Conferences related to Multichip modules

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE Industry Applications Society Annual Meeting

The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.


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Periodicals related to Multichip modules

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Multichip modules

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Xplore Articles related to Multichip modules

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Power Electronic Module: Enabling the 21st-century energy economy

IEEE Power Electronics Magazine, 2014

To enable the rapidly emerging and imminent energy economy, high-voltage (HV) and high-current robust power electronic modules (PEMs) are needed at low cost. PEMs typically consist of a number of semiconductor power switches and driver chips; intelligent power modules often contain sensing and protection circuitry. In the entire supply chain of power electronics systems-from materials to end-user applications, including the ...


Status And Trends In Optical Interconnects

LEOS '92 Conference Proceedings, 1992

None


Metal Insulator Structures For Multichip Modules

Electro International, 1991, 1991

The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.


Plenary lectures

2007 Power Conversion Conference - Nagoya, 2007

Provides an abstract for each of the plenary presentations and may include a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.


New intelligent power module for electric vehicles

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting, 1995

A new intelligent power module (IPM) of 450 A, 600 V has been developed. There are three major aspects in IPM development: IGBT (insulated gate bipolar transistor) device technology, packaging technology, and intelligent driver and protection circuits technology. The IGBT device has low power loss and high switching speed. The packaging has a smart housing with special easy-to- use connectors ...


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Educational Resources on Multichip modules

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IEEE-USA E-Books

  • Power Electronic Module: Enabling the 21st-century energy economy

    To enable the rapidly emerging and imminent energy economy, high-voltage (HV) and high-current robust power electronic modules (PEMs) are needed at low cost. PEMs typically consist of a number of semiconductor power switches and driver chips; intelligent power modules often contain sensing and protection circuitry. In the entire supply chain of power electronics systems-from materials to end-user applications, including the original equipment manufacturers (OEMs)-the PEM is the key building block, as it forms the heart of a power electronic system. The performance, cost, and durability of the entire power electronic system critically hinge on those of the PEM. In addition, major business opportunities in power electronics are often enabled by the advances in power semiconductor devices. One such opportunity currently available to the power electronics community has been created by the advances in wide-bandgap (WBG) power switching devices, which were first introduced by Shenai et al. in the 1980s [1].

  • Status And Trends In Optical Interconnects

    None

  • Metal Insulator Structures For Multichip Modules

    The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.

  • Plenary lectures

    Provides an abstract for each of the plenary presentations and may include a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.

  • New intelligent power module for electric vehicles

    A new intelligent power module (IPM) of 450 A, 600 V has been developed. There are three major aspects in IPM development: IGBT (insulated gate bipolar transistor) device technology, packaging technology, and intelligent driver and protection circuits technology. The IGBT device has low power loss and high switching speed. The packaging has a smart housing with special easy-to- use connectors and high density mounting. The developed circuits constitute a three phase inverter bridge, driver and three protection functions (short- circuit, over-temperature, and control supply under-voltage lock) in addition to a serially-coded fault output function. Furthermore, reliability and cost are important factors for electric vehicles. This paper describes the structure and the superior electric characteristics of the new IPM.

  • Novel screening techniques for wind turbine power converters

    Power converters represent one of the highest failure rates in the wind turbine. Therefore converter manufacturers perform burn-in tests to prevent shipping of faulty converters. Recent developments in junction temperature estimation, based on accurate online IGBT collector-emitter voltage measurements, allow for thermal stress estimation of the IGBT modules. This is utilized to detect infant mortalities in power converters, by comparing thermal responses of IGBTs for faulty and non-faulty converters. The method proves to be a time and cost efficient candidate to replace burn-in tests of power converters for wind turbines applications.

  • A new multi-functional compact IPM for low power industrial application

    This paper presents a new intelligent power module (IPM) family dedicated for low power industrial inverter drive applications, especially for low cost and compact size requirements. The new IPM family integrates converter, inverter, brake and driver circuits into a compact, high reliable transfer-molded package with fine cell pitch Carrier Stored Trench-gate Bipolar Transistor (CSTBT™) power chips, optimized internal layout and direct gate wire bond structure. As a result, the new IPM products achieved both high performance and small size. The inverter main driver circuit that utilizes the new IPM can achieve about 50% reduction on PCB size compare with those uses IGBT modules or discrete parts.

  • Integration of electronic power components for electromobility

    The current trend in the global automotive industry toward eco-friendly mobility will continue to grow in the future. At the same time the most important challenge for automotive electronics is to manage increasing electronic power within smaller devices. Power electronic modules have to be placed close to the electric motor or - for hybrid electronic vehicles - close to the combustion engine. Further challenges are to achieve high reliability during operation and to reduce system costs. Under the CATRENE (Cluster for application and technology research in Europe on nanoelectronics) project EmPower (Embedded power components for electric vehicle application), funded by the German government, a new high integrated packaging technology (embedding technology) is under development and being tested which covers power components for electric vehicle applications (e.g. pedelec, electric vehicle).

  • ATCURE: a heterogeneous processor for image recognition

    A processor that applies a heterogeneous architecture to the problem of real- time image recognition has been developed. Several unique features distinguish this work from other work in this field and are the subject of this paper. They include the following: (1) use of a complete set of documented applications of automatic target recognition to derive and validate processor requirements; (2) choice of a heterogeneous architecture that integrates several types of processors; (3) development of image-processing-domain custom integrated circuits; (4) application of wafer-scale multichip module miniaturization to the image processing pipeline; and (5) use of a piecewise- connected hierarchy of simulation tools, providing for connectivity of simulation both vertically (i.e., from chip through boards to subsystem) and horizontally (i.e., board vs. multichip module domain). This processor has been programmed with several recognition algorithms and delivered in a baseline 20-stage-pipeline-configuration, where it achieves over 20 billion reduced instruction set (RISC)-equivalent operations/sec upon 16-bit pixels.

  • Development of compact power control unit for HEVs

    This paper presents a compact power control unit (PCU) for hybrid electric vehicles. The authors use silicon carbide (SiC) MOSFET power modules with insulated ceramic substrates, resulting in high thermal conductivity. In addition, direct connection of aluminum-made chassis of a reactor and a capacitor to the heat sink makes it possible to highly release heat generation of them. These two measures enable a size reduction of the PCU, and a power density of 86 kVA/L was achieved that is the most compact in the similar PCU class.



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