Q factor

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In physics and engineering the quality factor or Q factor is a dimensionless parameter that describes how under-damped an oscillator or resonator is, or equivalently, characterizes a resonator's bandwidth relative to its center frequency. (Wikipedia.org)






Conferences related to Q factor

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ICC 2021 - IEEE International Conference on Communications

IEEE ICC is one of the two flagship IEEE conferences in the field of communications; Montreal is to host this conference in 2021. Each annual IEEE ICC conference typically attracts approximately 1,500-2,000 attendees, and will present over 1,000 research works over its duration. As well as being an opportunity to share pioneering research ideas and developments, the conference is also an excellent networking and publicity event, giving the opportunity for businesses and clients to link together, and presenting the scope for companies to publicize themselves and their products among the leaders of communications industries from all over the world.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


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Periodicals related to Q factor

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


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Most published Xplore authors for Q factor

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Xplore Articles related to Q factor

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Optimization of varactor cartridge transformation

1964 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1964

None


Practical Approximations and Tips

Wavelength Division Multiplexing: A Practical Engineering Guide, None

This chapter talks about practical approximations and tips for the conversion between bit error rate (BER) and equivalent Q‐factor. The Q‐factor is a more convenient parameter than the BER, as the latter varies by orders of magnitude. For testing purposes, a pseudorandom bit sequence (PRBS) instead of “real” data is often transmitted over a link. The chapter explains chromatic dispersion ...


High-Q, BT-Cut, Quartz Resonator Units

18th Annual Symposium on Frequency Control, 1964

None


Effects of load impedance on the dimensions and beamwidth of a dual feed nearly square patch antenna for circular polarisations

IEEE Antennas and Propagation Society International Symposium 1992 Digest, 1992

The authors present a model for the dual-feed nearly square patch antenna which accounts for the loading effects of the output port upon the antenna. Theory indicates that the required antenna dimensions depend on the load impedance seen by the antenna. It is also seen that the axial ratio bandwidth of the antenna can be varied by correct choice of ...


Suppression of resonant modes in microwave packages

IEEE MTT-S International Microwave Symposium Digest, 1989

Undesirable resonant cavity modes of a metal package are shown to be damped effectively by placing a dielectric substrate coated with a resistive film in the cavity. Theoretical predictions are confirmed experimentally. The application of this technique to a hybrid phase shifter in which coupling to a resonant mode of the package degrades circuit performance is discussed. The undesirable interaction ...


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Educational Resources on Q factor

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IEEE-USA E-Books

  • Optimization of varactor cartridge transformation

    None

  • Practical Approximations and Tips

    This chapter talks about practical approximations and tips for the conversion between bit error rate (BER) and equivalent Q‐factor. The Q‐factor is a more convenient parameter than the BER, as the latter varies by orders of magnitude. For testing purposes, a pseudorandom bit sequence (PRBS) instead of “real” data is often transmitted over a link. The chapter explains chromatic dispersion values and propagation constants that developed in a Taylor series.

  • High-Q, BT-Cut, Quartz Resonator Units

    None

  • Effects of load impedance on the dimensions and beamwidth of a dual feed nearly square patch antenna for circular polarisations

    The authors present a model for the dual-feed nearly square patch antenna which accounts for the loading effects of the output port upon the antenna. Theory indicates that the required antenna dimensions depend on the load impedance seen by the antenna. It is also seen that the axial ratio bandwidth of the antenna can be varied by correct choice of load impedance. Typical results of antennas designed to operate at 2.450 GHz indicate a broadening of the 3 dB axial ratio bandwidth from approximately 19 MHz with a load impedance of R/sub L/=1.0 M Omega to a value in excess of 130 MHz for R/sub L/=50 Omega .<<ETX>>

  • Suppression of resonant modes in microwave packages

    Undesirable resonant cavity modes of a metal package are shown to be damped effectively by placing a dielectric substrate coated with a resistive film in the cavity. Theoretical predictions are confirmed experimentally. The application of this technique to a hybrid phase shifter in which coupling to a resonant mode of the package degrades circuit performance is discussed. The undesirable interaction of the phase-shifting circuit and a resonant package mode is shown to be suppressed effectively by the introduction of the lossy film.<<ETX>>

  • Sc<inf>x</inf>Al<inf>1−x</inf>N film evaluation using contour mode resonators

    Recent literature has focused on improving piezoelectric coupling coefficients by alloying aluminum nitride (AlN) with scandium (Sc). Akiyama et al. showed the highest piezoelectric coefficient increase of nearly four times for a 41% Sc substitution for Al. Thus far, studies mainly focus on material measurements such as x-ray diffraction or piezoelectric constants to assess the material quality. Although these measurements are useful to assess the improvement in the piezoelectric performance of the material, they do not address changes in the coupling coefficient and quality factor. Resonator structures are needed to directly extract these key performance parameters for film assessment. Fabrication integration, however, must be minimized to avoid obscuring film performance by extrinsic device effects. In this work, we assess a film evaluation tool using contour mode resonators (CMRs) to directly extract resonator performance for film comparison. Resonators formed from AlN, Sc0.06Al0.94N, and Sc0.125Al0.875N films are compared to demonstrate the method.

  • Multi-objective mixed-integer design optimization of planar inductors using surrogate modeling techniques

    In this paper, we discuss multi-objective design optimization of planar inductors using surrogate modeling techniques. The goal is to identify the best possible trade-offs between the quality factor of the inductor and its size while maintaining a required value of the inductance at a given operating frequency. The design problem is formulated as a mixed-integer task involving geometry parameters as well as the number of inductor windings. The initial Pareto front is found by optimizing a data-driven surrogate of the structure at hand, further refined by means of response correction techniques. Our considerations are illustrated using a 3.5-nH spiral inductor implemented in 65-nm CMOS technology.

  • Active Quasi-Optical Cavity Resonators Similar to Sinai and Bunimovich Billiards as Self-Excited Millimeter Wave System

    The goal of the paper is to study experimentally the auto-oscillating systems based on quasi-optical 3D cavity resonators similar to instable Bunimovich and Sinai billiards and to detect the microwave generation in such systems activated by a Gunn diode. The concept of using this unstable resonator as a part of an active oscillating system is based on the following. The high quality factor resonator serves as an oscillating system in microwave oscillators. An increase of the quality factor of an oscillatory circuit leads to the reduction of excitation threshold of the oscillator and the increase of its frequency stability.

  • New structure for high Q-factor printed antenna in wireless power transmission

    In this paper, a new and novel printed structure is proposed to obtain high quality factor (Q-factor) coil antenna in wireless power transmission system. The main idea to achieve high quality factor is “adjusted line pitch and width” with respect to outer diameters. The line pitch and width of the printed pattern are gradually increased in proportion with outer diameter. By using this design method, the Q-factor is increased about 21.8% in comparison with conventionally designed antenna.

  • Design of a Microstrip Low-Pass-Bandpass Diplexer Using Direct-Feed Coupled-Resonator Filter

    Previous systematic low-pass-bandpass diplexer was using coupled-feed line to design its bandpass channel response. However, a coupled-feed line coupled- resonator bandpass filter typically leads to the realization problem in the external quality factor because of the line space limitation between the coupled-feed line and the resonator. Based on our investigation, systematic low-pass-bandpass diplexer design using direct-feed coupled-resonator bandpass filter to relax this problem has never been published in the literature. Therefore, a low-pass-bandpass diplexer using direct-feed coupled-resonator bandpass filter is presented and a systematic matching design is also included in this letter.



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