Nanolithography

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Nanolithography is the branch of nanotechnology concerned with the study and application of fabricating nanometer-scale structures, meaning patterns with at least one lateral dimension between the size of an individual atom and approximately 100 nm. (Wikipedia.org)






Conferences related to Nanolithography

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


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Periodicals related to Nanolithography

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Nanolithography

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Xplore Articles related to Nanolithography

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Analysis of Flow Rate through Channel in New Design of Active Fountain Pen Nanolithography

2007 Digest of papers Microprocesses and Nanotechnology, 2007

In this paper, new design AFPN (active fountain pen nanolithography) uses open and close control. Reservoir upper tip is designed. We analyze load of flux and atmospheric pressure from opened part of reservoir. When tip is contacted on surface, flux is outpoured by tip's repulsive force. We present analysis that control flux according to force that gives pressure to tip.


The UV-Nanoimprint Lithography with Multi-head Nanoimprinting Unit for Sub-50nm Half-pitch Patterns

2006 SICE-ICASE International Joint Conference, 2006

Nanoimprint lithography is a promising technology to produce sub-50nm half- pitch features on silicon chips. The contact-based nano lithography, such as thermal and/or UV nano-imprint, is well-known as the next generation lithography. Especially, the UV nano-imprint lithography technology has advantages of the simple process, low cost, high replication fidelity, and relatively high throughput. To achieve nano-imprinting process, nano- imprinting lithography ...


Synthesis and directed self-assembly of modified PS-b-PMMA for sub-10 nm nanolithography

2017 China Semiconductor Technology International Conference (CSTIC), 2017

The directed self-assembly (DSA) of block copolymers has attracted a great deal of interest due to its potential applications in sub-10 nm lithography [1-3]. The conventional organic-organic DSA materials such as poly-(styrene- block-methyl methacrylate) (PS-b-PMMA) have been extensively studied [4,5], however, the low etch contrast between two blocks and the difficulty to reduce L0limit its application. In this study, we ...


Applications of mathematical systems science to nanolithography of integrated circuits

Proceedings of the Thirteenth Biennial University/Government/Industry Microelectronics Symposium (Cat. No.99CH36301), 1999

An overview is given describing applications of multivariable control, signal processing, optimization, modeling and computation to the lithography sequence. We discuss areas in the patterning process where mathematical methods can play a significant role including optical proximity correction, phase shifting mask design, alignment, and stage control for nanopositioning. We also include a discussion on systems applications in the general area ...


Sub-50nm featured polymer stamp fabrication for UV nanoimprint lithography

2007 Digest of papers Microprocesses and Nanotechnology, 2007

Using hot embossing lithography, 8-inch sized sub-50 nm featured flexible polymer template was clearly fabricated. UV-NIL process was taken on Si substrate with the polymer stamp and sub-50 nm pattern was successfully fabricated on Si substrate.


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Educational Resources on Nanolithography

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IEEE-USA E-Books

  • Analysis of Flow Rate through Channel in New Design of Active Fountain Pen Nanolithography

    In this paper, new design AFPN (active fountain pen nanolithography) uses open and close control. Reservoir upper tip is designed. We analyze load of flux and atmospheric pressure from opened part of reservoir. When tip is contacted on surface, flux is outpoured by tip's repulsive force. We present analysis that control flux according to force that gives pressure to tip.

  • The UV-Nanoimprint Lithography with Multi-head Nanoimprinting Unit for Sub-50nm Half-pitch Patterns

    Nanoimprint lithography is a promising technology to produce sub-50nm half- pitch features on silicon chips. The contact-based nano lithography, such as thermal and/or UV nano-imprint, is well-known as the next generation lithography. Especially, the UV nano-imprint lithography technology has advantages of the simple process, low cost, high replication fidelity, and relatively high throughput. To achieve nano-imprinting process, nano- imprinting lithography equipment must have required some multi-functional units which are imprinting head, self-alignment wafer stage, overlay and alignment system for multi-layer process, master with sub-50nm half-pitch patterns, and anti-vibration unit, etc

  • Synthesis and directed self-assembly of modified PS-b-PMMA for sub-10 nm nanolithography

    The directed self-assembly (DSA) of block copolymers has attracted a great deal of interest due to its potential applications in sub-10 nm lithography [1-3]. The conventional organic-organic DSA materials such as poly-(styrene- block-methyl methacrylate) (PS-b-PMMA) have been extensively studied [4,5], however, the low etch contrast between two blocks and the difficulty to reduce L0limit its application. In this study, we designed and synthesized the novel DSA materials based on PS-b-PMMA. Through the modifying of acrylics part, segment-segment interaction parameter (χ) can be significantly increased, which leads to rapid self-assembly and high etch contrast.

  • Applications of mathematical systems science to nanolithography of integrated circuits

    An overview is given describing applications of multivariable control, signal processing, optimization, modeling and computation to the lithography sequence. We discuss areas in the patterning process where mathematical methods can play a significant role including optical proximity correction, phase shifting mask design, alignment, and stage control for nanopositioning. We also include a discussion on systems applications in the general area of photoresist processing for lithography with emphasis on the thermal process.

  • Sub-50nm featured polymer stamp fabrication for UV nanoimprint lithography

    Using hot embossing lithography, 8-inch sized sub-50 nm featured flexible polymer template was clearly fabricated. UV-NIL process was taken on Si substrate with the polymer stamp and sub-50 nm pattern was successfully fabricated on Si substrate.

  • Fast resistance switching of TiO<inf>2</inf> and MSQ thin films for non-volatile memory applications (RRAM)

    We present the fabrication method and the electrical performance of nanoscale crosspoint junctions for two different metal/ oxide/ metal configurations. 100 × 100 nm2 small cells were fabricated by e-beam lithography and nanoimprint lithography (NIL), respectively. The electrical results show switching speeds of less than 10 ns for the SET and RESET operations, and resistance changes of several orders of magnitude. Additionally, the resistance state of TiO2 thin films reveal a strong dependence on the switch signal and demonstrates a retention time of up to 105 s at room temperature and 85°C. The tested materials and fabrication steps are in good accordance with current and future CMOS technology and provide a way to achieve low cost, high density non- volatile memory.

  • Coercivity Reduction in Nickel Ferrite (NiFe<formula formulatype="inline"><tex Notation="TeX">$_{2}$</tex></formula>O <formula formulatype="inline"><tex Notation="TeX">$_{4}$</tex></formula>) Thin Films Through Surface Patterning

    NiFe2O4(NFO), a spinel ferrite with high electrical resistivity and favorable magnetic properties, is an interesting material for high-frequency signal and power electronic applications. Here, significant reduction in the coercivity of NFO films is obtained through surface patterning via nanoimprint lithography. Multilayered NFO films are grown on c-plane (0001) sapphire substrates using room temperature chemical solution deposition. Two film variants, layer-by-layer and bulk, are deposited. Prior to crystallization, films are patterned with a polydimethylsiloxane stamp. Good feature transfer to the thin-film surface is confirmed by atomic force microscopy and transmission electron microscopy. Θ-2Θ X-ray diffraction shows that both variants produce single-phase inverse spinel NFO, with better texture in the layer-by-layer samples. Magnetic measurements show substantial reduction in coercivity in the patterned samples due to the surface anisotropy-enhanced demagnetization field. The bulk patterned sample showed the lowest coercivity, ~18 Oe in-plane, albeit with reduced saturation magnetization, whereas the layer-by-layer patterned film maintained the same degree of texture and saturation as unpatterned films, with a ~80% reduction in coercivity. These results show that nanoimprint lithography of chemical solution deposition films is a cost-effective pathway to engineering the coercivity of NFO films while retaining desirable saturation magnetization and texture.

  • Application of nanoimprint lithography in nanoscale GaAs MSM photodetectors

    Summary form only given. Nanoscale metal-semiconductor-metal (MSM) photodetectors and MESFETs are key elements in ultra-fast optical and wireless communication systems. However, devices with sub-0.25 /spl mu/m feature sizes are typically fabricated using electron-beam lithography (EEL), which has high cost and low throughput. Nanoimprint lithography (NIL), on the other hand, has both low cost and high throughput, as well as sub-l0 nm resolution. We report the fabrication of MSM photodetectors on semi-insulating (SI) GaAs using NIL, and the examination of NIL on the quality of the nanoscale Schottky contact. We found that if the imprint pressure is 600 psi or lower, nanoscale GaAs MSM photodetectors fabricated using NIL are comparable to those fabricated by conventional EEL and photolithography, indicating no degradation to the photodetector Schottky contact induced by the imprint process.

  • Superresolution nanolithography technique based on polydimethylsiloxane soft mold

    We report the design, analysis, and simulation of the superresolution nanolithography technique based on PDMS soft mold, which obtained the feature size smaller than 1/10 operating wavelength. The proposed nanolithography system consist of a periodic PDMS soft transparent mold, a thin silver layer, photoresist and substrate. The reason why we employ the PDMS soft mold is it can contact perfectly with silver layer. By adjusting the linewidth and the thickness of the silver layer, the optimal contrast were obtained. To analysis the superresolution nanolithography of proposed system, the electric field distributions and electric field intensity are given.

  • Fabrication of nanoperforated silicon membranes with tunable sized high aspect ratio holes

    We present a fabrication process for free-standing, nanoperforated membranes which are made of single-crystalline silicon. The membranes are fabricated out of silicon-on-insulator wafers. The mask for nanoperforations is patterned on the device layer side of the wafer using nanoimprint lithography. The membrane is released by etching through the handle wafer and the buried oxide layer from the backside of the wafer. The nanoperforations are created by the final cryogenic deep reactive ion etching step through the device layer. The process circumvents problems related to notching effect. As the last process step, narrowing of the pores is done by conformal atomic layer deposition of aluminum oxide. The thickness of the membrane is 3 mum and pore diameters of 200 nm and 420 nm are demonstrated.



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