Conferences related to Nanometers

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2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


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Periodicals related to Nanometers

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems Magazine, IEEE


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Nanometers

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Xplore Articles related to Nanometers

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Specific geometries of resonant cantilevers for scanning force microscopy

2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum, 2009

In this paper, specific geometries of resonant cantilevers for scanning force microscopy aimed to reduce sliding between tip and sample have been presented. These cantilevers have been designed for the scanning microdeformation microscope. Flexural and torsional vibration modes have been observed and compared to finite element simulations. Static deflections and dynamic sliding have been studied and the results have confirmed ...


Electronic switching in amorphous silicon devices: properties of the conducting filament

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105), 1998

It has been amply demonstrated that non-volatile memory switching in metal- hydrogenated amorphous silicon-metal structures is crucially dependent on the formation of a conducting filament during the very first switching operation. In this paper we review the evidence which shows that the filament is an inclusion in the amorphous silicon made up of metallic particles from the top contact dispersed ...


A miniature vidicon of high sensitivity

1956 International Electron Devices Meeting, 1956

Experimental models of a sensitive miniature Vidicon pickup tube ½" in diameter and 3" long have been built and operated in prototype equipment. With such a small photolayer area, the use of a photoconductor having the sensitivity of conventional Vidicons would require an excessively fast lens or an increase in scene illumination. A new photoconductor has been developed which has ...


Applications of Total Internal Reflection Fluorescence (TIRF) microscopy in cellular bio-imaging

2007 Asia Optical Fiber Communication and Optoelectronics Conference, 2007

Evanescent field based imaging and sensor technologies have been widely used for a long time, but only recently has TIRF been introduced for bio-imaging. This paper will discuss the reasons and give a brief summary of the recent development of TIRF which is also based on evanescent wave excitation, and which is well suited for ultra thin optical sectioning (hundreds ...


Shingled Magnetic Recording on Bit Patterned Media

IEEE Transactions on Magnetics, 2010

Shingled magnetic recording on bit patterned media with areal densities of 2-4 Tbit/in<sup>2</sup> is examined. The use of a shingled recording scheme allows wider write poles and dots with higher anisotropy to be used. The down-track and cross-track write margins can be tailored to suit the tolerances of the drive by varying the bit cell aspect ratio. Readback waveforms are ...


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Educational Resources on Nanometers

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IEEE-USA E-Books

  • Specific geometries of resonant cantilevers for scanning force microscopy

    In this paper, specific geometries of resonant cantilevers for scanning force microscopy aimed to reduce sliding between tip and sample have been presented. These cantilevers have been designed for the scanning microdeformation microscope. Flexural and torsional vibration modes have been observed and compared to finite element simulations. Static deflections and dynamic sliding have been studied and the results have confirmed the efficiency of the cantilevers to keep the tip vertical during contact and to reduce the displacement of the tip on the surface.

  • Electronic switching in amorphous silicon devices: properties of the conducting filament

    It has been amply demonstrated that non-volatile memory switching in metal- hydrogenated amorphous silicon-metal structures is crucially dependent on the formation of a conducting filament during the very first switching operation. In this paper we review the evidence which shows that the filament is an inclusion in the amorphous silicon made up of metallic particles from the top contact dispersed in an insulating matrix and that its critical dimensions are on the scale of nanometres. Particular attention is given to recent work on metal nonmetal transitions and a dielectric anomaly associated with the filament. These and earlier experiments all provide consistent evidence for the mesoscopic dimensions of the active filament region in which switching occurs.

  • A miniature vidicon of high sensitivity

    Experimental models of a sensitive miniature Vidicon pickup tube ½" in diameter and 3" long have been built and operated in prototype equipment. With such a small photolayer area, the use of a photoconductor having the sensitivity of conventional Vidicons would require an excessively fast lens or an increase in scene illumination. A new photoconductor has been developed which has sufficient operating sensitivity to more than offset the reduction in light collecting area. The spectral response of the new tube covers the approximate range from 400 to 800 millimicrons with its maximum in the neighborhood of 600 millimicrons. Resolution and picture lag are adequate for many applications where the small size is particularly attractive. The ½" tube requires only one-fourth the heater power and one-third the deflection power of the 6198 Vidicon.

  • Applications of Total Internal Reflection Fluorescence (TIRF) microscopy in cellular bio-imaging

    Evanescent field based imaging and sensor technologies have been widely used for a long time, but only recently has TIRF been introduced for bio-imaging. This paper will discuss the reasons and give a brief summary of the recent development of TIRF which is also based on evanescent wave excitation, and which is well suited for ultra thin optical sectioning (hundreds of nanometres) at cell-substrate regions with an unusually high signal-to-noise ratio and image quality.

  • Shingled Magnetic Recording on Bit Patterned Media

    Shingled magnetic recording on bit patterned media with areal densities of 2-4 Tbit/in<sup>2</sup> is examined. The use of a shingled recording scheme allows wider write poles and dots with higher anisotropy to be used. The down-track and cross-track write margins can be tailored to suit the tolerances of the drive by varying the bit cell aspect ratio. Readback waveforms are calculated for sensors of various size, including the effect of thermal noise in the sensor, and the combination of a wide sensor and bit aspect ratio (BAR) of 1:1 is found to give the highest SNR.

  • Microfabrication of submicron nozzles in silicon nitride

    A microfabrication process for obtaining nanometer apertures in highly cusped nozzle-like structures fabricated in silicon nitride and having apex angles of up to a few degrees is described. The process is based on a sacrificial etch technology using single-crystal silicon as the mold and silicon nitride as the material for the nozzle. The nitride coating on the apex of the pyramid shaped mold is selectively etched off using a polymer layer as the etch mask, which leaves the tip of the silicon mold protruding from the masked nitride, thus defining the aperture of the nozzles. The silicon mold is then removed in an alkaline etchant which leaves the free standing nozzles.<<ETX>>

  • PN Junctions and solar cells by ion implantation

    Ion implantation provides a new PN junction formation technique that is at once more controllable and more versatile than either alloying or diffusion. It is based on doping by a coherent positive ion beam from a high energy accelerator. For convenient accelerator size, the technique is limited to devices having shallow junctions such as solar cells. The penetration depth of heavy ions in crystalline materials is extremely sharp and is a function of ion energy. Consequently voltage control of the accelerator allows placement of the junction with millimicron accuracy. Doping levels are dependent on beam current and time. Since ion energy and irradiation time are independent, the doping profile obtainable by the technique may be chosen at will. Boron was accelerated in a 2 million electron volt Van de Graaff generator to produce 1 × 1 cm solar cells with various junction depths and doping gradients. The effects of junction depth on cell efficiency were studied as was the effect of a built in drift field. Work was also conducted on the effect of carrier concentration on cell efficiency arid on the effect of annealing on carrier concentration.

  • Spectrum BRDF and its Application in Visible Light Scattering of Spatial Object

    The spectral bi-directional reflectance distribution function (BRDF) of some satellite coating material and solar plane samples in the band from 380 to 780 nanometres is measured with relative measurement in the laboratory. The spectrum BRDF which can characterize the spectrum reflectance property of samples is obtained by weighting the measured spectral BRDF by the spectral irradiance of the incident spectrum. A new method to calculate the visible light scattering of spatial object is introduced with the aid of the spectrum BRDF. As an application example, the visible light scattering of a simple satellite model is calculated.

  • Contribution to segmentation of digital images based on clustering

    In this work are described methods of segmentation of digital images based on clustering. As clustering method was chosen fuzzy c-means clustering method, but these methods of segmentation are not restricted only to fuzzy c-means. In these methods of segmentation can be used any clustering method, which respects some rules. Color perception by humans is also important part of this contribution. As a logical consequence of color perception is L*u*v* color space, which is also defined and described. It is described L*u*v* transformation and application of this transformation in image segmentation. First of all is mathematical definition of partial segmentation required for introduced segmentations' methods

  • Asymmetric split ring resonators for organic sensing

    We have previously reported the use of asymmetric split ring resonators for sensing organic material in the infra red. Arrays of circular split ring resonators can be tuned to particular wavelengths in the mid infra red. By producing asymmetry in the structures, the two sides of the ring produce plasmon resonances that are reflection peaks and a trapped mode corresponding to a reflection minimum. The combination leads to a steep slope between the reflection peaks and can increase the sensitivity to the addition of different molecular species. In addition to the shift induced, geometrical tuning allows matching of the ASSRs to molecular resonances. Thin films of, for example, PMMA shift the resonances by several hundred nanometres. Further enhancements to sensitivity are to be expected from localization of the organic material.



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