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ICC 2021 - IEEE International Conference on Communications
IEEE ICC is one of the two flagship IEEE conferences in the field of communications; Montreal is to host this conference in 2021. Each annual IEEE ICC conference typically attracts approximately 1,500-2,000 attendees, and will present over 1,000 research works over its duration. As well as being an opportunity to share pioneering research ideas and developments, the conference is also an excellent networking and publicity event, giving the opportunity for businesses and clients to link together, and presenting the scope for companies to publicize themselves and their products among the leaders of communications industries from all over the world.
The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)
IEEE Microwave Magazine, 2009
2007 IEEE Antennas and Propagation Society International Symposium, 2007
Delicate Balance: Technics, Culture and Consequences, 1989
1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966
IEEE Spectrum, 2009
Lunar Industrialization: The First Step to the Solar System
Engineering Our Future - Randii R. Wessen, Ph.D
The Full Spectrum: Travelogue of the Atomic Age
A Conversation with…AJung Moon: IEEE TechEthics
Bridge Robot Moonwalks on Magnets
Synthetic Fuels to the Rescue?
Engineering the Big Bang
Future of Space Exploration from the Leaders at Mars One, Astrobotic, and Teledyne Brown Engineering: Innovation Spotlight with Grant Imahara
A Robot to Mine the Moon
2011 IEEE Awards Matt Ettus HKN Eminent Member Recognition
Developing a Plasma Thruster in Costa Rica
One Giant Leap: The Moon Landing's Impact on Humanity | IEEE TechEthics Virtual Panel
The AcceleGlove: A Cheap and Lightweight Control Glove
The Full Spectrum: COSMIC Satellites Use GPS to Forecast Weather
Visit to the Lightning Lab: Zapping Model Airplanes with Over 2 Million Volts
What a Leap: The Apollo 11 Moon Landing - IEEE History Center presentation
Introducing Ethical and Social Considerations in the Design Process: IEEE TechEthics Panel Discussion
Power Electronics for the Space Exploration Hype: APEC 2019
IEEE 3D Standards-Based Medical Applications and 3D Printing: Young Lae Moon
This article talks about the electromagnetic spectrum.
Based on the multichannel brightness temperature observations of Chinese Chang'E-1 lunar satellite, inversions of the physical temperature profile of the lunar regolith medium and its layer thickness are discussed. The correspondence of the brightness temperature distribution to the lunar topography is demonstrated and discussed, especially around lunar polar regions under poor solar illumination. As examples, in two areas, along the lunar equator and along the line of longitude 150°W, the physical temperature profile of regolith layer and its thickness are inverted using a three-layer model of thermal radiative transfer. The results which are based on some Apollo measurements are compared with an empirical formulation of the physical temperature as a function of latitude.
This article consists of a collection of slides from the author's conference presentation.
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