Occupational stress

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Occupational Stress is stress involving work. (Wikipedia.org)






Conferences related to Occupational stress

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

All topics related to engineering and technology management, including applicable analytical methods and economical/social/human issues to be considered in making engineering decisions.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Occupational stress

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


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Most published Xplore authors for Occupational stress

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Xplore Articles related to Occupational stress

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Journal of management studies

IEEE Transactions on Engineering Management, 1984

None


A study of occupational stress of aviation ground crews

2010 IEEE International Conference on Industrial Engineering and Engineering Management, 2010

The aim of this study was to explore the relationship between various sources of occupational stress and work performance in aviation ground crews. It was also to explore the connection among occupational stress, coping strategies and work performance by using the Structural Equation Modeling (SEM). The result of analysis exhibited that occupational stress had a negative impact on work performance ...


Open source ECG analysis

Computers in Cardiology, 2002

Each year companies and researchers expend significant resources developing basic beat detection and classification software. In an effort to reduce this duplication of effort we are developing and making available open source ECG analysis software. Our open source QRS detectors have sensitivities and positive predictivities that are close to 99.8% on the MIT/BIH and AHA arrhythmia databases. Our beat classifier ...


Influence of STI-Induced Mechnical Stress In Kink Effect of 65nm PD SOI CMOS Devices

2007 IEEE Conference on Electron Devices and Solid-State Circuits, 2007

The mechanical stress induced by shallow trench isolation (STI) may affect the performance of CMOS devices. Mechanical stress may change workfunction, effective mass, carrrier mobility, and junction leakage. This paper reports the influence of STI-induced mechanical stress in the kink effect of a 65 nm PD SOI NMOS device.


Measurement of Biomedical Signals from Helmet Based System

2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2007

In the military, there are many dangerous, difficult working conditions. Sometimes soldiers have to cope with the enemy and cannot sleep all the day because of overnight training or operation. So the health state of serviceperson has been the main concern of the commander. Despite the importance, to monitor the health condition of the serviceperson without influence of daily schedule ...


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Educational Resources on Occupational stress

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IEEE-USA E-Books

  • Journal of management studies

    None

  • A study of occupational stress of aviation ground crews

    The aim of this study was to explore the relationship between various sources of occupational stress and work performance in aviation ground crews. It was also to explore the connection among occupational stress, coping strategies and work performance by using the Structural Equation Modeling (SEM). The result of analysis exhibited that occupational stress had a negative impact on work performance and the coping strategies were the mediator survives between occupational stress and work performance.

  • Open source ECG analysis

    Each year companies and researchers expend significant resources developing basic beat detection and classification software. In an effort to reduce this duplication of effort we are developing and making available open source ECG analysis software. Our open source QRS detectors have sensitivities and positive predictivities that are close to 99.8% on the MIT/BIH and AHA arrhythmia databases. Our beat classifier has a sensitivity of 93.91% and a positive predictivity of 96.48% on the MIT/BIH arrhythmia database and a sensitivity of 93.2% and a positive predictivity of 97.83% on the AHA arrhythmia database. Since we have posted our source code, over 350 users have downloaded our ECG analysis software. Downloads have been nearly equally divided between students, researchers, and commercial developers.

  • Influence of STI-Induced Mechnical Stress In Kink Effect of 65nm PD SOI CMOS Devices

    The mechanical stress induced by shallow trench isolation (STI) may affect the performance of CMOS devices. Mechanical stress may change workfunction, effective mass, carrrier mobility, and junction leakage. This paper reports the influence of STI-induced mechanical stress in the kink effect of a 65 nm PD SOI NMOS device.

  • Measurement of Biomedical Signals from Helmet Based System

    In the military, there are many dangerous, difficult working conditions. Sometimes soldiers have to cope with the enemy and cannot sleep all the day because of overnight training or operation. So the health state of serviceperson has been the main concern of the commander. Despite the importance, to monitor the health condition of the serviceperson without influence of daily schedule or combat situation is very difficult, because there are so many artifact sources in the field. And the devices which monitor the subjects need the additional work and subjects need to be very careful doing something with devices. We intend to develop the system that can monitor the soldier's biomedical signal unconstrainedly. In this paper we introduce the prototype of our helmet based system. This system measured the ECG, EOG and eye blink successfully.

  • A novel surface-oxidized barrier-SiN cell technology to improve endurance and read-disturb characteristics for gigabit NAND flash memories

    This paper describes a novel surface-oxidized barrier-SiN cell technology to effect a tenfold improvement in endurance and read disturb characteristics. In conventional memory cells, degradation of tunnel oxides due to barrier-SiN films for Self-Aligned Contact (SAC) limits the scaling of memory cells. The proposed technology overcomes this problem by an additional oxidation process subsequent to barrier-SiN deposition to reduce hydrogen in both SiN film and tunnel oxide. 0.18 /spl mu/m-rule NAND cells fabricated by the proposed technology demonstrate a tenfold improvement in allowable program/erase cycles and read disturb lifetime without any deterioration of other cell properties.

  • Impact of recent blackout: Return of experience of experience on utility operational IT infrastructures

    The utility operational environment has been facing over the last 10 years significant changes mainly derived from the unbundling of the overall energy supply chain as well as from fundamental changes observed in the mix of the energy resources portfolio towards lower size renewable energies. These challenges have been changing the former flow patterns observed within transmission and distribution networks towards larger amount of cross-border flows from less observable areas as well as massive counter-flows from distribution to transmission related to the larger penetration of distribution energy resources. Meanwhile the growing regulatory pressure tends to focus network operator attention to grow the return of their assets their existing asset though aging. These growing operational constraints have grown the amount of dispatcher stress while various blackouts have happened in Europe and US. Several working groups analysing the context of these major incidents have been launched, AREVA T&D technical experts having participated to several of them. This paper proposes to list the various consequence of this analysis onto energy management system technologies.

  • Infoglut

    Information overload isn't just about having too much e-mail, voice mail, and text messages. It's a much more complex problem, and its effects take a toll on companies' bottom lines and on their employees' well-being. The time that information workers invest in coping with this overload is significant; at Intel, where I was until recently a principal engineer, we assessed the loss due to unnecessary e-mails and unproductive interruptions at 8 hours a week. In a 1996 Reuters survey of 1300 managers worldwide, two out of three respondents associated information overload with loss of job satisfaction and tension with colleagues, and 42 percent attributed ill health to this stress. Today, more than 10 years later, the numbers would likely be even higher.

  • VMSDT: a device independent mobile service development tool

    Mobile commerce has attracted increasingly attention recently and Web based service plays more and more important role in the future. However, many problems need to be solved when building this kind of service. In that, device diversity is the most troublesome one. In this article, we introduce a project called VMSDT, which provides a device independent usual development environment to construct Web-based mobile service. It provides solutions for the diversity of device language. It stresses on the extensibility not only in visual design and result file conversion. In this article, we first analyze design issues resulted from the diversity of device language and introduce related works. Then, we present the system architecture of this tool and discuss the implementation strategies and algorithms of the two core components IEE and converter in detail. In the end, we draw a conclusion and specify the future work.

  • Impact of solder pad size on solder joint reliability in flip chip PBGA packages

    A variety of parameters impact package reliability. One set of parameters that does not get much attention is the variations in package design that are assembly and vendor related. This study shows that solder pad size is important in solder joint reliability. Differences in solder pad size due to different vendors and processes can affect the reliability considerably. The impact of substrate thickness on package reliability has been shown in finite element stress analysis, moire interferometry experiments, and reliability tests. However, in certain cases, the pad size effect can be so significant that it overrides the impact of substrate thickness. This work indicates that in order to obtain good correlation between predictive engineering results and reliability tests data, this factor should not be ignored. In this study, finite element simulation has been used to quantify the pad size effect on the BGA reliability in the PBGA package. Air-to-air thermal cycling test results were compared with FEM predictions. Optimized pad sizes are discussed and the impact on the solder joint reliability is predicted. Solder pad size effect was found to be a dominant feature in correlating test data with predictions.



Standards related to Occupational stress

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Jobs related to Occupational stress

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