Conferences related to Sandwich structures

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


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Periodicals related to Sandwich structures

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Sandwich structures

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Xplore Articles related to Sandwich structures

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Novel 1-D sandwich photonic bandgap structure

Tsinghua Science and Technology, 2004

A sandwich photonic bandgap (PBG) structure is a novel PBG structure whose periodic lattice is buried in the middle of a substrate. Neither drilling nor suspending the substrate is required, and the integrity of the ground plane is maintained. This paper presents several modification techniques for sandwich PBG structure fabrication. The forbidden gap can be improved by adopting the chirping ...


Vacuum MEMS sensor based on thermopiles - simple model and experimental results

2008 26th International Conference on Microelectronics, 2008

This paper presents a simple model of MEMS thermopile based vacuum detector and experimental results obtained for sensors designed and fabricated at IHTM- IMTM. Sensors contain two thermopiles, each with 30 multilayer p<sup>+</sup>Si/Al thermocouples and p<sup>+</sup>Si or Al heater. Thermal isolating membrane has sandwich structure consisting of sputtered SiO<sub>2</sub> and residual n-Si layer. Dependence of output thermopile voltage on pressure ...


Electromagnetic tunneling for using in wireless power transfer

2016 Progress in Electromagnetic Research Symposium (PIERS), 2016

Combining the metamaterials (MMs), which possess the ability to manipulate the electromagnetic (EM) field, with the wireless power transfer (WPT) system is a new trend. In this paper, a new WPT system is proposed, which is based on the MMs electromagnetic tunneling phenomenon. This system consists of two back-to- back sandwiches structure. The sandwiches structure is classic EM tunneling model ...


Ultrasonic propagation and damage sensing in a bonded PMC/SiC-Foam

2014 IEEE International Ultrasonics Symposium, 2014

The nondestructive evaluation of hybrid material systems is a challenging problem, where very different materials are often combined to enhance performance. In the present application, the bondline integrity of a sandwich structure is of interest, where two polymer matrix composite (PMC) facesheets are bonded to an insulating silicon carbide (SiC) foam interior. The propagation of ultrasound within the PMC-SiC Foam ...


Electrical properties of sandwich structures with aluminum nitride layers

1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351), 1998

Electrical properties of adherent, low stressed aluminum nitride films prepared by magnetron sputtering have been studied. Arrhenius plots in the 100/spl deg/-170/spl deg/C range of temperature and transient current curves with different bias steps (at room temperature and 150/spl deg/C) have been performed. The conduction activation energy has been found and its dependence on subsequent annealings has been studied. A ...


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Educational Resources on Sandwich structures

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IEEE-USA E-Books

  • Novel 1-D sandwich photonic bandgap structure

    A sandwich photonic bandgap (PBG) structure is a novel PBG structure whose periodic lattice is buried in the middle of a substrate. Neither drilling nor suspending the substrate is required, and the integrity of the ground plane is maintained. This paper presents several modification techniques for sandwich PBG structure fabrication. The forbidden gap can be improved by adopting the chirping technique, applying the tapering technique, enlarging the periodic elements, adjusting the location of the periodic lattice in the substrate, and using different dielectric media H-shape elements. A finite difference time domain method is applied to analyze the structures. Deep and wide stopbands can be obtained using the modified sandwich structures. Experimental measurement results agree well with the theoretical analysis.

  • Vacuum MEMS sensor based on thermopiles - simple model and experimental results

    This paper presents a simple model of MEMS thermopile based vacuum detector and experimental results obtained for sensors designed and fabricated at IHTM- IMTM. Sensors contain two thermopiles, each with 30 multilayer p<sup>+</sup>Si/Al thermocouples and p<sup>+</sup>Si or Al heater. Thermal isolating membrane has sandwich structure consisting of sputtered SiO<sub>2</sub> and residual n-Si layer. Dependence of output thermopile voltage on pressure was measured for sensors with different membrane thickness. Tests were performed in pressure range (10<sup>-3</sup>-10<sup>5</sup>) Pa. Experimental results were compared with theoretical predictions.

  • Electromagnetic tunneling for using in wireless power transfer

    Combining the metamaterials (MMs), which possess the ability to manipulate the electromagnetic (EM) field, with the wireless power transfer (WPT) system is a new trend. In this paper, a new WPT system is proposed, which is based on the MMs electromagnetic tunneling phenomenon. This system consists of two back-to- back sandwiches structure. The sandwiches structure is classic EM tunneling model which is composed of epsilon-negative (ENG) layer, air layer and mu- negative (MNG) layer. The ENG layer is imitated by a hollow metallic waveguide which operating below cutoff frequency. The MNG layer is implemented by a square split resonate ring (SSRR) array. By configuring the parameters, a tunneling phenomenon arises. This system is analyzed by transfer-matrix method and simulated by CST Microwave Studio, which match well. This system may open up a new way of WPT.

  • Ultrasonic propagation and damage sensing in a bonded PMC/SiC-Foam

    The nondestructive evaluation of hybrid material systems is a challenging problem, where very different materials are often combined to enhance performance. In the present application, the bondline integrity of a sandwich structure is of interest, where two polymer matrix composite (PMC) facesheets are bonded to an insulating silicon carbide (SiC) foam interior. The propagation of ultrasound within the PMC-SiC Foam sandwich structure was studied using bonded PZT ultrasound sensing and scanning laser vibrometry, where wave propagation and scattering processes were evaluated for damaged and non-damaged SiC foam cases. The material system included two, 1-millimeter thick PMC facesheets bonded to a 14-millimeter thick SiC foam, where the sample had been subjected to a 4-point bend experiment, which generated a localized 45-degree crack in the SiC foam and a fracture of the PMC-SiC foam interface. The scanning laser vibrometry measurements were taken along the side profile of the layered material system, which permitted the visualization and study of propagating elastic wave energy through the thickness of the PMC- SiC-foam material system.

  • Electrical properties of sandwich structures with aluminum nitride layers

    Electrical properties of adherent, low stressed aluminum nitride films prepared by magnetron sputtering have been studied. Arrhenius plots in the 100/spl deg/-170/spl deg/C range of temperature and transient current curves with different bias steps (at room temperature and 150/spl deg/C) have been performed. The conduction activation energy has been found and its dependence on subsequent annealings has been studied. A phenomenological conduction model at the ITO-AlN interface based on the shape of the transient curves has been elaborated. The conditions of behaviour of AlN as a highly insulating layer (sputtering conditions, thicknesses, annealing temperatures) have been established.

  • Delamination Growth of Foam Core Composite Sandwich Plate under Harmonic Dynamic Load

    In this paper, the delamination growth of sandwich plate with foam core and composite sheets under harmonic dynamic load is investigated by finite element method. The composite sheet is modeled as layered shell element considering first order shear effect, and the foam core is modeled as isotropic solid element; while for the bond line between sheet and core is simulated by using simple cohesive layer models with a bilinear constitutive relationship. Reference to previous experience, the most significant parameter G<sub>C</sub> is applied to tracing delamination growth. By some numerical examples, the behavior of dynamic delamination growth of sandwich plates is investigated.

  • Failure Analysis Approach in Memory Failure of SOI Devices

    Silicon-on-insulator (SOI) is a sandwich structure consisting of a thin insulating layer, such as silicon dioxide or glass sandwiching between a thin layer of silicon (T-Si) and the silicon substrate. The incorporation of the insulating layer between the T-Si and the silicon substrate has greatly changed the front-end process of microelectronic devices and thus the approach of failure analysis would be different compared to that of bulk technology. In this paper, approaches to analyze the single bit failure and pair bit failure in memory failure of SOI wafers would be presented.

  • A four-vacuum-cycle lift-off process for the polycrystalline CdSe thin-film transistor

    A photolithographic process is described for the fabrication of the polycrystalline CdSe thin-film transistor (TFT). This process only uses four vacuum cycles and four lift-off masks, without the need of sputter cleaning to prevent contamination. The devices made have a stability similar to the ones made by the single-vacuum process.

  • Multi-band polarization-versatile array antenna for smart antenna applications in cellular systems

    A new array antenna concept for application as smart antenna in cellular systems has been developed. It was implemented as a compact, 4/spl times/4 dual polarized, multi-band array together with a calibration network which satisfies the tight tolerances of the system requirements. A three-dimensional radiator structure made of metalized plastic covers more than 20% bandwidth (VSWR<1.5) and allows various polarizations, e.g., dual-slant polarization. A large microstrip board for signal distribution forms a sandwich structure together with a carbon-fiber reinforced back-plate and a foam-filled epoxy radome. These measures keep the weight of the array exceptionally low while ensuring high mechanical stability.

  • Dual-energy wave subtraction imaging for damage detection in ultrasonic propagation imaging system

    In various research fields, barely visible impact damages (BVID) caused by low velocity impacts have been studied as critical design factors of composite sandwich structures. Thus, dual-energy wave subtraction (DWS) algorithm using ultrasonic propagation imaging (UPI) system is proposed to evaluate BVID on sandwich panel. The UPI system, one of the laser ultrasonic techniques that generates ultrasound on structures with several tens kilohertz of scan speed and visualizes ultrasonic propagation. Amplitude of ultrasonic signals generated by the UPI system increases with increasing energy of excitation laser beam. Difference of amplitude level is able to be calibrated by multiplying a factor to the signal obtained with low laser excitation energy and the signals subtracted one from the other become almost noise level. However, the subtracted signals in the damaged area will not be zero because of change in ultrasonic frequency and material condition in laser ultrasonic generation mechanism, which will be shown in anomalous waves around the damage. The suggested algorithm has been developed based on this phenomenon. The DWS algorithm eliminates most of incident ultrasonic wave and relatively amplifies anomalous waves. In this paper, the sandwich panel with Nomex honeycomb core including ply delamination fabricated by mass drop has been inspected to validate the proposed algorithm, and the results of statistical analysis and damage visualization are presented.



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