Early Detection of Cancer - Plenary Speaker, Christopher Contag - IPC 2018
Edge To Core To Cloud IoT infrastructure For Distributed Analytics - Yogev Shimony and Phil Hummel, Fog World Congress 2017
NFV And 5G In A Fog Computing & Networking Environment - Farid Singh and Raghu Kondapalli, Fog World Congress 2017
Validating Cyber-Physical Energy Systems, Part 1: IECON 2018
Real-time Spectrogram Analysis of Continuous Optical Wavefields - José Azaña - Closing Ceremony, IPC 2018
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
WIE ILC: Exception to Expectation: Women in Engineering
HKN: The Next Big Thing Panel

IEEE-USA E-Books

  • Conductive Polymer Patternd Media for Scanning Multiprobe Data Storage

    This paper reports on the fabrication and evauation of a conductive polymer dot array as a patterned medium for scanning multiprobe data storage system based on the technology of scanning probe microscopy (SPM). The dot array was formed by electron beam lithography and selective electrolytic polymerization from self-assembled monolayer on Au surface. The conductance of the conductive polymer dots was electrochemically changed by the application of voltages with a conductive SPM tip. It is demonstrated that conductive polymer possesses the potential ability for the patterned media of scanning probe data storage systems.

  • Air-bearing sliders and plane-plane-concave tips for atomic force microscope cantilevers

    This paper explores strategies for fabricating and maintaining a sharp atomic force microscope (AFM) tip suitable for AFM data storage applications. To this end, AFM cantilevers have been incorporated into micromachined sled carriers and air-bearing sliders. These supports act to limit the maximum loading force on the AFM tip and allow for improved vibration immunity for the AFM cantilever in comparison to macroscopic loading schemes. Readback from a patterned rotating disk has been demonstrated using these devices. Silicon- carbide AFM cantilevers with diamond tips have been fabricated in a process compatible with that of the sleds and sliders. Molded silicon-nitride tips defined by the intersection of three surfaces have also been fabricated for AFM cantilevers. The molds for plane-plane-concave tips are defined by two silicon {111} planes and a silicon-dioxide curved surface. By geometry, the three surfaces necessarily have a unique intersection point, which may improve the consistency in sharpness of these tips relative to conventional pyramidal tips.

  • Liar!

    I'm here to investigate No Lie MRI, a San Diego company that is offering US $5000 "truth-verification" sessions. Around my head, a superconducting electromagnet cooled to within a few degrees of absolute zero generates a magnetic field that's about 50000 times as strong as Earth's.

  • A new approach for CMOS-compatible fabrication of cantilever/tip systems for probe-storage applications

    In this work an original approach for the fabrication of the mechanical part of the Millipede, a MEMS-based scanning-probe data storage system, is reported. It allows the integration of both mechanical and electronic parts on the same wafer, by using CMOS-compatible processes. The proposed approach is based on the selective etching of p-type silicon, used as a sacrificial layer, with respect to n-type silicon, which is exploited as structural material (selective p-to-n electropolishing). Experimental results on chips fabricated by using the BCD6 process of STMicroelectronics demonstrate the feasibility of using this approach for the fabrication of freestanding n-type silicon cantilevers by selective etching of the p-type substrates.

  • An Analog Frontend Chip for a MEMS-Based Parallel Scanning-Probe Data-Storage System

    We present a 32-channel analog frontend chip for a parallel scanning-probe data-storage system ("millipede"-project). The chip include all circuitry required to control the thermomechanical write-process that forms nanoscale indentations in a polymer surface. The on-chip read-channel circuitry is able to reliably detect the tiny signal-current obtained with the thermoelectrical read-process in the presence of a 1000 times larger bias current

  • "Millipede": a MEMS-based scanning-probe data-storage system

    Ultrahigh storage densities of up to 1 Tbit/in./sup 2/ or more can be achieved by local-probe techniques to write, read back, and erase data in very thin polymer films. The thermomechanical scanning-probe-based data-storage concept called Millipede combines ultrahigh density, small form factor, and high data rate. After illustrating the principles of operation of the Millipede, we introduce system aspects related to the read-back process, multiplexing, and position-error-signal generation for tracking.

  • Control of MEMS-Based Scanning-Probe Data-Storage Devices

    Micro-electro-mechanical-system (MEMS)-based scanning-probe data-storage devices are emerging as potential ultra-high-density, low-access-time, and low-power alternative to conventional data storage. Nanoscale accuracy and short latency in the navigation of the probes are the primary control challenges in probe-storage applications. This paper focuses on the control design to address these challenges in a probe-based storage prototype using a micro-scanner as the nanopositioner for the storage medium. Experimental results demonstrate remarkably short seek times on the order of 1 ms for the worst-case seek operations. Moreover, a thermal-sensor-based approach is compared with a two-sensor-control configuration employing both the global- position information from the thermal sensors and the medium-derived position information. Drift and low-frequency noise can affect the performance of the thermal-sensor-based control scheme over long periods of operation. This is addressed by the second scheme, a novel control architecture based on the Hinfin control framework that uses the best measurement in each of the frequency regions.

  • The millipede, a very dense, highly parallel scanning-probe data-storage system

    Ultrahigh storage densities of up to 1 Tbit/in<sup>2</sup>. can be achieved by local-probe techniques to write, read back, and erase data in very thin polymer films. The thermo-mechanical scanning-probe-based data-storage concept called Millipede combines ultrahigh density, terabit capacity, small form factor, and high data rate. After illustrating the principles of operation of the Millipede, we introduce a channel model for the analysis of the read back process, and compare analytical results with experimental data.

  • Jitter Investigation and Performance Evaluation of a Small-Scale Probe Storage Device Prototype

    MEMS-based scanning-probe data storage devices are emerging as potential ultra-high-density, low-access-time, and low-power alternatives to conventional data storage. Thermomechanical probe-based storage on thin polymer films is arguably the most advanced scanning-probe data storage scheme. The performance evaluation of a small-scale storage device prototype based on this concept is presented. The emphasis is on understanding the timing jitter in the read-back signals. Experiments are performed that confirm that the primary source of timing-jitter is the nanometer-scale perturbations of the micro-scanner while positioning the recording medium relative to the read/write transducers. Analytical estimates of these micro-scanner perturbations are obtained. An extensive performance evaluation, using the experimentally identified channel and medium-noise spectral characteristics, is conducted to study the impact of the microscanner perturbations on the performance of the storage device.

  • Millipede - a MEMS-based scanning-probe data-storage system

    Ultrahigh storage densities of up to 1 Tb/in./sup 2/ or more can be achieved by using local-probe techniques to write, read back, and erase data in very thin polymer films. The thermomechanical scanning-probe-based data-storage concept called Millipede combines ultrahigh density, small form factor, and high data rate. After illustrating the principles of operation of the Millipede, a channel model for the analysis of the readback process is introduced, and analytical results are compared with experimental data. Furthermore, the arrangement of data-storage fields as well as dedicated fields for servo and timing control is discussed, and system aspects related to the readback process, multiplexing, synchronization, and position-error- signal generation for tracking are introduced. Finally, the application of (d,k) modulation coding as a means to further increase areal density is presented, and the effect on the user data rates discussed.



Standards related to Scanning probe data storage

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IEEE Recommended Practice for Determining the Peak Spatial-Average Specific Absorption Rate (SAR) in the Human Head from Wireless Communications Devices: Measurement Techniques

To specify protocols for the measurement of the peak spatial-average specific absorption rate (SAR) in a simplified model of the head of users of hand-held radio transceivers used for personal wireless communications services and intended to be operated while held next to the ear. It applies to contemporary and future devices with the same or similar operational characteristics as contemporary ...


IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...



Jobs related to Scanning probe data storage

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