Conferences related to Nanotube devices

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


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Periodicals related to Nanotube devices

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


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Most published Xplore authors for Nanotube devices

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Xplore Articles related to Nanotube devices

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Oxide-Induced Noise in Carbon Nanotube Devices

2007 65th Annual Device Research Conference, 2007

In this report, we employ suspended nanotubes to directly study the impact of the oxide on the electrical properties and noise characteristics of carbon nanotube devices, showing that the 1/f noise can be reduced significantly in a substrate-free environment.


Fabricaction of short-channel Individual Single-walled carbon Nanotubes Devices for Spin Transport Measurements

2006 Sixth IEEE Conference on Nanotechnology, 2006

We describe the fabrication of short channel (10nm-15nm) ferromagnetically contacted individual single-walled nanotube devices for spin electronic applications. We observe a hysteretic magnetoresistance indicative of spin transport in several nanotube devices with a maximum resistance change of +15 to -10%. The sign and magnitude of the magnetoresistance can be controlled through the bias on a capacitively coupled gate. Our experiments ...


A nanotube-on-insulator (NOI) approach toward scalable and integratable nanotube devices on sapphire

2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings, 2006

We present a novel nanotube-on-insulator (NOI) approach to produce high-yield nanotube devices based on aligned single-walled carbon nanotubes. First, we managed to grow aligned nanotube arrays with controlled density on crystalline, insulating sapphire substrates, which bear analogy to industry- adopted silicon-on-insulator substrates. Based on the nanotube arrays, we demonstrated registration-free fabrication of top-gated field-effect transistors with minimized parasitic capacitance. Our ...


Modeling and analysis of intrinsic gate capacitance for carbon nanotube array based devices considering variation in screening effect and diameter

2007 International Semiconductor Device Research Symposium, 2007

An accurate analytical model for intrinsic gate capacitance of carbon nanotube array based back-gated FET is proposed. The model accounts for electrostatic capacitive coupling between nanotubes as well as screening effect for any given number of nanotubes, their diameter, and pitch. Analysis using this model shows that as the number of nanotubes increases, although the overall electrostatic capacitance per nanotube ...


Novel process for fabricating nanodevices consisting of carbon nanotubes

Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International Microprocesses and Nanotechnology Conference, 1999

Carbon nanotubes are well known to have high aspect ratios, such as nanometer order diameter and micrometer order length, and small tip radii with a sharp cone. In this work we have developed microprocesses of nanotubes for fabricating the nanotube probes and other nanotube devices. The processes involve the preparation of a nanotube cartridge and the transportation, welding and fixation ...


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Educational Resources on Nanotube devices

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IEEE-USA E-Books

  • Oxide-Induced Noise in Carbon Nanotube Devices

    In this report, we employ suspended nanotubes to directly study the impact of the oxide on the electrical properties and noise characteristics of carbon nanotube devices, showing that the 1/f noise can be reduced significantly in a substrate-free environment.

  • Fabricaction of short-channel Individual Single-walled carbon Nanotubes Devices for Spin Transport Measurements

    We describe the fabrication of short channel (10nm-15nm) ferromagnetically contacted individual single-walled nanotube devices for spin electronic applications. We observe a hysteretic magnetoresistance indicative of spin transport in several nanotube devices with a maximum resistance change of +15 to -10%. The sign and magnitude of the magnetoresistance can be controlled through the bias on a capacitively coupled gate. Our experiments suggest that the short channel contacting technique provides improved yield over devices having longer contact separations.

  • A nanotube-on-insulator (NOI) approach toward scalable and integratable nanotube devices on sapphire

    We present a novel nanotube-on-insulator (NOI) approach to produce high-yield nanotube devices based on aligned single-walled carbon nanotubes. First, we managed to grow aligned nanotube arrays with controlled density on crystalline, insulating sapphire substrates, which bear analogy to industry- adopted silicon-on-insulator substrates. Based on the nanotube arrays, we demonstrated registration-free fabrication of top-gated field-effect transistors with minimized parasitic capacitance. Our approach has great potential for high-density, large-scale integrated systems based on carbon nanotubes for microelectronics

  • Modeling and analysis of intrinsic gate capacitance for carbon nanotube array based devices considering variation in screening effect and diameter

    An accurate analytical model for intrinsic gate capacitance of carbon nanotube array based back-gated FET is proposed. The model accounts for electrostatic capacitive coupling between nanotubes as well as screening effect for any given number of nanotubes, their diameter, and pitch. Analysis using this model shows that as the number of nanotubes increases, although the overall electrostatic capacitance per nanotube decreases by up to 50%, the electrostatic capacitance becomes the dominant factor over the quantum capacitance. Furthermore, applicability of the proposed model in presence of practical fabrication process variations such as variation in diameter of carbon nanotubes is demonstrated using a probabilistic approach.

  • Novel process for fabricating nanodevices consisting of carbon nanotubes

    Carbon nanotubes are well known to have high aspect ratios, such as nanometer order diameter and micrometer order length, and small tip radii with a sharp cone. In this work we have developed microprocesses of nanotubes for fabricating the nanotube probes and other nanotube devices. The processes involve the preparation of a nanotube cartridge and the transportation, welding and fixation by carbon deposition for nanotubes.

  • Impact of Process Variation on Nanowire and Nanotube Device Performance

    We present an in-depth analysis of the nanowire and nanotube device performance under process variability. While every process parameter variation drastically affects the conventional MOSFET performance, we found that nanowire/nanotube FETs are significantly (> 4X) less sensitive to many process parameter variations.

  • All-semiconducting nanotube devices for RF and microwave applications

    Purified, all-semiconducting nanotubes offer great promise for a variety of applications in RF and microwave electronics. In this work, we present device performance of thin-film transistors fabricated using a spin-coating method that is economical and lends itself to mass manufacturing of nanotube electronics.

  • Spin injection in carbon nanotubes

    None

  • Impact of the nanotube diameter on the performance of CNFETs

    This study investigates 38 CNFETs and shows that nearly 3 orders of magnitude current variation can be explained in a comprehensive way by the diameter variation among nanotubes alone. This is the first systematic analysis that correlates the device performance with the nanotube properties quantitatively. It also shows that one can neglect the impact of the preparation on the contact quality to a large extend

  • AC and DC characteristics of carbon nanotube field-effect transistors

    Recent results on the DC as well as AC characteristics of carbon nanotube field-effect transistors (CN-FETs) are presented. Experimental data is discussed in the context of an extended Schottky barrier model and the potential of CNFETs for high frequency applications is elucidated.



Standards related to Nanotube devices

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IEEE Standard Test Methods for Measurement of Electrical Properties of Carbon Nanotubes

This project will develop standard methods for the electrical characterization of carbon nanotubes (CNTs). The methods will be independent of processing routes used to fabricate the CNT's.



Jobs related to Nanotube devices

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